Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 2008.11a
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- Pages.27.2-27.2
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- 2008
3D IC 패키징을 위한 열처리 효과에 따른 Cu-Cu 접합부의 계면 특성 평가
- Jang, Eun-Jeong ;
- Pfeiffer, Sarah (EV Group) ;
- Kim, Bioh (EV Group) ;
- Matthias, Thorsten (EV Group) ;
- Hyeon, Seung-Min ;
- Lee, Hak-Ju ;
- Park, Yeong-Bae
- Published : 2008.11.07