• Carbon letters
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• v.11 no.1
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• pp.38-40
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• 2010

Carbon supported electrocatalysts are commonly used as electrode materials for polymer electrolyte membrane fuel cells(PEMFCs). These kinds of electrocatalysts provide large surface area and sufficient electrical conductivity. The support of typical PEM fuel cell catalysts has been a traditional conductive type of carbon black. However, even though the carbon particles conduct electrons, there is still significant portion of Pt that is isolated from the external circuit and the PEM, resulting in a low Pt utilization. Herein, new types of carbon materials to effectively utilize the Pt catalyst are being evaluated. Carbon nanofiber/activated carbon fiber (CNF/ACF) composite with multifunctional surfaces were prepared through catalytic growth of CNFs on ACFs. Nickel nitrate was used as a precursor of the catalyst to synthesize carbon nanofibers(CNFs). CNFs were synthesized by pyrolysising $CH_4$ using catalysts dispersed in acetone and ACF(activated carbon fiber). The as-prepared samples were characterized with transmission electron microscopy(TEM), scanning electron microscopy(SEM). In TEM image, carbon nanofibers were synthesized on the ACF to form a three-dimensional network. Pt/CNF/ACF was employed as a catalyst for PEMFC. As the ratio of prepared catalyst to commercial catalyst was changed from 0 to 50%, the performance of the mixture of 30 wt% of Pt/CNF/ACF and 70wt% of Pt/C commercial catalyst showed better perfromance than that of 100% commercial catalyst. The unique structure of CNF can supply the significant site for the stabilization of Pt particles. CNF/ACF is expected to be promising support to improve the performance in PEMFC.

• Journal of Adhesion and Interface
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• v.15 no.4
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• pp.169-173
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• 2014

The effect of filler sizes on the thermal diffusivity of Nylon 66/SiC composites was investigated. By loading 60 vol% of SiC fillers on Nylon 66, the thermal diffusivity of the composites increased more than 10 times than that of unfilled Nylon 66 and the thermal diffusivity of composites with filler sizes of $24{\mu}m$ and $76{\mu}m$ increased to $2.2{\times}10^{-2}cm^2/sec$ and $1.75{\times}10^{-2}cm^2/sec$, respectively. It is speculated that the smaller filler size ($24{\mu}m$) of SiC is more favorable for the formation of thermal conductive path that the larger size ($76{\mu}m$) of filler composites. The thermal diffusivity of Nylon 46/SiC 400 (60 vol%) composites was $1.61{\times}10^{-2}cm^2/sec$ that was lower than that of Nylon 66/SiC (60 vol%) composites.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1938-1940
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• 2003

본 연구는 요소 센서 제작을 위한 과정으로서, 전기화학적 방법을 이용한 다공질 실리콘 구조 형성과, PDV(Physical Vapor Deposition) 법에 의한 백금 박막 코팅 및 전기화학적 전도성 고분자 코팅과 urease 고정화 단계를 고찰하고 감도 특성을 제시 하였다. 전극 기질로서 B을 도우핑한 p-type 실리콘웨이퍼를 사용하였고, HF:$C_2H_5OH:H_2O$=1:2:1의 부피비를 갖는 에칭 용액에서 5분간 -7 $mA/cm^2$의 일정 전류를 가하여 폭 2 ${\mu}m$, 깊이 10 ${\mu}m$의 다공질 실리콘(PS) 충을 형성하였다. 그 위에 200 ${\AA}$의 Ti 층을 underlayer로서 증착하고, 2000 ${\AA}$의 Pt를 중착하여 PS/Pt 박막 전극을 제작하고, 전도성 고분자로서 polypyrrole (PPy), 또는 poly(3-mehylthiophene) (P3MT)을 전기화학적으로 코팅한 후, urease(EC 3.5.1.5, type III, Jack Bean, Sigma)를 고정화 하였다. 고정화 시 전해질 수용액의 pH는 7.4로 하여 urease표면이 음전하를 갖도록 하고, 전극에 0.6 V (vs. SCE(Saturated Calomel Electrode))의 일정 전압을 가함으로써 urease가 전도성 고분자 표면에 전기적으로 흡착되도록 하였다. 이상의 방법으로 제작한 요소 센서의 감도는 PPy와 P3MT를 전자 전달 매질로 사용한 경우, 각각 8.44 ${\mu}A/mM{\cdot}cm^2$와 1.55 ${\mu}A/mM{\cdot}cm^2$의 감도를 보였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.12
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• pp.1465-1471
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• 2013

The electrical and mechanical properties of room temperature vulcanized (RTV) silicone rubber composites are investigated as functions of multi-walled carbon nanotube (CNT), carbon black (CB), and thinner content. The thinner is used to improve the CNT and CB dispersion in the matrix. The electrical and mechanical properties of the composite with CNT are improved when compared to the composite with CB at the same content. As the thinner content is 80 phr, the electric resistance of the composite decreases significantly with the CNT content and shows contact point saturation of CNT at 2.5 phr. As the thinner content increases, the dispersion of conductive particles improves; however, the critical CB content increases because of the reduction in the CB weight ratio. It is believed that an electrode that needs good flexibility and excellent electrical properties can be manufactured when the amount of CNT and CB are increased with the thinner content.

