그림자효과를 이용하여 증착한 구리박막의 구조에 관한 연구

A Study on the Microstructure of Sputtered Copper Thin Films Deposited by using Shadow Effect

  • 배창환 (호서대학교 혁신기술경영융합대학원 메카트로닉스공학과) ;
  • 이주희 (호서대학교 혁신기술경영융합대학원 메카트로닉스공학과) ;
  • 한창석 (호서대학교 국방과학기술학과)
  • Bae, Chang-Hwan (Dept. of Mechatronics Eng., Graduate School of M. T. &M., Hosea University) ;
  • Lee, Ju-Hee (Dept. of Mechatronics Eng., Graduate School of M. T. &M., Hosea University) ;
  • Han, Chang-Suk (Dept. of Defense Science & Technology, Hosea University)
  • 발행 : 2009.09.30

초록

The microstructure of copper films prepared by a sputtering apparatus, which was fabricated to enhance the shadowing effect, was investigated by scanning electron microscopy. Black copper films were deposited on copper wires at an Ar pressure of 10 Pa. The black films had an extremely porous structure composed of separated columns. This structure is quite similar to that of black titanium films prepared by cylindrical magnetron sputtering. These results suggest that the porous structure composed of separated columns is easily formed for metal films by enhancing the shadowing effect.

키워드

참고문헌

  1. C. H. Bae, J. H. Lee and C. S. Han : J. Kor. Soc. Heat Treat., 22 (2009) 143
  2. L. Bardos : Surface & Coatings Tech., 86/87 (1996) 648 https://doi.org/10.1016/S0257-8972(96)03056-3
  3. H. Koch and H. J. Eichler : J. Appl. Phys., 54 (1983) 4939 https://doi.org/10.1063/1.332760
  4. K. H. Schoenbach, T. Tessnow and R. Verhappen : Plasma Science, IEEE Inter. Conf., (1996) 229 https://doi.org/10.1109/PLASMA.1996.551434
  5. K. H. Schoenbach, F. E. Peterkin and R. Verhappen : Plasma Science, IEEE Inter. Conf., (1995) 186 https://doi.org/10.1109/PLASMA.1995.531685
  6. J. Banaszek and J. Browne : Mater. Trans., 46 (2005) 1378 https://doi.org/10.2320/matertrans.46.1378
  7. K. A. Bertness, A. Roshko and N. A. Sanford : Physica Status Solidi. PSS. C, Conferences and Critical Reviews, 2 (2005) 2369 https://doi.org/10.1002/pssc.200461523
  8. C. P. Liu, J. J. Chang and S. W. Chen : Appl. phys., A, Materials Science & Processing, 80 (2005) 1601 https://doi.org/10.1007/s00339-004-3183-z
  9. D. D. Wang and T. Oki : J. Vac. Sci. Tech., A8(4) (1990) 3163 https://doi.org/10.1116/1.576601