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Property and Surface Morphology of Copper Foil on the Various Temperature of Electrolyte  

Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Lee, Man-Hyung (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Park, Eun-Kwang (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Bae, Tea-Sung (Department of Dental Biomaterials and Institute of Oral Bioscience, School of Dentistry, Chonbuk National University)
Lee, Min-Ho (Department of Dental Biomaterials and Institute of Oral Bioscience, School of Dentistry, Chonbuk National University)
Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.4, 2009 , pp. 256-260 More about this Journal
Abstract
This study examined the effects of plated temperature on the surface morphology and property of an electrodeposited copper foil. The morphology, crystal structure and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity could be controlled using various temperature of electrolyte. Large particles were observed on the surface of the copper layer electroplated onto the $30^{\circ}C$. However, a uniform surface, lower resistivity and high flexibility were obtained when a $50^{\circ}C$ electrolyte was used.
Keywords
FCCL; temperature; flexibility; resistivity;
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