• 대한기계학회논문집B
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• 제27권10호
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• pp.1480-1488
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• 2003

Synthesis of carbon nanomaterials on a substrate coated with metal nitrates using an ethylene fueled inverse diffusion flame was illustrated. The effects of radial distance, residence time of the substrate, and hydrocarbon composition on the synthesis of carbon nanomaterials were investigated. The effects of catalyst metal particles were also studied using SUS304 substrates coated with Fe(NO$_3$)$_3$ (ferric nitrate, nonahydrate) and Ni(NO$_3$)$_2$(nickel nitrate, hexahydrate), and Cu substrate. Carbon nanomaterials, with diameters ranging from 30 - 70 nm, were observed on the substrate for both cases of using substrates only and using them with metal nitrates. In case of using the substrate with metal nitrates, the formation and growth of carbon nanomaterials were occurred in the lower temperature region than that of using the substrates only due to the easy activation of the metal particles coated on the surface of the substrates.

• 한국전기전자재료학회논문지
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• 제15권1호
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• pp.24-29
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• 2002

In this paper, the microstructure and the dielectric properties of Sr$\_$1-x/CaxTiO$_3$(0$\leq$x$\leq$0.2)-based grain boundary layer ceramics were investigated. The sintering temperature and time were 1420∼152 0$\^{C}$ and 4 hours in N$_2$ gas, respectively. The average grain size and the lattice constant were decreased with increasing content of Ca, but the average grain size was increased with increase of sintering temperature. The second phase foamed by the thermal diffusion of CuO from the surface leads to verb high apparent dielectric constant, $\xi$$\_$r/>50000 and low dielectric loss, tan$\delta$<0.05. X-ray diffraction patterns of Sr$\_$1-x/CaxTiO$_3$ exhibited cubic structure, and the peaks shifted upward and the peak intensity were decreased with x. This is due to the lattice contraction as Sr is replaced by Ca with a smaller ionic radius. The specimens treated thermal diffusion for 2hrs in 1150$\^{C}$ exhibited nonlinear current-voltage characteristic, and its nonlinear coefficient(a) was overt 7.

• 한국전기전자재료학회논문지
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• 제14권11호
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• pp.879-884
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• 2001

In this paper, the structural and dielectric properties of (Sr$_{l-x}$Ca$_{x}$)TiO$_3$ (0$\leq$x$\leq$0.2) -based grain boundary layer ceramics were investigated by XRD, SEM and HP4194A. The ceramics were fabricated by the conventional mixed oxide method. The sintering temperature and time were 1420~152$0^{\circ}C$ and 4 hours, respectively. The average grain size and the lattice constant were decreased with increasing content of Ca. The average grain size was increased with increase of sintering temperature. The relative density of all specimens was 96~98%. The 2nd Phase formed by the thermal diffusion of CuO from the surface leads to very excellent dielectric properties, that is, $\varepsilon$$_{r}$>50000, tan $\delta$<0.05, $\Delta$C<$\pm$10%. The appropriate Ca content was under 15 ㏖%.s under 15 ㏖%.%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.114-115
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• 2006

반도체 기술이 초고집적화 되어감에 따라 공정에서 선폭이 줄어들고, 박막을 다층으로 제조하는 것이 중요하게 되었다. 이와 같은 제조 공정 하에서는 Si 기판과 금속 박막간의 확산이 커다란 문제로 부각되어 왔다. 특히 Cu는 높은 확산성에 의하여 Si 기판과 접합에서 많은 확산에 의한 문제가 발생하게 되며. 또한 선폭이 줄어듦에 따라 고열이 발생하여 실리콘으로 spiking이 발생하게 된다. 이를 방지하기 위하여 우리는 3개의 화합물로 구성된 Tungsten-Carbon-Nitrogen (W-C-N) 확산방지막을 사용하였다. 실험은 물리적 기상 증착법 (PVD)으로 질소비율을 변화하며 확산방지막을 증착하였고, 이를 여러 온도에서 열처리하여 X-ray Diffraction 분석을 하였다.

• 한국표면공학회지
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• 제27권5호
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• 한국자기학회지
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• 제15권4호
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• pp.226-230
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• 2005

