• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.2
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• pp.29-35
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• 1998

This paper describes architectures and design of a SIMD type parallel image processing chip called SliM-II. The chiphas a linear array of 64 processing elements (PEs), operates at 30 MHz in the worst case simulation and gives at least 1.92 GIPS. In contrast to existing array processors, such as IMAP, MGAP-2, VIP, etc., each PE has a multiplier that is quite effective for convolution, template matching, etc. The instruction set can execute an ALU operation, data I/O, and inter-PE communication simulataneously in a single instruction cycle. In addition, during the ALU/multiplier operation, SliM-II provides parallel move between the register file and on-chip memory as in DSP chips, SliM-II can greatly reduce the inter-PE communication overhead, due to the idea a sliding, which is a technique of overlapping inter-PE communication with computation. Moreover, the bandwidth of data I/O and inter-PE communication increases due to bit-parallel data paths. We used the COMPASS$^{TM}$ 3.3 V 0.6.$\mu$m standrd cell library (v8r4.10). The total number of transistors is about 1.5 muillions, the core size is 13.2 * 13.0 mm$^{2}$ and the package type is 208 pin PQ2 (Power Quad 2). The performance evaluation shows that, compared to a existing array processors, a proposed architeture gives a significant improvement for algorithms requiring multiplications.s.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.769-770
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• 2011

This paper presented a method constructing the ITSoC(Information Technology System-on-Chip). In order to implement the ITSoC, designers are increasing relying on reuse of intellectual property(IP) blocks. Since IP blocks are pre-designed and pre-verified, the designer can concentrate on the complete system without having to worry about the correctness or performance of the individual components. Also, embedded core in an ITSoC access mechanisms are required to test them at the system level. That is the goal, in theory. In practice, assembling an ITSoC using IP blocks is still an error-prone, labor-intensive and time-consuming process. This paper discuss the main challenge in ITSoC designs using IP blocks and elaborates on the methodology and tools being put in place for addressing the problem. It explains ITSoC architecture and gives algorithmic details on the high-level tools being developed for ITSoC design.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.63 no.2
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• pp.81-88
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• 2014

In this paper, an implementation of concurrent backoff delay process on a single chip with IEEE 802.15.4 hardware and 8051 processor core that can be used for analyzing the interference on IEEE 802.15.4 channels due to WiFi traffics is studied. The backoff delay process of IEEE 802.15.4 CSMA-CA algorithm is explained. The characteristics of random number generator, timer, and CCA register included in the single chip are described with their control procedure in order to implement the process. A concurrent backoff delay process to evaluate multiple IEEE 802.15.4 channels is proposed, and a method to service the associated tasks at sequentially ordered backoff delay events occurring on the channels is explained. For the implementation of the concurrent backoff delay process on a single chip IEEE 802.15.4 hardware, the elements for the single channel backoff delay process and their control procedure are used to be extended to multiple channels with little modification. The medium access delay on each channel, which is available after execution of the concurrent backoff delay process, is displayed on the LCD of an IEEE 802.15.4 channel analyzer. The experimental results show that we can easily identify the interference on IEEE 802.15.4 channels caused by WiFi traffics in comparison with the way displaying measured channel powers.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.3
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• pp.359-366
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• 2016

Today's multi-core technology rapidly increases with more and more Intellectual Property cores on a single chip. Network-on-Chip (NoC) is an emerging communication network design for SoC. For efficient on-chip communication, routing algorithms plays an important role. This paper proposes a novel multicast routing technique entitled as Docket NoC (Dt-NoC), which eliminates the need of routing tables for faster communication. This technique reduces the latency and computing power of NoC. This work uses a CURVE restriction based algorithm to restrict few CURVES during the communication between source and destination and it prevents the network from deadlock and livelock. Performance evaluation is done by utilizing cycle accurate RTL simulator and by Cadence TSMC 18 nm technology. Experimental results show that the Dt-NoC architecture consumes power approximately 33.75% 27.65% and 24.85% less than Baseline XY, EnA, OEnA architectures respectively. Dt-NoC performs good as compared to other routing algorithms such as baseline XY, EnA, OEnA distributed architecture in terms of latency, power and throughput.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.3
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• pp.93-100
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• 2004

Test scheduling of SoC (System-on-a-chip) is very important because it is one of the prime methods to minimize the testing time under limited power consumption of SoC. In this paper, a heuristic algorithm, in which test resources are selected for groups and arranged based on the size of product of power dissipation and test time together with total power consumption in core-based SoC is proposed. We select test resource groups which has maximum power consumption but does not exceed the constrained power consumption and make the testing time slot of resources in the test resource group to be aligned at the initial position in test space to minimize the idling test time of test resources. The efficiency of proposed algorithm is confirmed by experiment using ITC02 benchmarks.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.1003-1006
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• 2005

