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http://dx.doi.org/10.17702/jai.2014.15.4.169

Effect of Filler Size on the Thermal Diffusivity of Nylon 66/SiC Composites  

Kim, Sung-Ryong (Department of Polymer Science and Engineering, Korea National University of Transportation)
Publication Information
Journal of Adhesion and Interface / v.15, no.4, 2014 , pp. 169-173 More about this Journal
Abstract
The effect of filler sizes on the thermal diffusivity of Nylon 66/SiC composites was investigated. By loading 60 vol% of SiC fillers on Nylon 66, the thermal diffusivity of the composites increased more than 10 times than that of unfilled Nylon 66 and the thermal diffusivity of composites with filler sizes of $24{\mu}m$ and $76{\mu}m$ increased to $2.2{\times}10^{-2}cm^2/sec$ and $1.75{\times}10^{-2}cm^2/sec$, respectively. It is speculated that the smaller filler size ($24{\mu}m$) of SiC is more favorable for the formation of thermal conductive path that the larger size ($76{\mu}m$) of filler composites. The thermal diffusivity of Nylon 46/SiC 400 (60 vol%) composites was $1.61{\times}10^{-2}cm^2/sec$ that was lower than that of Nylon 66/SiC (60 vol%) composites.
Keywords
SiC; Nylon 66; thermal diffusivity; interface;
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