• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.1-6
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• 2014

차세대 전자소자는 입출력(I/O) 핀 수의 증가, 전력소모의 감소, 소형화 등으로 인해 fine-pitch 배선 시스템이 요구되고 있다. Fine-pitch 특히 10 um 이하의 fine-pitch에서는 기존의 무연솔더나 Cu pillar/solder cap 구조를 사용할 수 없기 때문에 Cu-to-Cu bumpless 배선 시스템은 2D/3D 소자 구조에서 매우 필요한 기술이라 하겠다. Bumpless 배선 기술로는 BBUL 기술, 접착제를 이용한 WOW의 본딩 기술, SAB 기술, SAM 기술, 그리고 Cu-to-Cu 열압착 본딩 기술 등이 연구되고 있다. Fine-pitch Cu-to-Cu interconnect 기술은 연결 방법에 상관없이 Cu 층의 불순물을 제거하는 표면 처리 공정, 표면 활성화, 표면 평탄도 및 거칠기가 매우 중요한 요소라 하겠다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 추계학술발표대회 및 제15회 신소재 심포지엄
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• pp.27.2-27.2
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• 2008

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.39-44
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• 2015

이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 $164m{\Omega}$, $141m{\Omega}$ 및 $132m{\Omega}$의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 $200m{\Omega}$, $150m{\Omega}$ 및 $140m{\Omega}$의 평균 접속저항을 나타내었다.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.71-76
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• 2012

SnBi 저온솔더의 플립칩 공정을 이용한 스마트 의류용 칩 접속공정에 대해 연구하였다. 캐리어 필름에 형성한 Cu 리드프레임을 $130^{\circ}C$에서 직물에 열압착 시킴으로써 Cu 리드프레임이 전사된 직물 기판을 형성하였다. 칩 시편에 SnBi 페이스트를 도포하여 솔더범프를 형성한 후 직물 기판의 Cu 리드프레임에 배열하고 $180^{\circ}C$에서 60초 동안 유지시켜 플립칩 본딩하였다. SnBi 저온솔더를 사용하여 형성된 스마트 의류용 플립칩 접속부의 평균 접속저항은 $9m{\Omega}$이었다.

• 한국환경과학회지
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• 제21권5호
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• pp.555-562
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• 2012

The experimental determination of equilibrium constants is required to estimate concentrations of reagents and/or products in environmental chemical reactions. For an example, the choice of copper (Cu) complexation reactions was motivated by their fast kinetics and the ease of measurement of Cu by an ion-sensitive electrode. Each individual titrant of sulfate ($SO{_4}^{2-}$) and oxalate ($C_2O{_4}^{2-}$) was expected to have its own unique characteristics, depending on the bonding in Culigands connected to the aqueous species. The complexation reaction of Cu with $SO{_4}^{2-}$ somewhat fast reached equilibrium status compared with $C_2O{_4}^{2-}$. The experimental equilibrium constants ($K_{eq}$) of copper sulfate ($CuSO_4$) and copper oxalate ($CuC_2O_4$) were determined $10^{2.2}$ and $10^{3{\sim}4.3}$, respectively.

• 센서학회지
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• 제21권1호
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Tribology and Lubricants
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• 제27권1호
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• pp.1-6
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• 2011

The possibility of Cu-Al-Ni intermetallic coating on the mild steel through the combustion synthesis has been investigated. In particular, the effect of the ball milling energy on the microstructure of the coating layer was examined to obtain the best coating condition. Experimental results show that Cu-Al-Ni powder compact was explosively synthesized and successfully coated with the steel matrix. It was revealed that the formation of $Cu_9Al_4$ intermetallic decreased with increase in the ball milling energy. This result supports that the high energy ball milling would be effective for obtaining the most suitable microstructure for Cu-Al-Ni coating layer. However, the excessive ball milling energy seems to decrease the bonding strength between the coating layer and the matrix.

• 대한화학회지
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• 제53권3호
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• pp.257-265
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• 2009

$Cu^{+}$ 및 $Cu^{2+}$와 proline의 결합형태에 따른 구조 및 금속 친화도를 DFT(Density Functional Theory) 방법으로 조사하였다. 금속-proline의 결합과 여러 결합형태에 따른 에너지 순서는 $Cu^{+}$-Proline및 $Cu^{2+}$-proline 착화합물에서 서로 매우 상이함을 알았다. $Cu^{+}$-Proline의 경우, 바닥상태의 구조는 $Cu^{+}$가 중성 proline의 카르보닐 산소 및 이미노기 질소에 배위된 두 자리 배위를 하며, 이에 비해 $Cu^{2+}$-Proline 의 바닥상태의 구조는 zwitter이온 형태 proline의 카르복시기의 두 산소 사이에 chelation을 형성하는 구조임을 확인하였다. 가장 안정한 $Cu^{+}$-Proline 착화합물에서 proline의 금속 이온 친화도는 6-311++G(d,p) 수준에서 76.0 kcal/mol로 계산되었으며, proline의 $Cu^{2+}$ 이온 친화도는 258.5 kcal/mol로 나타났다.

• 한국전기전자재료학회논문지
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• 제30권4호
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

• 한국분말재료학회지
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• 제26권3호
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• pp.220-224
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• 2019

The aluminum (Al)/copper oxide (CuO) complex is known as the most promising material for thermite reactions, releasing a high heat and pressure through ignition or thermal heating. To improve the reaction rate and wettability for handling safety, nanosized primary particles are applied on Al/CuO composite for energetic materials in explosives or propellants. Herein, graphene oxide (GO) is adopted for the Al/CuO composites as the functional supporting materials, preventing a phase-separation between solvent and composites, leading to a significantly enhanced reactivity. The characterizations of Al/CuO decorated on GO(Al/CuO/GO) are performed through scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy mapping analysis. Moreover, the functional bridging between Al/CuO and GO is suggested by identifying the chemical bonding with GO in X-ray photoelectron spectroscopy analysis. The reactivity of Al/CuO/GO composites is evaluated by comparing the maximum pressure and rate of the pressure increase of Al/CuO and Al/CuO/GO. The composites with a specific concentration of GO (10 wt%) demonstrate a well-dispersed mixture in hexane solution without phase separation.