• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.340-347
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• 2004

Ultra-small size, high-performance, solenoid-type RF chip inductors utilizing low-loss A1$_2$O$_3$ core materials were investigated. The dimensions of the RF chip inductors fabricated were 1.0mm${\times}$0.5mm${\times}$0.5mm and copper coils were used. The materials (96％ A1$_2$O$_3$) and shape (I-type) of the core, the diameters (40${\mu}{\textrm}{m}$) and position (middle) of the coil, and the lengths (0.35mm) of solenoid were determined by a high-frequency structure simulator (HFSS) to maximize the performance of the inductors. The high-frequency characteristics of the inductance (L) and quality-factor (Q) of the developed inductors were measured using a RF impedance/material analyzer (E4991A with E16197A test fixture). The developed inductors exhibit an inductance of 11 to 11.3nH and a qualify factor of 22.3 to 65.7 over the frequency ranges of 250 MHz to 1.7 GHz, and show results comparable to those measured for the inductors prepared by Coilcraft$^{TM}$. The simulated data described the high-frequency data of the L and Q of the fabricated inductors well.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.399-402
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• 2004

This paper presents a system-on-chip prototype implementing a full integration for a portable digital audio system. The chip is composed of a audio processor block to implements audio decoding and voice compression or decompression software, a system control block including 8-bit MCU core and Memory Management Unit (MMU) a low power 16-bit ${\Sigma}{\Delta}$ CODEC, two DC-to-BC converter, and a flash memory controller. In order to support other audio algorithms except Mask ROM type's fixed codes, a novel 16-bit fixed-point DSP core with the program-download architecture is proposed. Funker, an efficient power management technique such as task-based clock management is implemented to reduce power consumption for portable application. The proposed chip has been fabricated with a 4 metal 0.25um CMOS technology and the chip area is about 7.1 mm ${\times}$ 7.1mm with 100mW power dissipation at 2.5V power supply.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.190-195
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• 2005

The hearing aid chip described in this paper is an analog & digital mixed system. The design focuses on the$\mu$DSP core. This $\mu$DSP core includes internal time delays to two inputs from front and rear microphones. The paper consists of two parts; one is the composure and signal processing algorithm of digital hearing aids and the other is Verilog HDL codes for$\mu$DSP cores. All digital modules in the design were coded and synthesized by Verilog HDL codes which were verified by Mentor Graphics and Synopsis semiconductor chip design tools.

• ETRI Journal
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• v.37 no.6
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• pp.1176-1187
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• 2015

This work proposes a highly efficient sensorless motor driver chip for various permanent-magnet synchronous motors (PMSMs) in a wide power range. The motor driver chip is composed of two important parts. The digital part is a sensorless controller consisting mainly of an angle estimation block and a speed control block. The analog part consists of a gate driver, which is able to sense the phase current of a motor. The sensorless algorithms adapted in this paper include a sliding mode observer (SMO) method that has high robust characteristics regarding parameter variations of PMSMs. Fabricated SMO chips detect back electromotive force signals. Furthermore, motor current-sensing blocks are included with a 10-bit successive approximation analog-to-digital converter and various gain current amplifiers for proper sensorless operations. Through a fabricated SMO chip, we were able to demonstrate rated powers of 32 W, 200 W, and 1,500 W.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.7
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• pp.1418-1423
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• 2009

This paper describes the design and implementation of a System-on-a-Chip (SoC) for image processing applications to use in wearable/mobile products. The target Soc consists of LEON 2 core, AMBA/APB bus-systems and custom-designed controllers. A new FPGA-based prototyping platform is implemented and used for design and verification of the target SoC. To ensure that the implemented SoC satisfies the required performances, an image processing application is performed.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.575-582
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• 2014

One of the most important decision making is which product's components should make in-house and which should they outsource. This paper suggests a framework to solve above question. This paper applies to LCD TV industry with AHP analysis. The results shows that Scaler chip, LCD panel, MPEG decoder, and Video decoder are important components. Samsung Electronics turn out make in-house these core component. This research will be a good guideline for selecting core component.

• Proceedings of the Korea Information Processing Society Conference
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• 2011.04a
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• pp.250-253
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• 2011

Chip manufacture nowadays turned their attention from accelerating uniprocessors to integrating multiple cores on a chip. Moreover desktop graphic hardware is now starting to support general purpose computation. Desktop users are able to use multi-core CPU and GPU as a high performance computing resources these days. However exploiting parallel computing resources are still challenging because of lack of higher programming abstraction for parallel programming. The 2-dimensional discrete cosine transform (2D-DCT) algorithms are most computational intensive part of JPEG encoding. There are many fast 2D-DCT algorithms already studied. We implemented several algorithms and estimated its runtime on multi-core CPU and GPU environments. Experiments show that data parallelism can be fully exploited on CPU and GPU architecture. We expect parallelized DCT bring performance benefit towards its applications such as JPEG and MPEG.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.69-74
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• 2013

In this paper, the impact of integrating large number of I/O (Input-Output) and Core power Delivery Network (PDN) on a 6 layers Flip-Chip Ball Grid Array (FCBGA) package is investigated. The impact of core induced supply noise on high-speed I/O interfaces, and high-speed I/O interface's supply noise coupling to adjacent high-speed I/O interfaces' jitter impact are studied. Concurrent stress validation software is used to induce SSO noise on each individual I/O interfaces; and at the same time; periodic noise is introduced from Core PDN into the I/O PDN domain. In order to have the maximum coupling impact, a prototype package is designed to merge the I/O and Core PDN as one while impact on jitter on each I/O interfaces are investigated. In order to understand the impact of the Core to I/O and I/O to I/O noise, the on-die noise measurements were measured and results were compared with the original PDN where each I/O and Core PDN are standalone and isolated are used as a benchmark.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.174-177
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• 2016

Wireless network-on-chip (WNoC) can alleviate critical path problem of existing typical NoCs by integrating radio-frequency module on router. In this paper, core-connection-aware genetic algorithm-based core and WIR mapping methodology at small world WNoC is presented. The methodology could optimize the critical path between cores with heavy communication. The 33% of average latency improvement is achieved compared to random mapping methodology.

• Journal of the Korea Society of Computer and Information
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• v.18 no.10
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• pp.13-21
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• 2013

Recently, although the number of cores on a chip multi-processor increases, multi-programming or multi-threaded programming techniques to utilize the whole cores are still insufficient. Therefore, there inevitably exist some idle cores which are not working. This results in a waste of the caches, so-called idle caches which are dedicated to those idle cores. In this research, we propose amethodology to exploit idle caches effectively as victimcaches of on-chip memory resource. In simulation results, we have achieved 19.4%and 10.2%IPC improvement in 4-core and 16-core respectively, compared to previous technique.