Journal of Surface Science and Engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath

피로인산동욕의 무기첨가제에 의한 전해동박의 특성에 관한 연구

  • Koo, Seokbon (Surface Technology R & BD Group, Korea Institute of Industrial Technology) ;
  • Hur, Jinyoung (Surface Technology R & BD Group, Korea Institute of Industrial Technology) ;
  • Lee, Hongkee (Surface Technology R & BD Group, Korea Institute of Industrial Technology)
  • 구석본 (한국생산기술연구원 표면처리연구실용화그룹) ;
  • 허진영 (한국생산기술연구원 표면처리연구실용화그룹) ;
  • 이홍기 (한국생산기술연구원 표면처리연구실용화그룹)
  • Received : 2013.10.08
  • Accepted : 2014.02.03
  • Published : 2014.02.28
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Abstract

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

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