• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.6
• /
• pp.370-375
• /
• 2016

In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

• Journal of the Semiconductor & Display Technology
• /
• v.8 no.4
• /
• pp.31-36
• /
• 2009

In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.

• The Korean Journal of Ceramics
• /
• v.6 no.3
• /
• pp.236-239
• /
• 2000

Both the X-ray diffraction data of the normal direction in the sample orientation and the pole figure data of three reflections, (111), (200) and (220), were used to do the Rietveld refinement for the copper sheet prepared by a cold rolling process. The agreement between calculated and observed patterns was not satisfactory, which was attributed to the preferred orientation effect of the copper sheet. The Rietveld refinement for the copper sheet could be done successfully by applying the pole density of each reflection obtained from the corresponding inverse pole figure to the X-ray diffraction data of the normal direction. The R-weighted pattern, $R_{wp}$ was 12.99% and the goodness-of-fit indicator, S, was 3.68.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.14 no.5
• /
• pp.423-429
• /
• 2001

PbS, CuS and (Pb,Cu)S thin films were chemically deposited on glass from alkaline baths containing lead acetate, copper chloride, thiourea and triethanolamine. The deposition, optical, resistivity and thermal electric properties of these films were studied. PbS thin films showed a hexagonal structure and CuS thin films showed amorphous. The crystalline of (Pb,Cu)S thin films was obtained by heat treatment at 200$\^{C}$ and the deposition ratio of Pb to Cu showed 7:3. The energy gap of PbS, CuS and (Pb,Cu)S thin films were 1.7, 2.1 and 2.4 eV, respectively. Sheet resistance of PbS thin films was less affected on thermal annealing, but hose of (Pb,Cu)S and CuS thin films were more reduced about 3 orders of magnitude. All of those thin films indicated p type semiconductor in temperature ranging 30$\^{C}$ to 150$\^{C}$.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2010.05a
• /
• pp.48.1-48.1
• /
• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• Korean Journal of Metals and Materials
• /
• v.49 no.3
• /
• pp.243-249
• /
• 2011

This study describes the feasibility of producing high-strength Al alloy sheet with a high solute content using a combined technique of twin-roll strip casting and asymmetric rolling. The Al sheet produced in this study exhibited excellent formability ($\overline{r}$ =1.0, $\Delta$r=0.16) and mechanical properties ($\sigma_{TS}$~305 MPa, $\epsilon$~33%), that, cannot be feasibly obtained via the conventional technique based on ingot casting and rolling. The structural origin of the observed properties, especially enhanced formability, was clarified by examining the evolution of textures associated with strip casting and subsequent thermo-mechanical treatments. Our evaluation of the mechanical properties and formability leads us to conclude that the combination of strip casting and asymmetric rolling is a feasible process for enhancing the formability of Al alloy sheets to the level beyond what the conventional techniques can reach.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.75-78
• /
• 1996

The deposition condition Gf TiN films as electrode was studied by sheet resistance, TiN depositon Thickness X-ray diffraction. TiN was made by reactively DC magnetron sputtering with varying $N_2$/Ar mixture gas and substrate temperature. After finding The deposition condition of TiN films, The samples with the structure of Cu/Ta$_2$O$_{5}$, TiN/Ta$_2$O$_{5}$Si, Cu/TiN/Ta$_2$O$_{5}$ Si were prepared and were measured I-V, C-V. As a results, it was found that when TiN was deposited in an $N_2$a results, it was found that when TiN was deposited in an $N_2$atmosphere its Sheet resistance is lower n than n V$_2$Ar mixtureixture

• Journal of the Korean institute of surface engineering
• /
• v.30 no.5
• /
• pp.310-319
• /
• 1997

The purpose of this study is to investigate the effect of the specific alloying elements in steel such as Cr, Ni and Cu, and surface roughness of substrate with two different FCS temperature zones in the CAL process on the phosphatability of the cold-rolled sheet used for the drum in order to improve the zinec phosphating property. Phosphatability is dependent of the surface oxide and roughness on the substrate and can be indirectly improved by increasing surface roughness of the steel sheet. Basically, in order to obtain the good phosphatability, the low concentration of the retained elements such as Cr, Ni and Cu among the steel alloy elements should be required. Phosphatability of substrate with high concentration instead of the retained elements and surface roughness, however, can be effectively improved instead of low FSC temperature.

• Korean Journal of Materials Research
• /
• v.12 no.3
• /
• pp.225-230
• /
• 2002

Sn was selected as an alloying element of Cu. The Cu-Sn thin layers were deposited on the Si substrates by the electroplating method and their properties were studied. By rapidly thermal annealing(RTA) up to 40$0^{\circ}C$ after electroplating, sheet resistance decreased and adhesion strength increased, but that trend was reversed at the 50$0^{\circ}C$ RTA. Cu-Sn particles grew dense and the surface was uniform up to 40$0^{\circ}C$, but at 50$0^{\circ}C$, empty area was introduced and the surface became rough owing to oxidation and particle coarsening and agglomeration. Deposited layer contained significant amount of Si, while pure Cu-Sn layer with the composition ratio of 90:10 was present only on the top surface. However, no significant change in the Cu composition within alloy layers occured by the RTA regardless of its temperature. This indicates that the Cu diffusion into the Si was suppressed by the presence of Sn.

• Structural Engineering and Mechanics
• /
• v.52 no.5
• /
• pp.957-969
• /
• 2014

Among severe plastic deformation methods, groove pressing is one of the prominent techniques for producing ultra-fine grained sheet materials. This process consists of imposing repetitive severe plastic deformation on the plate or sheet metals through alternate pressing. In the current study, a 2 mm pure Cu sheet has been subjected to repetitive shear deformation up to two passes. Hardness and tensile yield and ultimate stress were obtained after groove pressing. Fracture toughness tests have been performed and compared for three conditions of sheet material namely as received (initial annealed state), after one and two passes of groove pressing. Results of experiments indicate that a decrease in the values of fracture toughness attains as the number of constrained groove pressing (CGP) passes increase.