• Title/Summary/Keyword: Copper plate

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Use of Hydrazine for Pitting Corrosion Inhibition of Copper Sprinkler Tubes: Reaction of Hydrazine with Corrosion By-Products

  • Suh, Sang Hee;Kim, Sohee;Suh, Youngjoon
    • Corrosion Science and Technology
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    • v.16 no.5
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    • pp.247-256
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    • 2017
  • The feasibility of using hydrazine for inhibiting pitting corrosion in copper sprinkler tubes was investigated by examining microscopical and structural evolution of corrosion by-products with SEM, EDS, and XRD. Hydrazine removed dissolved oxygen and reduced CuO and $Cu_2O$ as well. The stable phase was changed from CuO to $Cu_2O$ or Cu depending on hydrazine concentration. Hydrazine concentration of 500 ppm could convert all CuO corrosion by-products to $Cu_2O$. In a tightly sealed acryl tube filled with aqueous solution of 500 ppm hydrazine, octahedral $Cu_2O$ particles were formed while plate-like structures with high concentration of Cu, O, N and C were formed near a corrosion pit. The inside structure of a corrosion pit was not altered by hydrazine aqueous solution. Uniform corrosion of copper was almost completely stopped in aqueous solution of 500 ppm hydrazine. Corrosion potential of a copper plate was linearly dependent on log (hydrazine concentration). The concept of stopping pitting corrosion reaction by suppressing oxygen reduction reaction could be verified by applying this method to a reasonable number of real sprinkler systems before full-scale application.

Rapid Fabrication of Bi2212 Superconducting Films on Cu Tape with Cu-free Precursor (Cu-free 전구체를 이용한 동 테이프 위의 Bi2212 초전도 후막의 급속 제조)

  • 한상철;성태현;한영희;이준성;김상준
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.69-72
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    • 1999
  • A Well oriented Bi$_2$re$_2$CaCu$_2$O$\sub$8/(Bi2212) superconductor thick films were formed successfully on a copper substrate by liquid reaction between a Cu-free precursor and Cu tape using method in which Cu-free BSCO powder mixture was printed on copper plate and heat-treated. And we examined the mechanism for the rapid formation of Bi2212 superconducting films from observing the surface microstructure with heat-treatment time. At heat-treatment temperature, the printing layer partially melt by reacting with CuO of the oxidizing copper plate, and the nonsuperconducting phases present in the melt are typically Bi-free phases and Cu-free phases. Following the partial melting, the Bi$_2$Sr$_2$CaCu$_2$O$\sub$8/ superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. It was confirmed that the phase colony from the phase diagram of Bi$_2$O$_3$-(SrO+CaO)/2-CuO system is similar to the observed result.

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A Study on the Dissipation Energy of Plate due to Cutting

  • Lee, J. W.;Hong, S. J.
    • Journal of Ship and Ocean Technology
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    • v.1 no.1
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    • pp.48-56
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    • 1997
  • This paper deals with the energy dissipation of ductile metal plate due to cutting. By using nondimensional analysis, we present that the dissipation energy of tearing behaviour can be formulated as a function of slenderness ratio expressed by cutting length, yield stress, plate thickness and elastic modulus. The validity of the proposed formula for Al-alloy, copper and mild steel is demonstrated by comparing the proposed formula with experimental results, which are shown in good agreements except for thick mild steel plate.

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Effect of Electrolysis Parameters on the Fractal Structure of Electrodeposited Copper

  • Na Wu;Chunxia Zhang;Shanyu Han;Juan An;Wentang Xia
    • Journal of Electrochemical Science and Technology
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    • v.14 no.2
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    • pp.194-204
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    • 2023
  • Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.

A Study on the Cementation Reaction of Copper-containing Waste Etching Solution to the Shape of Iron Samples (철 샘플에 따른 구리 함유 폐에칭액의 시멘테이션 반응에 대한 연구)

  • Kim, Bo-Ram;Jang, Dae-Hwan;Kim, Dae-Weon
    • Clean Technology
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    • v.27 no.3
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    • pp.240-246
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    • 2021
  • The waste etching solution for chip on film (COF) contained about 3.5% copper, and it was recovered through cementation using iron samples. The effect of cementation with plate, chip, and powder iron samples was investigated. The molar ratio (m/r) of iron to copper was used as a variable in order to increase the recovery rate of copper. As the molar ratio increased, the copper content in the solution rapidly decreased at the beginning of the cementation reaction. Before and after the reaction, the copper content of the solution was determined by Inductively Coupled Plasma (ICP) using copper concentration according to time. After cementation at room temperature for 1 hour, the recovery rate of copper had increased the most in the iron powder sample, having the largest specific surface area of the samples, followed by the chip and plate samples. The recovered copper powder was characterized for its crystalline phase, morphology, and elemental composition by X-ray diffraction (XRD), scanning electron microscopy (SEM), and Energy-dispersive X-ray spectroscopy (EDS), respectively. Copper and unreacted iron were present together in the iron powder samples. The optimum condition for recovering copper was obtained using iron chips with a molar ratio of iron to copper of 4 giving a recovery rate of about 98.4%.

Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath (피로인산동욕의 무기첨가제에 의한 전해동박의 특성에 관한 연구)

  • Koo, Seokbon;Hur, Jinyoung;Lee, Hongkee
    • Journal of Surface Science and Engineering
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    • v.47 no.1
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    • pp.1-6
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    • 2014
  • The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

A Study on the Printed French Textiles in the 18th Century - Focus on the Toile do Jouy (18세기 프랑스의 프린트 직물에 관한 연구 -트왈 드 죠이 디자인을 중심으로-)

  • Kim, Hee-Sun;Koo, Hee-Kyung
    • Journal of the Korea Fashion and Costume Design Association
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    • v.8 no.3
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    • pp.129-143
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    • 2006
  • This study is to review the printed cotton textile industry of Europe in 17th-l8th century, and specially investigate the development of the Toile do Jouy, printed French fabrics around the 18th century. Generally, the Toile de Jouy has two different meanings. The first meaning is the popular printed cotton textiles producted by wood block printing, copper plate printing and roller printing techniques at Jouy on Joas factory in France, around 18th century. The second meaning is the monochromatic upholstery fabrics printed by copper plate. Actually, this monochromatic printed textiles were the most popular printed cotton fabrics with large scale scenic designs with people, trees, birds, buildings, mythical heroes, protagonists of novel and country scenes of shepherds, sheep and other animals manufactured by Jouy on Joas factory. Main issue of this paper is to propose features of pattern, color and classify types of patterns expressed on the Toile de Jouy fabrics according to printing techniques such as wood block printing, copper plate printing and copper roller printing. And this study is also to analyze on origins of the variety of names called the printed cotton textiles in those days. The results of this study can help to understand the knowledge of printed cotton textiles in Europe and be effectively applied to develop printed fabric design in the textile industry.

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Development of 3D printer heating block using clad plate material (클래드 판재를 사용한 3D 프린터 히팅 블록 개발)

  • Won, Dae-Hee
    • Journal of the Korea Convergence Society
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    • v.8 no.4
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    • pp.199-205
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    • 2017
  • In this study, the design analysis and the explosion welding were made into a clad sheet by the convergence method in order to solve the problem of heat transfer to the guide due to the heating of the 3D printer heating block. The shear strength of the clad plate material was tested and the results were analyzed by thermal analysis, thermal conductivity and thermal imaging. The following conclusions were obtained. 3D modeling of the heating block made of copper and titanium clad plate material The thermal analysis showed that the surface temperature of the filament guide area was lower than the heating block surface temperature. The average shear strength of copper and titanium clad plate material was measured and the average value of 195.6MPa was obtained. The thermal conductivity of the heating block made of copper and titanium clad plate material was measured three times and the average value was $62.52W/m{\cdot}K$. The surface temperature of the heating block made of copper and titanium clad plate material was measured by a thermal imaging camera at a maximum of $107.3^{\circ}C$ and $183.2^{\circ}C$ at the filament guide. The temperature distribution was $89^{\circ}C$ lower than that of the existing filament.

Comparison of Dose and Quality of Copper and Nickel Additional Filter Plate in Diagnostic X-ray Generator (진단용 엑스선 발생장치에서 부가 여과판에 따른 선량과 화질 비교)

  • Lee, Hyun-Kyung;Go, Yu-Rim;Park, Young-Kyeong;Han, Dong-Kyoon
    • Journal of the Korean Society of Radiology
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    • v.11 no.6
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    • pp.459-466
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    • 2017
  • The purpose of this study was to evaluate the difference of dose and image quality according to the material of the additional filter plate by selecting copper and nickel. First, the absorbed dose was measured using a Rando phantom setting the additional filter plates of copper and nickel None, 0.1 mm, 0.2 mm, and 0.3 mm under 120 kVp, and 6.3 mAs. Second, We acquired image according to filter thickness of copper and nickel. by changing the tube voltage of 90 kVp, 100 kVp, 110 kVp, 120 kVp and exposure indexes of 400, 800 and 1600. Third, we obtained the SNR and CNR values using the Image J program and evaluated quantitatively and then evaluated image quality. As a result, Absorbed dose measurements showed that nickel was higher than copper, and the absorbed dose decreased as the thickness increased(p<0.05). Furthermore, Quantitative analysis of images showed no significant difference between the two images according to change the voltage and the exposure index(p>0.05). In conclusion, this study confirms that the nickel addition plate can maintain the current image quality while reducing the exposure dose compared to copper.

A Study on the Performance of Flat-Plate Solar Collector with Rectangular Channels (사각관을 이용한 태양열집열기의 성능에 관한 연구)

  • Lee Sang Chun;Cha Jong Hee;Bae Soon Hoon
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.6 no.2
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    • pp.91-98
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    • 1977
  • For the cost reduction of a flat-plate solar collector, a new galvanized iron collectro plate replaced the convenctional copper or alnminum collector plates and the flow channel was also modified to a rectangular channel for a better heat transfer performance. A simple analytical model was developed and agreed well with the experimental results. The results show better thermal performance for a rectangular channel than for a conventional circular channel.

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