1 |
Bong-Hwan Kim, Jong-bok Kim, and Jong-Hyun Kim, "A highly manufacturable large area array MEMS probe card using electroplating and flipchip bonding", IEEE Transactions on Industrial Electronics, vol. 56, no. 4, pp. 1079-1085, April 2009,
DOI
ScienceOn
|
2 |
Chanseob Cho, Sangwon Kim, Daeyoung Kong, Jaewoo Nam, Bonghwan Kim, and Jonghyun Lee, "Design and fabrication of highly manufacturable MEMS test sockets for BGA IC packages", Japanese Journal of Applied Physics, vol. 50, no. 6, 06GM17, June 20, 2011.
|
3 |
J. Santander, M. Lozano, A. Collado, M. Ullan, and E. Cabruja, "Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers", IEEE Transactions on Electron Devices, vol. 47, Issue 7, pp. 1431-1439, 2000.
DOI
ScienceOn
|
4 |
C.Y. Chung, "A novel package electrical characterization process-application on plastic BGA packages", Proceedings of the 1st Electronic Packaging Technology Conference, pp. 304-309, 1997.
|
5 |
L. Shan, J. Trewhella, C. Baks, R. John, W. Dyckman, D. O'Connor, and E. Pillai, "A low-cost ceramic BGA package for 50 Gb/s multiplexing circuit", Electrical Performance of Electronic Packaging, pp. 59-62, 2003.
|
6 |
H. Hasan, A. Cangellaris, R. Kaw, and W. Pinello, "Effects of heat spreader on electrical characteristics of tape-BGA packages", IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 153-156, 1997.
|
7 |
Rinebold, K. and Newberry, W. "Trends in BGA design methodologies", Proceedings of 1998 IEEE Symposium on IC/Package Design Integration, pp. 120-123, 1998.
|
8 |
Ming-Kun Chen and Cheng-Chi Tai, "Electrical characterization of BGA test socket for high-speed applications", Proceedings of the 4th International Symposium on Electronic Materials and Packaging, pp. 123-126, 2002.
|
9 |
Da-Yuan Shih, Paul Lauro, Keith Fogel, Brian Beamanaj, Yun-Hsin Liao, and James Hedrick., "New ball grid array module test sockets", Proceedings of the Electronic Components & Technology Conference, vol. 46, no. 1, pp. 467-470.
|
10 |
Benson Chan, "BGA sockets - A dendritic solution", Proceedings of the Electronic Components & Technology Conference, vol. 46, no. 1, pp. 460-466, 1996.
|
11 |
H. Koeppen and L. Muller, "Alloys C17400 and C17410-New beryllium copper alloys for connector applications", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 9, Issue 3, pp. 310-316, 1986.
DOI
|
12 |
I.J. Zatz and H.A. Murray, "Fracture testing of beryllium copper alloy C17510", Proceedings, 14th IEEE/NPSS Symposium on Fusion Engineering, vol. 1, pp. 276-279, 1991.
|
13 |
김상원, 조찬섭, 남재우, 김봉환, 이종현, "MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작", 대한전자공학회 논문지 제47권 SD편, 제11호, pp. 749-753.
|
14 |
S. Sasaki and T. Kishimoto, "High-pin-count quad flat package with thin-film termination resistors", Proceedings of 1993 Japan International Electronic Manufacturing Technology Symposium, pp. 125-128, 1993.
|
15 |
Jongwoo Park, D.G. Harlow, and H.F. Nied, "Growth kinetics of interfacial damage: epoxy coating on a generic dual inline package", IEEE Transactions on Components and Packaging Technologies, vol. 24, Issue 3, pp. 482-492, 2001.
DOI
ScienceOn
|
16 |
H. Hardisty and J Abboud, "Thermal analysis of a dual-in-line package using the finite-element method" IEE Proceedings, Part I - Solid-State and Electron Devices (ISSN 0143-7100), vol. 134, pt. I, no. 1, pp. 23-31, Feb. 1987.
DOI
ScienceOn
|
17 |
A. Emerick, J. Ellerson, J. McCreary, R. Noreika, C. Woychik, and P. Viswanadham, "Enhancement of TSOP solder joint reliability using encapsulation", Proceedings. 43rd Electronic Components and Technology Conference, pp. 187-192, 1993.
|