1 |
Y. K. Son, J. E. Kim and I. Y. Cho, "Trends on Wearable Computer Technology and Market", Electronics and Telecommunications Trends, 23, 79 (2008).
|
2 |
J. E. Kim, H. T. Jeong and I. Y. Cho, "Trend in Digital Clothing Technology", Electronics and Telecommunications Trends, 24, 20 (2009).
|
3 |
S. Wagner, E. Bonderover, W. B. Jordan and J. C. Strum, "Electrotextiles: Concepts and Challenges", Int. J. High Speed Electon. Syst., 12, 391 (2002).
DOI
|
4 |
T. Linz, R. Vieroth, C. Dils, M. Koch, T. Braun, K. F. Becker, C. Kallmayer and S. M. Hong, "Embroidered Interconnections and Encapsulation for Electronics in Textiles for Wearable Electronics Applications", Adv. Sci. Technol., 60, 85 (2008).
DOI
|
5 |
S. J. Schwartz and A. Pentland, "The Smart Vest: Towards a Next Generation Wearable Computing Platform", MIT Media Laboratory Perceptual Computing Section Technical Report No. 504, pp.1-7 (1999).
|
6 |
T. Linz, C. Kallmayer, R. Aschenbrenner and H. Reichl, "Fully Integrated EKG Shirt Based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics", Proc. 3rd Int. Workshop on Wearable and Implantable Body Sensor Networks (BSN 2006), pp.23-26 (IEEE, 2006).
|
7 |
T. Linz, L. Gourmelon and G. Langereis, "Contactless EMG Sensors Embroidered onto Textile", Proc. 4th Int. Workshop on Wearable and Implantable Body Sensor Networks (BSN 2007), pp.29-34 (IEEE, 2007).
|
8 |
D. Meoli and T. May-Plumlee, "Interactive Electronic Textile Development", J. Textile Apparel, Technol. Manag., 2, 1, 2002.
|
9 |
E. R. Post, M. Orth, P. R. Russo and N. Gershenfeld, "E-broidery: Design and Fabrication of Textile-based Computing", IBM Syst. J., 39, 840 (2000).
DOI
|
10 |
D. Marculescu, R. Marculescu, N. H. Zamora, P. Stanley- Marbell, P. K. Khosla, S. Park, S. Jayaraman, S. Jung, C. Lauterbach, W. Weber, T. Kirstein, D. Cottet, Z. Grzyb, G. Troster, M. Jones, T. Martin and Z. Nakad, "Electronic Textiles: A Platform for Pervasive Computing", Proc. IEEE, 91, 1995 (2003).
DOI
|
11 |
S. Park and S. Jayaramin, "Smart Textiles: Wearable Electronic Systems", MRS Bulletin, 27, 585 (2003).
|
12 |
R. Vieroth, C. Kallmayer, R. Ascenbrenner and H. Reichl, "A New Package for Textile Integrated RFID Tags", Proc. 11th Electon. Packag. Technol. Conf., pp.240-243 (2009).
|
13 |
P. Lukowicz, T. Kirstein and G. Troster, "Wearable Systems for Health Care Applications", Methods Inf. Med., 43, 232 (2004).
|
14 |
Y. Kim, H. Kim and H. J. Yoo, "Electrical Characterization of Screen-Printed Circuits on the Fabric", IEEE Trans. Adv. Packag., 33 196 (2010).
|
15 |
U. R. Kattner, "Phase Diagrams for Lead-Free Solder Alloys", JOM, 54, 45 (2002).
|
16 |
J. Kloeser, K. Heinricht, K. Kutzner, E. Jung, A. Ostmann and H. Reichl, "Fine Pitch Stencil Printing of Sn/Pb and Lead Free Solders for Flip Chip Technology", IEEE Trans. Comp. Packag. Manuf. Technol., 21, 41 (1998).
DOI
|
17 |
J. Y. Choi, J. H. Lee, J. T. Moon and T. S. Oh, "Wafer-Level MEMS Capping Process Using Electrodeposition of Ni Cap and Debonding with SnBi Solder Layer", J. Microelectron. Packag. Soc., 16(4), 23 (2009).
|
18 |
S. C. Kim and Y. H. Kim, "Low Temperature Bonding Technology for Electronic Packaging", J. Microelectron. Packag. Soc., 19(1), 17 (2012).
DOI
|