본 연구에서는 스핀밸브 구조에서 하지층으로 많이 사용되고 있는 Ta 층에 질소를 첨가하여 질소량에 따른 자기적 특성과 열처리 결과를 비교 검토하였다. 또한 하지층에 질소를 첨가하여 확산 방지막으로서 역할과 기판과 하지층과의 접착력을 측정하여 비교하였다. 사용된 스핀밸브는 Si($SiO_2$)/Ta(TaN)/NiFe/CoFe/Cu/CoFe/FeMn/Ta 구조이다. Ta 박막에 비해 TaN 박막의 질소량이 증가할수록 증착률은 감소하였고, 비저항과 표면 거칠기는 증가하였다. 고온에서 열처리 후 측정한 XRD 결과를 보면 Si/Ta 박막에서는 규소화합물이 생성된 반면 Si/TaN 박막에서는 규소화합물을 발견할 수 없었다. 자기저항비(MR)와 교환결합자장($H_{ex}$)은 질소량이 4.0 sccm 이상에서는 감소하였다. 열처리 결과 자기저항비는 하지층이 Ta인 시편과 질소량이 4.0 sccm까지 혼합된 TaN 시편은 $200^{\circ}C$까지는 약 $0.5\%$ 정도 증가하다가 감소하였다. 기판과 하지층과의 접착력을 측정한 결과 Ta 박막보다 질소량이 8.0 sccm인 TaN 박막인 경우 약 2배 강한 접착력을 보였다. 본 연구 결과에 의하면 하지층 증착 시 아르곤 가스에 3.0 sccm 정도의 질소 가스를 혼합하여 사용하면 자기적 특성에 크게 영향을 주지 않으면서 확산 방지막, 접착력 향상등의 이점을 얻을 수 있으리라 사료된다.

• 대한치과보철학회지
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• 제23권1호
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• pp.39-59
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• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.

• 한국초전도ㆍ저온공학회논문지
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• 제22권1호
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• pp.1-6
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• 2020

This is a parameter study for the direct fabrication of a large grain YBCO bulk superconductors using Y₂O₃, BaCO₃ and CuO powders without any grinding step. The cracks, which have been formed due to volume contraction during calcination step, have been prevented by controlling the heating rate at 930~950 ℃. It has been observed that multi-grain growth has occurred due to the dissolution of Sm123 seed due to the retention of carbon in Ba-Cu-O melt. In order to accelerate the carbon release in prior calcination heat treatment, the reduction of pellet thickness and the drilling of artificial holes have been applied. Single-grain YBCO bulk superconductor has been successfully fabricated by stacking multiple thin slab. However, the crack formation has been rather prominent for the compact with artificial holes. The use of buffer pellet, which is supposed to act as diffusion barrier, has prevented the dissolution of Sm123 seed crystal and has led to the growth of single grain of high content of carbon containing specimen.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 춘계학술대회 논문집
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• pp.33-34
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• 1988

태양전지의 특성분석에 관한 최근의 동향을 고찰해 보기로 한단. 첫째, $CuInSe_2$와 비정질 실리콘 등의 광전압 용도의 태양전지의 재료선택에 관한 일반 규칙을 살펴 보고, 둘째, AM1 조건에서 보다 정확한 전지효율의 측정방법을 조사하며, 셋째, 태양전지의 중요 특성분석방법들을 소개 설명한다. 특히 생산 품질관리의 규모로 까지 확대적용이 가능한 다음과 같은 태양전지의 특성분석방법들의 장치개선 및 컴퓨터제어를 고찰하기로 한다. 전지효율 및 기타 전지특성을 위한 전류-전압 성질 측정장치, 양자효율을 위한 분광반응장치, 소수 이동자의 확산거리를 위한 표면광전압장치, 또한 에너지갭 내의 양자상태밀도를 위한 광열굴절장치 등이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.172-172
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• 2011

현대 반도체 금속배선 연구에서는 기존에 쓰이던 Al (Aluminium) 금속배선 대신에 Cu(Copper) 금속배선 연구가 진행 되고 있다. Cu는 Al 보다 비저항이 낮고, 녹는점도 Al보다 높다는 장점이 있지만 저온에서 기판인 Si (Silicon) 과 반응하고 접착력이 우수하지 못 하다는 단점이 있다. 이런 문제를 해결하기 위하여 확산방지막을 기판과 금속배선 사이에 삽입하는 방법이 제시 되었다. 확산방지막으로는 기존에 쓰이던 Ti (Titanium) 계열의 확산방지막과 W (Tungsten) 계열의 확산방지막이 있다. 이번 연구에서는 W 계열의 확산방지막에 불순물 C (Carbon), N(Nitrogen)을 첨가한 W-C-N 확산방지막 시편을 제조하였고, N2의 비율을 변화시키며 $600^{\circ}C$ 열처리를 하였다. 실험 결과 질소의 포함 농도에 따라 확산방지막의 안정도가 변화한다는 결과를 얻었으며, 질소 첨가량에 따라 시편의 표면 보다는 시편의 중간층의 물성 변화율이 큰데 이는 시편 표면의 질소는 열처리 중 확산에 의한 시편과의 분리 현상이 일어나지만 시편의 중간층은 trap현상에 의하여 시편에 남아있어 질소의 영향을 받아 시편의 중간층이 더욱 질소 유량에 따른 영향이 큰 것을 확인하였다. 이 결과로부터 W-C-N 박막은 첨가된 질소의 유량에 따라 박막의 안정도가 결정된 다는 것을 알았다. 본 연구에서 시편은 rf magnetron sputtering 방법으로 제작하였고 연속압입 실험은 Hysitron사의 Triboindenter를 이용하였다. Indenting에 사용된 압입팁은 Berkovich tip을 사용하였다.