• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
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• pp.75-77
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• 2004

Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn$_2$ IMCs were formed at the interface solder and pad after 1reflow. An increase of the number of reflows changed AuIn into AuIn$_2$. AuIn$_2$ IMC layer at the interface broke and spalled away into the solder after 3reflows. Shear force decreased with the number of reflows because the weakness of the interface by the spalling of AuIn$_2$ IMC layer.

• 한국공작기계학회논문집
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• 제18권2호
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• pp.234-240
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• 2009

In this study, we found that it is important to have a specific management of standards which are the $12{\pm}3{\mu}m$ of plating thickness and $2{\pm}1%$ of tuning. To verify these standards, we checked the plating thickness and density of tuning through marginal valuation of each and checked size of a plating particle, adhesion of solder and condition of reflow after a section chief.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.333-337
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• 2008

This study investigates crack propagation behavior of Sn-3.0Ag-0.5Cu solder under pull-push loading conditions. Fatigue Crack Growth (FCG) tests were conducted on Center Cracked Plate (CCP) specimens in fast-fast (pp) strain waveform. The fast-slow (pc), slow-fast (cp) and slow-slow (cc) strain waveforms were also used to study the effect of strain rates. The crack propagation rates for the four strain waveforms were correlated with J-integral range and a scatter band of factor 4 was found. The crack growth rates for the pc waveform was highest, followed by cp, cc and then pp waveforms.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.284-284
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• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• 한국주조공학회지
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• 제22권1호
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Journal of Welding and Joining
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• 제32권1호
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1057-1058
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• 2006

The preparation of $Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders was accomplished by the mechanical alloying of a pure Ti, Cu, Ni, Sn and carbon nanotube (CNT) powder mixture after 8 h milling. In the ball-milled composites, the initial CNT particles were dissolved in the Ti-based alloy glassy matrix. The bulk metallic glass composite was successfully prepared by vacuum hot pressing the as-milled CNT/$Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders. A significant hardness increase with the CNT additions was observed for the consolidated composite compacts.

• 한국표면공학회지
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• 제35권1호
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.113.2-113.2
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• 2011

Sn-Ag계 합금은 대표적인 무연 솔더 조성으로 전자제품의 실장 및 접합에 적용되어 왔으며, 태양전지 분야에서도 모듈의 전극과 bus바로 사용되는 등 다양한 분야에서 사용되고 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 신뢰성을 보다 향상시키고자 Ag의 함량을 줄이고 다원계 합금 조성의 무연 솔더 연구가 활발히 진행되고 있다. 본 실험에서는 기존의 연구 결과를 바탕으로 Sn-1.0Ag-0.5Cu-0.4In 4원계 무연솔더 조성에 Bi를 첨가하여 최적의 융점과 용융구간을 가지는 5원계 Sn-Ag-Cu-In-Bi 계 솔더 합금을 설계하였다. 이 설계된 합금은 기존의 유연 솔더인 Sn-Pb와 대표적인 무연 솔더인 Sn-3.5Ag와 각각의 특성을 비교 분석하였다. 젖음성을 평가하기 위하여 wetting balance tester를 이용하여 실험을 행하였고 Differential Scanning Calorimetry(DSC)를 분석하여 젖음 정도와 조성 분석 및 고상점과 액상점 등의 녹음 거동을 확인하였다. 또한 각각의 조성별 전단응력에 따른 파괴 거동을 분석하였다.