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http://dx.doi.org/10.6117/kmeps.2012.19.3.071

Chip Interconnection Process for Smart Fabrics Using Flip-chip Bonding of SnBi Solder  

Choi, J.Y. (Department of Materials Science and Engineering, Hongik University)
Park, D.H. (Department of Materials Science and Engineering, Hongik University)
Oh, T.S. (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.3, 2012 , pp. 71-76 More about this Journal
Abstract
A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.
Keywords
Smart fabric; Electronic textile; Flip chip; Contact resistance;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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