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http://dx.doi.org/10.5369/JSST.2012.21.1.34

Fabrication of Test Socket from BeCu Metal Sheet  

Kim, Bong-Hwan (Department of Electronics Engineering, Catholic University of Daegu)
Publication Information
Journal of Sensor Science and Technology / v.21, no.1, 2012 , pp. 34-38 More about this Journal
Abstract
We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.
Keywords
BeCu; Test Socket; Probe;
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Times Cited By KSCI : 1  (Citation Analysis)
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