• Korean Journal of Materials Research
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• v.11 no.6
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• pp.527-532
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• 2001

Dry etching of copper film using $O_2$ plasma and H(hfac) has been investigated. A one-step process consisting of copper film oxidation with an $O_2$ plasma and the removal of surface copper oxide by the reaction with H(hfac) to form volatile Cu(hfac)$_2$ and $H_2O$ was carried but. The etching rate of Cu in the range from 50 to 700 /min was obtained depending on the substrate temperature, the H(hfac)/O$_2$ flow rate ratio, and the plasma power. The copper film etch rate increased with increasing RF power at the temperatures higher than 215$^{\circ}C$. The optimum H(hfac)/O$_2$ flow rate ratio was 1:1, suggesting that the oxidation process and the reaction with H(hfac) should be in balance. Cu patterning using a Ti mask was performed at a flow rate ratio of 1:1 on 25$0^{\circ}C$\ulcorner and an isotropic etching profile with a taper slope of 30$^{\circ}$was obtained. Cu dry patterning with a tapered angle which is necessary for the advanced high resolution large area thin film transistor liquid-crystal displays was thus successfully obtained from one step process by manipulating the substrate temperature, RF power, and flow rate ratio.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.435-438
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• 2004

MOCVD is one of the major deposition techniques for Cu thin films and Ta-Si-N is one of promising barrier metal candidates for Cu with high thermal stability. Effects of hydrogen plasma pretreatment of the underlying Ta-Si-N film surface on the Cu nucleation in Cu MOCVD were investigated using scanning electron microscopy, X-ray photoelectron spectroscopy and Auger electron emission spectrometry analyses. Cu nucleation in MOCVD is enhanced as the rf-power and the plasma exposure time are increased in the hydrogen plasma pretreatment. The optimal plasma treatment process condition is the rf-power of 40 Wand the plasma exposure time of 2 min. The hydrogen gas flow rate in the hydrogen plasma pretreatment process does not affect Cu nucleation much. The mechanism through which Cu nucleation is enhanced by the hydrogen plasma pretreatment of the Ta-Si-N film surface is that the nitrogen and oxygen atoms at the Ta-Si-N film surface are effectively removed by the plasma treatment. Consequently the chemical composition was changed from Ta-Si-N(O) into Ta-Si at the Ta-Si-N film surface, which is favorable for Cu nucleation.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.1-6
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• 2014

The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variation of inorganic additive. $NH_4OH$ and $NH_4NO_3$ were used as inorganic additives. The copper layer characteristics - tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and Universal Test Machine. The presence of ammonium nitrate results in reduction of average roughness value from $0.08{\mu}m$ to $0.03{\mu}m$. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodeposit copper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when adding ammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111), (200) and (220) - and crystallite size (2~30 nm).

• Journal of Powder Materials
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• v.9 no.4
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• pp.227-234
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• 2002

For the austenitic stainless steel (304L) manufactured by metal injection molding(MIM), the effects of copper content and sintering temperature on the mechanical properties, antibacterial activities, corrosion resistance, and electric resistances were investigated. The specimens were prepared by injection molding of the premixed powders of water-atomized 304 L and Cu with poly-acetyl binders. The green compacts were prepared with various copper contents from 0 to 10 wt.% Cu, which were debound thermally at 873 K for 7.2 ks in $N_2$gas atmosphere and subsequently sintered at various temperatures from 1323 K to 1623 K for 7.2 ks in Ar gas atmosphere. The relative density and tensile strength of the sintered compacts showed the minimum values at 5 and 8 wt.% Cu, respectively. Both the relative density and the tensile strength of the specimen with 10 wt.% Cu sintered at 1373 K showed the highest values, higher than those of copper-free specimen. Antibacterial activities investigated by the plastic film contact printing method for bacilli and the quantitative analysis of copper ion dissolved in water increased as the increase of the copper content to stainless steels. It was also verified by the measurement of pitting potential that the copper addition in 304 L could improve the corrosion resistance. Furthermore the electric conductivity increased with the increase of copper content.

• Tribology and Lubricants
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• v.36 no.4
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• pp.207-214
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• 2020

In this study, we investigated the effects of copper and copper-alloy on the frictional and wear properties of low-steel friction material. The proportions of copper and copper-alloy in the brake friction materials used in passenger cars are very high (approximately 5-20% weight), and these materials have significant effects on friction and wear characteristics. In this study, the effects of cupric ingredients, such as the copper fiber and brass fiber, are investigated using the friction materials based on commercial formulations. After the copper and brass fibers from the same formulation were removed, the frictional and wear characteristics were evaluated to determine the influence of the copper and copper-alloy. We evaluated the frictional and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The results show that the friction material containing copper and brass fibers have excellent frictional stability and a low wear rate compared to the friction material that does not contain copper and brass fibers. These results are attributed to the excellent ductility, moderate melting point, high strength, and excellent thermal conductivity of copper and copper-alloy. We analyzed the surfaces of the friction materials before and after the performing the friction tests using a scanning electron microscope-energy dispersive X-ray spectroscope, confocal microscope, and roughness tester to verify the frictional behavior of copper and copper-alloy. In future studies, it will be applied to the development of copper-free friction materials based on the results of this study.

• Applied Chemistry for Engineering
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• v.33 no.6
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• pp.574-580
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• 2022

While in the process of electroless plating of dendrite-shape copper with silver, various silver-coated copper (Ag@Cu) particles were prepared by using both displacement plating and reducing electroless plating. The physicochemical properties of Ag@Cu particles were analyzed by scanning electron microscope- energy-dispersive X-ray spectroscopy (SEM-EDS), thermogravimetric analysis (TGA), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and Brunauer-Emmett-Teller analysis (BET), and it was confirmed that the silver coated by the reducing electroless plating was formed as nano-particles on the copper surface. Ag@Cu particles were compounded with an epoxy resin to prepare a conductive film, and its thermal stability was evaluated. We investigated the effect of the difference between the displacement plating and reducing electroless plating on the initial resistance and thermal stability of conductive films.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.5
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• pp.275-281
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• 2009

The microstructure of copper films prepared by a sputtering apparatus, which was fabricated to enhance the shadowing effect, was investigated by scanning electron microscopy. Black copper films were deposited on copper wires at an Ar pressure of 10 Pa. The black films had an extremely porous structure composed of separated columns. This structure is quite similar to that of black titanium films prepared by cylindrical magnetron sputtering. These results suggest that the porous structure composed of separated columns is easily formed for metal films by enhancing the shadowing effect.

• Transactions of Materials Processing
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• v.19 no.3
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• pp.179-184
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• 2010

The present study is focused on the deep drawability and product qualities of ultra thin beryllium copper sheet metal. The goal of this research is to investigate the limit drawing ratio in deep drawing of ultra thin beryllium copper metal. For the experiment, beryllium copper(C1720, $50{\mu}m$ in thickness) is used. Tensile test are also carried out to find out the material properties. Deep drawing experiments are carried out in Universal Testing Machine(UTM) to obtain limit drawing ratio. Deep drawing tests are carried out for various specimen sizes. Teflon film is used as a lubricant and constant blank holding force is imposed. Sheet thickness and surface hardness are measured along radial direction after deep drawing. Thickness is measured using optical microscope. For beryllium copper(C1720), the maximum LDR of 2.4 is obtained when the die shoulder radius is 20 or 30 times of sheet thickness.

• KSTLE International Journal
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• v.2 no.1
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• pp.22-28
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• 2001

A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.