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A Study on Working Condition of the Pb Free Plating Process Using the Plating Soluction of Sn/Cu  

Jeon, Taeg-Jong (충남대학교 대학원 기계공학과)
Ko, Jun-Bin (한밭대학교 기계설계공학과)
Lee, Dong-Ju (충남대학교 기계공학과)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.18, no.2, 2009 , pp. 234-240 More about this Journal
Abstract
In this study, we found that it is important to have a specific management of standards which are the $12{\pm}3{\mu}m$ of plating thickness and $2{\pm}1%$ of tuning. To verify these standards, we checked the plating thickness and density of tuning through marginal valuation of each and checked size of a plating particle, adhesion of solder and condition of reflow after a section chief.
Keywords
$PbSO_4$; $PbCl_2$; plating solution;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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