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A Study on the Microstructure of Sputtered Copper Thin Films Deposited by using Shadow Effect  

Bae, Chang-Hwan (Dept. of Mechatronics Eng., Graduate School of M. T. &M., Hosea University)
Lee, Ju-Hee (Dept. of Mechatronics Eng., Graduate School of M. T. &M., Hosea University)
Han, Chang-Suk (Dept. of Defense Science & Technology, Hosea University)
Publication Information
Journal of the Korean Society for Heat Treatment / v.22, no.5, 2009 , pp. 275-281 More about this Journal
Abstract
The microstructure of copper films prepared by a sputtering apparatus, which was fabricated to enhance the shadowing effect, was investigated by scanning electron microscopy. Black copper films were deposited on copper wires at an Ar pressure of 10 Pa. The black films had an extremely porous structure composed of separated columns. This structure is quite similar to that of black titanium films prepared by cylindrical magnetron sputtering. These results suggest that the porous structure composed of separated columns is easily formed for metal films by enhancing the shadowing effect.
Keywords
copper film; shadowing effect; porous structure; cylindrical magnetron sputtering;
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1 K. H. Schoenbach, F. E. Peterkin and R. Verhappen : Plasma Science, IEEE Inter. Conf., (1995) 186   DOI
2 K. A. Bertness, A. Roshko and N. A. Sanford : Physica Status Solidi. PSS. C, Conferences and Critical Reviews, 2 (2005) 2369   DOI   ScienceOn
3 L. Bardos : Surface & Coatings Tech., 86/87 (1996) 648   DOI   ScienceOn
4 J. Banaszek and J. Browne : Mater. Trans., 46 (2005) 1378   DOI   ScienceOn
5 H. Koch and H. J. Eichler : J. Appl. Phys., 54 (1983) 4939   DOI   ScienceOn
6 C. H. Bae, J. H. Lee and C. S. Han : J. Kor. Soc. Heat Treat., 22 (2009) 143
7 C. P. Liu, J. J. Chang and S. W. Chen : Appl. phys., A, Materials Science & Processing, 80 (2005) 1601   DOI   ScienceOn
8 D. D. Wang and T. Oki : J. Vac. Sci. Tech., A8(4) (1990) 3163   DOI
9 K. H. Schoenbach, T. Tessnow and R. Verhappen : Plasma Science, IEEE Inter. Conf., (1996) 229   DOI