Demand of Auto Focus for Camera module is increased very fast in these days and will be adapted to most of mobile phones in next few years instead of traditional method, fixed focus. To make auto focus function, 2 kinds of solutions, VCM(Voice Coil Motor) and Piezo linear motor are normally used. In this paper, VCM which commercially strong candidate for Auto focus mechanism was investigated to verify principles are match up to the actual operation. Auto focus algorithm is different between 1 chip and 2 chip solution. Normally 2 chip is more complicate than the other. To have best performance on this function, hysteresis and depth of field(DOF) table should be optimized.

• ETRI Journal
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• v.46 no.4
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• pp.708-715
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• 2024

We propose a 10-GHz 2 × 2 phased-array radio frequency (RF) receiver with an 8-bit linear phase and 15-dB gain control range using 65-nm complementary metal-oxide-semiconductor technology. An 8 × 8 phased-array receiver module is implemented using 16 2 × 2 RF phased-array integrated circuits. The receiver chip has four single-to-differential low-noise amplifier and gain-controlled phase-shifter (GCPS) channels, four channel combiners, and a 50-Ω driver. Using a novel complementary bias technique in a phase-shifting core circuit and an equivalent resistance-controlled resistor-inductor-capacitor load, the GCPS based on vector-sum structure increases the phase resolution with weighting-factor controllability, enabling the vector-sum phase-shifting circuit to require a low current and small area due to its small 1.2-V supply. The 2 × 2 phased-array RF receiver chip has a power gain of 21 dB per channel and a 5.7-dB maximum single-channel noise-figure gain. The chip shows 8-bit phase states with a 2.39° root mean-square (RMS) phase error and a 0.4-dB RMS gain error with a 15-dB gain control range for a 2.5° RMS phase error over the 10 to10.5-GHz band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.6
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• pp.633-643
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• 2013

GDS format files, as well as layout of the chip are noticeably needed so as to analyze the PDN (Power Delivery Network) inside of IC; however, commercial IC in the market has not supported design information which is layout of IC. Within this, in terms of IC having on-chip PDN, characteristic of inside PDN of the chip is a core parameter to predict generated noise from power/ground planes. Consequently, there is a need to scrutinize extraction method for unknown PDN of the chip in this paper. To extract PDN of the chip without IC circuit information, the de-embedding test vehicle is fabricated based on IEC62014-3. Further more, the extracted inside PDN of chip from de-embedding technique adopts the Co-simulation model which composes PCB, QFN (Quad-FlatNo-leads) Package, and Chip for the PDN, applied Co-simulation model well corresponds with impedance from measured S-parameters up to 4 GHz at common measured and simulated points.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.117-122
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• 2010

Recently, aspheric glass lens molding core is fabricated with tungsten carbide(WC). If molding core is fabricated with silicon carbide(SiC), SiC coating process, which must be carried out before the Diamond-Like Carbon(DLC) coating can be eliminated and thus, manufacturing time and cost can be reduced. Diamond Like Carbon(DLC) is being researched in various fields because of its high hardness, high elasticity, high durability, and chemical stability and is used extensively in several industrial fields. Especially, the DLC coating of the molding core surface used in the fabrication of a glass lens is an important technical field, which affects the improvement of the demolding performance between the lens and molding core during the molding process and the molding core lifetime. Because SiC is a material of high hardness and high brittleness, it can crack or chip during grinding. It is, however, widely used in many fields because of its superior mechanical properties. In this paper, the grinding condition for silicon carbide(SiC) was developed under the grinding condition of tungsten carbide. A silicon carbide molding core was fabricated under this grinding condition. The measurement results of the SiC molding core were as follows: PV of 0.155 ${\mu}m$(apheric surface) and 0.094 ${\mu}m$(plane surface), Ra of 5.3 nm(aspheric surface) and 5.5 nm(plane surface).

• Journal of KIISE:Computer Systems and Theory
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• v.31 no.3_4
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• pp.160-169
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• 2004

With an emergence of SOC from developed IC technology, the VLSI design has required the core re-use technique and modular test development. To minimize the cost of testing SOC, an efficient method is required to optimize the test time and area overhead in conjunction for the core test wrapper, which is one of the important elements for SOC test architecture. In this paper, we propose an efficient design strategy of core test wrapper to achieve the minimum cost for SOC testing. The proposed strategy adopted advantages of traditional methods and more developed to be successfully used in practice.