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A Study on the of Intermetallic compound and shear strength of Sn3.5Ag0.7Cu ball with interface position  

신규식 (서울시립대학교 신소재공학과)
박지호 (서울시립대학교 신소재공학과)
정재필 (서울시립대학교 신소재공학과)
Publication Information
Journal of the Korean institute of surface engineering / v.35, no.1, 2002 , pp. 47-52 More about this Journal
Abstract
Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.
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