• Archives of Metallurgy and Materials
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• v.67 no.4
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• pp.1475-1479
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• 2022

This work mainly focuses on the sintering behavior of the Cu-Sn alloy with the addition of Ag up to 4 wt% after pulsed electric current sintering (PECS) process for ultra-fast sintering. The microstructural evolution was characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and density measurements. The mechanical properties were evaluated via measurements of transverse rupture strength (TRS) and Rockwell hardness. The mechanism during the sintering process has been discussed thoroughly, and the effect on porosity with the addition of the Ag is also correlated. The results showed that the growth of porosity progressed with the amount of Ag up to 2 wt%, and further addition of Ag leads reduction in porosity. The effect on mechanical properties were improved slowly as the amount of Ag increased.

• 보존과학연구
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• s.6
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• pp.121-196
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• 1985

Atomic absorption spectrophotometer was used for analyzing each 10elements(Cu, Pb, Sn, Zn, Sb, Fe, Ni, Ag, Co and Mn)on 64 Chinese coinsre covered from Shinan seabed sunken ship. The results show that Cu, Pb and Sn were found to be a major elements consisting of coins and its composition ratio was 6 to 2 to 1.The composition of trace elements on coins was classified 3 levels : Sb, Fe and Zn(0.02%-2.2%), Ag, Ni, and Co(50 ppm-5500 ppm) and Mn(Trace). Theam ount of major elements, Cu and Sn were decreased while increased in Pbby the passage of ages (10th - 13th century) in China. There seems to be no systematic compositional change in major elements but content in trace elements was confirmed to increase with age.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.75-77
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• 2004

Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn$_2$ IMCs were formed at the interface solder and pad after 1reflow. An increase of the number of reflows changed AuIn into AuIn$_2$. AuIn$_2$ IMC layer at the interface broke and spalled away into the solder after 3reflows. Shear force decreased with the number of reflows because the weakness of the interface by the spalling of AuIn$_2$ IMC layer.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.400-400
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• 2009

Despite the success of Cu(In,Ga)$Se_2$ (CIGS) based PV technology now emerging in several industrial initiatives, concerns about the cost of In and Ga are often expressed. It is believed that the cost of those elements will eventually limit the cost reduction of this technology. One candidate to replace CIGS is $Cu_2ZnSnSe_4$ (CZTSe), fabricated by co-evaporation technique. Co-evaporation technique will be one of the best methods to control film composition. This type of absorber derives from the $CuInSe^2$ chalcopyrite structure by substituting half of the indium atoms with zinc and other half with tin. Energy bandgap of this material has been reported to range from 0.8eV for selenide to 1.5eV for the sulfide and large coefficient in the order of $10^{14}cm^{-1}$, which means large possibility of commercial production of the most suitable absorber by using the CZTSe film. In this work, Effects of substrate temperature of $Cu_2ZnSnSe_4$ absorber layer on the performance of thin films solar cells were investigated. We reported on some of the absorber properties and device results.

• Applied Chemistry for Engineering
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• v.5 no.2
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• pp.327-336
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• 1994

The synergistic effects in mechanical mixture catalysts of Mo-V-O and metal oxide were investigated for the selective oxidation of acrolein. The metal oxides used are $SnO_2$, ${\alpha}-Sb_2O_4$, $WO_3$, ${\alpha}-Al_2O_3$, CuO, $MnO_2$, $Cu_2O$, MgO, CoO, and ZnO. Mechanical mixtures of Mo-V-O plus $SnO_2$ or ${\alpha}-Sb_2O_4$ had resulted in higher conversion of acrolein and higher yield of acrylic acid than Mo-V-O. The origin of the synergy is attributed to the cooperation of Mo-V-O and $SnO_2$ or ${\alpha}-Sb_2O_4$, in which $SnO_2$ or ${\alpha}-Sb_2O_4$ forms dissociated oxygens at their oxygen vacancies and transports them to Mo-V-O. $Cu_2O$, MgO, CuO, and $MnO_2$, increased conversion of acrolein but decreased yield of acrylic acid. CoO and ZnO inhibited the catalytic performance of Mo-V-O. The different role of these metal oxides is explained in terms of their oxidation-reduction properties.

• Korean Journal of Materials Research
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• v.8 no.1
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• pp.33-37
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• 1998

Sn-Zn계 solder에서 Zn함량의 변화에 따른 납땜성을 납땜분위기 및 용제를 달리하여 연구하였다. 계면에서의 미세조직 관찰은 열처리온도를 8$0^{\circ}C$와 10$0^{\circ}C$로 달리하여 100일간 열처리한 후 관찰하였다. 젖음성 측정 결과, Zn함량이 증가함에 따라 젖음성은 감소하였고 RMA-용제를 사용한 경우가 R-용제를 사용한 경우에 비해 젖음성이 향상되었다. Sn-9Zn의 접촉각은 약 45도이고, 공기중에서 보다 질소 분위기에서 납땜한 경우가 젖음성 개선을 나타냈다. Sn-9Zn땝납과 Cu기판에서의 계면반응을 XRD, EDS로 분석한 결과 계면화합물은 r상(Cu$_{5}$Zn$_{3}$)으로 구성되어 있음을 알 수 있으며, 시효처리에 따라 접합부의 solder쪽에는 Zn상의 고갈이 나타남을 확인할 수 있었다.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.2
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• pp.234-240
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• 2009

In this study, we found that it is important to have a specific management of standards which are the $12{\pm}3{\mu}m$ of plating thickness and $2{\pm}1%$ of tuning. To verify these standards, we checked the plating thickness and density of tuning through marginal valuation of each and checked size of a plating particle, adhesion of solder and condition of reflow after a section chief.