• Applied Chemistry for Engineering
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• v.23 no.2
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• pp.157-163
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• 2012

Using six kinds of epoxy acrylates and a conductive carbon black, photosensitive resistor pastes were fabricated and then their developability in alkaline aqueous solution and the resistance values after thermal curing were evaluated. In order to impart the photocurability by UV exposure and the developability on alkaline solution, epoxy acrylate oligomers with carboxyl group, acrylate monomers, a photoinitiator and so forth were used. In addition, an organic peroxide was added into the paste to get a thermally curable composition. As a result, some of the pastes were not developed depending on the kinds of oligomers and, in the developed pastes, the measured resistance showed the different values depending on their compositions, even though they contain the same amount of carbon black. Finally, the optimum oligomer was selected and then, by adjusting the amount of carbon black, the kind of monomer and the curing temperature, the photosensitive resistor paste composition which showed the sheet resistance of about 0.5 $k{\Omega}/sq.$ could be obtained.

• Journal of Powder Materials
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• v.26 no.5
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• pp.395-404
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• 2019

Aluminum nitride (AlN) has excellent electrical insulation property, high thermal conductivity, and a low thermal expansion coefficient; therefore, it is widely used as a heat sink, heat-conductive filler, and heat dissipation substrate. However, it is well known that the AlN-based materials have disadvantages such as low sinterability and poor mechanical properties. In this study, the effects of addition of various amounts (1-6 wt.%) of sintering additives $Y_2O_3$ and $Sm_2O_3$ on the thermal and mechanical properties of AlN samples pressureless sintered at $1850^{\circ}C$ in an $N_2$ atmosphere for a holding time of 2 h are examined. All AlN samples exhibit relative densities of more than 97%. It showed that the higher thermal conductivity as the $Y_2O_3$ content increased than the $Sm_2O_3$ additive, whereas all AlN samples exhibited higher mechanical properties as $Sm_2O_3$ content increased. The formation of secondary phases by reaction of $Y_2O_3$, $Sm_2O_3$ with oxygen from AlN lattice influenced the thermal and mechanical properties of AlN samples due to the reaction of the oxygen contents in AlN lattice.

• Structural Engineering and Mechanics
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• v.77 no.2
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• pp.167-177
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• 2021

Due to various benefits such as unlimited degrees of freedom, environment adaptability, and safety for humans, engineers have used soft materials with hyperelastic behavior in various industrial, medical, rescue, and other sectors. One of the applications of these materials in the fabrication of bending soft actuators (SA) is that they have eliminated many problems in the actuators such as production cost, mechanical complexity, and design algorithm. However, SA has complexities, such as predicting and monitoring behavior despite the many benefits. The first part of this paper deals with the prediction of SA behavior through mathematical models such as Ogden and Darijani, and its comparison with the results of experiments. At first, by examining different geometric models, the cubic structure was selected as the optimal structure in the investigated models. This geometrical structure at the same pressure showed the most significant bending in the simulation. The simulation results were then compared with experimental, and the final gripper model was designed and manufactured using a 3D printer with silicone rubber as for the polymer part. This geometrical structure is capable of bending up to a 90-degree angle at 70 kPa in less than 2 seconds. The second section is dedicated to monitoring the bending behavior created by the strain sensors with different sensitivity and stretchability. In the fabrication of the sensors, silicon is used as a soft material with hyperelastic behavior and carbon fiber as a conductive material in the soft material substrate. The SA designed in this paper is capable of deforming up to 1000 cycles without changing its characteristics and capable of moving objects weigh up to 1200 g. This SA has the capability of being used in soft robots and artificial hand making for high-speed objects harvesting.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.80-85
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• 2022

ZnO-based transparent conductive films have been widely studied to achieve high performance optoelectronic devices such as next generation flexible and transparent display systems. In order to achieve a transparent flexible ZnO-based device, a low temperature growth technique using a flexible polymer substrate is required. In this work, high quality flexible ZnO films were grown on colorless polyimide substrate using atomic layer deposition (ALD). Transparent ZnO films grown from 80 to 200℃ were fabricated with a metal-semiconductor-metal structure photodetectors (PDs). As the growth temperature of ZnO film increases, the photocurrent of UV PDs increases, while the sensitivity of that decreases. In addition, it is found that the response times of the PDs become shorter as the growth temperature increases. Based on these results, we suggest that high-quality ZnO film can be grown below 200℃ in an atomic layer deposition system, and can be applied to transparent and flexible UV PDs with very fast response time and high photocurrent.