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http://dx.doi.org/10.5695/JKISE.2014.47.1.001

Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath  

Koo, Seokbon (Surface Technology R & BD Group, Korea Institute of Industrial Technology)
Hur, Jinyoung (Surface Technology R & BD Group, Korea Institute of Industrial Technology)
Lee, Hongkee (Surface Technology R & BD Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean institute of surface engineering / v.47, no.1, 2014 , pp. 1-6 More about this Journal
Abstract
The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).
Keywords
Pyrophosphate copper plating; Tensile strength; Crystal plane orientation; Ammonium nitrate; electrodeposition copper foil; Inorganic additives;
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