Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2004.05a
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- Pages.75-77
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- 2004
Microstructure and Mechanical Property of In48wt%Sn Solder / Electrolytic Au/Ni/Cu BGA Substrate with Multiple Reflows
리플로우에 따른 In-48Sn 솔더와 전해 Au/Ni/Cu BGA 기판의 미세구조와 기계적 특성
Abstract
Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn
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