• Korean Journal of Materials Research
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• v.16 no.11
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• pp.710-714
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• 2006

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

• Journal of the Korean Electrochemical Society
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• v.7 no.4
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• pp.173-178
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• 2004

Silicon thin film were synthesized from silane and argon gas mixture directly on copper foil by rf PECVD and then lithium ion batteries were prepared from them employed as the negative electrodes without any further treatment. In the present study, two different kinds of silicon thin films, amorphous silicon and copper silicide were prepared by changing deposition temperature. Amorphous silicon film was prepared below $200^{\circ}C$, but copper silicide film with granular shape was formed by the reaction between silicon radical and diffused copper ions under elevating temperature above $400^{\circ}C$. The amorphous silicon film gives higher capacity than copper silicide, but the capacity decreases sharply with charge-discharge cycling. This is possibly due to severe volume changes. The cyclability is improved, however, by employing the copper silicide as a negative electrode. The copper silicide plays an important role as an active material of the electrode, which mitigates volume change cause by the existence of silicon and copper chemical bonding and provides low electrical resistance as well.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1540-1542
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• 2001

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.57-62
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• 2008

The aim of this investigation was to extract the fatigue properties at the designated fatigue life of copper foil and observe the mean stress and stress amplitude effects on both the fatigue life and the corresponding surface morphology. Tensile tests were performed to determine the baseline monotonic material properties of the proportional limit and ultimate tensile strength. Constant amplitude fatigue tests were carried out using a feedback-controlled fatigue testing machine. The mean stress and the stress amplitude were changed to obtain the complete nominal stress-life curves. An atomic force microscope was utilized to observe the relationship between the fatigue damage and the corresponding changes in surface morphology. A Basquin's exponent of-0.071 was obtained through the fatigue tests. An endurance limit of 122 MPa was inferred from a Haigh diagram. The specimen surface became rougher as the number of fatigue cycles increased, and there was a close relationship between the fatigue damage and the surface roughness evolution.

• Journal of Power Electronics
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• v.15 no.2
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• pp.399-410
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• 2015

A 6.5 V/50 kA high-frequency switching power supply (HSPS) system composed of 10 power modules is developed to meet the requirements of copper-foil electrolysis. The power module is composed of a two-leg pulse width modulation (PWM) rectifier and a DC/DC converter. The DC/DC converter adopts two full-wave rectifiers in parallel to enhance the output. For the two-leg PWM rectifier, the ripple of the DC-link voltage is derived. A composite control method with a ripple filter is then proposed to effectively improve the performance of the rectifier. To meet the process demand of copper-foil electrolysis, the virtual impedance-based current-sharing control method with load current full feedforward is proposed for n-parallel DC/DC converters. The roles of load current feedforward and virtual impedance are analyzed, and the current-sharing control model of the HSPS system is derived. Virtual impedance is used to adjust the current-sharing impedance without changing the equivalent output impedance, which can effectively reduce current-sharing errors. Finally, simulation and experimental results verify the structure and control method.

• Journal of Welding and Joining
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• v.16 no.5
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.509-513
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical properties using micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect precision mechanical property of micro/nano material and component.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.245-248
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• 2005

This paper is concerned with manufacturing technology of thin foil tensile specimen using CIP(Cold Isostatic Press) and measurement of precision mechanical property. This thin foil tensile specimen manufacturing technology is a method that can make a metal thin foil specimen for micro tensile testing. We can get a burr free micro metallic thin foil specimen using this technology. For testing mechanical property of this micro thin foil, we use a nano scale material testing machine that was developed by KITECH. In this paper, micro tensile specimens of nickel and copper thin foil are fabricated with CIP and precision mechanical properties of these materials could be measured. We will expect that precision mechanical property of micro/nano material and component. Micro and Nano mechanical property can be measured using this technology and mechanical property data base of micro/nano material and component can be constructed.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.193-195
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• 2006

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.256-260
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• 2009

This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the $30^{\circ}C$. However, a uniform surface, lower resistivity and high flexibility were obtained when a $50^{\circ}C$ electrolyte was used.