• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Journal of Digital Contents Society
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• v.15 no.4
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• pp.513-520
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• 2014

The Smart Grid is next-generation power system materialized Convergence and Integration of power technologies and Information Technologies. And this system is the next generation power system optimizing energy efficiency via real-time information exchanges grafting the information technologies upon present power networks which are web-net. The introduction of smart grid can be embodied for latitude, distributed and cooperated network by inter-active exchange of energy information between electrical power provider and consumer previous uni-directional electrical power supplement. Therefore in this paper, we proposed Convergence technologies - Smart power grid, Smart Place, Smart Renewable and Smart Electricity Service - to make smart-grid succeed via analyzing the datum. And we scoped on Convergence and Integration technologies, which could be used for smart-power-grid that is most important factor to replace previous power industries. And we brought out the expecting industrialize timing and interesting aspects and analyzed the result with survey of professional worker from institute, research center, power plant and business of power industries. And proposed the essential policies for the government and power-control-business companies based on the datum and survey output.

• Transactions on Electrical and Electronic Materials
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• v.11 no.6
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• pp.243-248
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• 2010

The emergence of different and disparate materials together with the convergence of both the 'old' and 'emerging' technologies is paving the way for integration of heterogeneous technologies that are likely to extend the limitations of silicon technology beyond the roadmap envisaged for complementary metal-oxide semiconductor. Formulation of new information processing concepts based on novel aspects of nano-scale based materials is the catalyst for new nanoarchitectures driven by a different perspective in realization of novel logic devices. The memory technology has been the pace setter for silicon scaling and thus far has pave the way for new architectures. This paper provides an overview of the inevitability of heterogeneous integration of technologies that are in their infancy through initiatives of material physicists, computational chemists, and bioengineers and explores the options in the spectrum of novel non-volatile memory technologies considered as forerunner of new logic devices.

• Journal of the Korean Society of Industry Convergence
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• v.22 no.2
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• pp.201-208
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• 2019

Since the introduction of the open innovation at the beginning of the 2000s, various studies have been carried out on the convergence of technologies, such as the development of new technologies and the development of the business domain. while exploring the technologies necessary for the convergence of appropriate technologies in this research, we propose a discovery process of challengeable research areas by means of the integration of heterogeneous fields which are based on the strategic formulation of ICT and chemical safety industry. In this paper, we consequently propose the 103 detailed convergent technologies based on ICT, especially including artificial intelligent technology and smart big-data platform architecture, were derived from the research areas of the chemical safety field, We expect that research related to the safety field will be frustrated in the future.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.11
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• pp.7902-7909
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• 2015

The needs for smart city management technology has been increased for efficiently managing huge and complex social infrastructures. Thus, this research introduces smart bridge facility management system based on sensor and BIM technologies so that the inadequacy of current facility maintenance system and the limitations of data objectivity, consistency and expandability can be improved. For which, current trends on sensor and BIM technologies and standard information system were investigated to derive system develop requirements, and a scenario was suggested to discuss how to utilize the suggested system. Research outcomes are expected to be utilized as a preliminary research for developing the real application framework for bridge facility management.

• Electronics and Telecommunications Trends
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• v.34 no.5
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• pp.14-25
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• 2019

As the Internet of Things, artificial intelligence and big data have received a lot of attention as key growth engines in the era of the fourth industrial revolution, data acquisition and utilization in mobile, automotive, robotics, manufacturing, agriculture, health care and national defense are becoming more important. Due to numerous data-based industrial changes, demand for sensor technologies is exploding, especially for intelligent sensor technologies that combine control, judgement, storage and communication functions with the sensors's own functions. Intelligent sensor technology can be defined as a convergence component technology that combines intelligent sensor units, intelligent algorithms, modules with signal processing circuits, and integrated plaform technologies. Intelligent sensor technology, which can be applied to variety of smart IT convergence services such as smart devices, smart homes, smart cars, smart factory, smart cities, and others, is evolving towards intelligent and convergence technologies that produce new high-value information through recognition, reasoning, and judgement based on artificial intelligence. As a result, development of intelligent sensor units is accelerating with strategies for miniaturization, low-power consumption and convergence, new form factor such as flexible and stretchable form, and integration of high-resolution sensor arrays. In the future, these intelligent sensor technologies will lead explosive sensor industries in the era of data-based artificial intelligence and will greatly contribute to enhancing nation's competitiveness in the global sensor market. In this report, we analyze and summarize the recent trends in intelligent sensor technologies, especially those for four core technologies.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.34 no.6
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• pp.559-568
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• 2016

For the economic management of photovoltaic power plants, it is necessary to regularly monitor the panels within the plants to detect malfunctions. Thermal infrared image cameras are generally used for monitoring, since malfunctioning panels emit higher temperatures compared to those that are functioning. Recently, technologies that observe photovoltaic arrays by mounting thermal infrared cameras on UAVs (Unmanned Aerial Vehicle) are being developed for the efficient monitoring of large-scale photovoltaic power plants. However, the technologies developed until now have had the shortcomings of having to analyze the images manually to detect malfunctioning panels, which is time-consuming. In this paper, we propose an automatic photovoltaic panel area extraction algorithm for thermal infrared images acquired via a UAV. In the thermal infrared images, panel boundaries are presented as obvious linear features, and the panels are regularly arranged. Therefore, we exaggerate the linear features with a vertical and horizontal filtering algorithm, and apply a modified hierarchical histogram clustering method to extract candidates of panel boundaries. Among the candidates, initial panel areas are extracted by exclusion editing with the results of the photovoltaic array area detection. In this step, thresholding and image morphological algorithms are applied. Finally, panel areas are refined with the geometry of the surrounding panels. The accuracy of the results is evaluated quantitatively by manually digitized data, and a mean completeness of 95.0%, a mean correctness of 96.9%, and mean quality of 92.1 percent are obtained with the proposed algorithm.

• Journal of Digital Convergence
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• v.9 no.5
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• pp.89-98
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• 2011

IT has contributed much to Korea's economic growth and has helped the innovation of social paradigm. It helps the improvement of productivity, efficiency, convenience and communication, and also helps the critical changes of life style. IT convergence with other technologies or industries has appeared and it promotes new changes and innovations. It is the convergence of IT advancement and other areas of technology development, and it promotes and creates new industries. In major countries, including Korea, the resources and capabilities has focused selectively into this new industry. In this paper, we try to study IT integration strategy and technology development trends and to evaluate the level of IT integration capabilities in Korea based on experts survey results. In the conclusion, we suggest some Strategic Recommendations for developing and leading the new IT Convergence industries.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.23 no.12
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• pp.1710-1719
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• 2019

This study is intended to understand defense technologies that require the convergence of various technologies and the integration of systems, and to propose valuation methods that reflect the characteristics of each field. The measure of technology level, integration (system integration technology) between technologies, preparation of manufacturing, and maturity scale of the weapons system to be valued are measured according to the items of measurement factors to verify system performance, and to present a framework for estimating the quantitative values of core technologies using system maturity. Considering the characteristics of each technology field, the research suggests a proper valuation method. In evaluating the value of defense technologies, A proposal is made to evaluate the value of defense technology by competent technical experts in each field, using SRL, which can be evaluated according to the evaluation criteria reflecting the technical characteristics of each field, and to evaluate the completion of the entire system in quantitative terms.