• 제목/요약/키워드: Conductive Polymer

검색결과 401건 처리시간 0.022초

Silane Coupling제로 표면 처리된 ATO 나노입자를 이용하여 제조된 대전방지 ATO/EPOXY 복합체의 코팅 물성 (Properties of Static Dissipative Epoxy Composites Loaded with Silane Coupled-ATO Nanoparticles)

  • 유요한;김태영;김종은;서광석
    • 한국전기전자재료학회논문지
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    • 제21권4호
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    • pp.388-394
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    • 2008
  • For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.

Preparation of Pt Catalysts Supported on ACF with CNF via Catalytic Growth

  • Park, Sang-Sun;Rhee, Jun-Ki;Jeon, Yu-Kwon;Choi, Sung-Won;Shul, Yong-Gun
    • Carbon letters
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    • 제11권1호
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    • pp.38-40
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    • 2010
  • Carbon supported electrocatalysts are commonly used as electrode materials for polymer electrolyte membrane fuel cells(PEMFCs). These kinds of electrocatalysts provide large surface area and sufficient electrical conductivity. The support of typical PEM fuel cell catalysts has been a traditional conductive type of carbon black. However, even though the carbon particles conduct electrons, there is still significant portion of Pt that is isolated from the external circuit and the PEM, resulting in a low Pt utilization. Herein, new types of carbon materials to effectively utilize the Pt catalyst are being evaluated. Carbon nanofiber/activated carbon fiber (CNF/ACF) composite with multifunctional surfaces were prepared through catalytic growth of CNFs on ACFs. Nickel nitrate was used as a precursor of the catalyst to synthesize carbon nanofibers(CNFs). CNFs were synthesized by pyrolysising $CH_4$ using catalysts dispersed in acetone and ACF(activated carbon fiber). The as-prepared samples were characterized with transmission electron microscopy(TEM), scanning electron microscopy(SEM). In TEM image, carbon nanofibers were synthesized on the ACF to form a three-dimensional network. Pt/CNF/ACF was employed as a catalyst for PEMFC. As the ratio of prepared catalyst to commercial catalyst was changed from 0 to 50%, the performance of the mixture of 30 wt% of Pt/CNF/ACF and 70wt% of Pt/C commercial catalyst showed better perfromance than that of 100% commercial catalyst. The unique structure of CNF can supply the significant site for the stabilization of Pt particles. CNF/ACF is expected to be promising support to improve the performance in PEMFC.

필러 크기가 Nylon 66/SiC 복합재료의 열확산도에 미치는 영향 (Effect of Filler Size on the Thermal Diffusivity of Nylon 66/SiC Composites)

  • 김성룡
    • 접착 및 계면
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    • 제15권4호
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    • pp.169-173
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    • 2014
  • 크기가 다른 2가지 SiC 필러를 Nylon 66에 충전하여 용융혼련 시켜 복합재료를 제조하고 필러 크기가 열확산도에 미치는 영향을 고찰하였다. 필러를 충전하지 않은 경우에 비하여 60 vol%의 SiC 필러를 함유한 경우에 복합재료의 열확산도가 10배 이상 증가함을 확인하였고, SiC 필러의 평균크기가 $24{\mu}m$인 고분자복합재료의 열확산도가 $2.2{\times}10^{-2}cm^2/sec$였으나 필러크기가 76{\mu}m$인 경우에는 $1.75{\times}10^{-2}cm^2/sec$로 20% 감소하였다. 필러의 크기가 $24{\mu}m$인 경우에 열전도성 필러와 Nylon 66 매트릭스의 계면 접촉과 필러와 필러 사이의 접촉을 용이하게 하여 포논이 효과적으로 전달되는 것으로 보인다. Nylon 66보다 상대적으로 강직한 구조와 높은 가공온도를 가지는 Nylon 46를 매트릭스로 사용한 Nylon 46/SiC 400 (60 vol%) 복합재료의 열확산도는 $1.61{\times}10^{-2}cm^2/sec$였다.

A Low- Viscousity, Highly Thermally Conductive Epoxy Molding Compound (EMC)

  • Bae, Jong-Woo;Kim, Won-Ho;Hwang, Seung-Chul;Choe, Young-Sun;Lee, Sang-Hyun
    • Macromolecular Research
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    • 제12권1호
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    • pp.78-84
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    • 2004
  • Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90%, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

전기화학적 방법을 이용한 다공질 실리콘 구조 형성, 전도성 고분자코팅, 및 urease 고정화와 감도 특성 (Electrochemical methodologies for fabrication of urea-sensitive electrodes composed of porous silicon layer and urease-immobilized conductive polymer film)

  • 진준형;강문식;송민정;민남기;홍석인
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 하계학술대회 논문집 C
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    • pp.1938-1940
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    • 2003
  • 본 연구는 요소 센서 제작을 위한 과정으로서, 전기화학적 방법을 이용한 다공질 실리콘 구조 형성과, PDV(Physical Vapor Deposition) 법에 의한 백금 박막 코팅 및 전기화학적 전도성 고분자 코팅과 urease 고정화 단계를 고찰하고 감도 특성을 제시 하였다. 전극 기질로서 B을 도우핑한 p-type 실리콘웨이퍼를 사용하였고, HF:$C_2H_5OH:H_2O$=1:2:1의 부피비를 갖는 에칭 용액에서 5분간 -7 $mA/cm^2$의 일정 전류를 가하여 폭 2 ${\mu}m$, 깊이 10 ${\mu}m$의 다공질 실리콘(PS) 충을 형성하였다. 그 위에 200 ${\AA}$의 Ti 층을 underlayer로서 증착하고, 2000 ${\AA}$의 Pt를 중착하여 PS/Pt 박막 전극을 제작하고, 전도성 고분자로서 polypyrrole (PPy), 또는 poly(3-mehylthiophene) (P3MT)을 전기화학적으로 코팅한 후, urease(EC 3.5.1.5, type III, Jack Bean, Sigma)를 고정화 하였다. 고정화 시 전해질 수용액의 pH는 7.4로 하여 urease표면이 음전하를 갖도록 하고, 전극에 0.6 V (vs. SCE(Saturated Calomel Electrode))의 일정 전압을 가함으로써 urease가 전도성 고분자 표면에 전기적으로 흡착되도록 하였다. 이상의 방법으로 제작한 요소 센서의 감도는 PPy와 P3MT를 전자 전달 매질로 사용한 경우, 각각 8.44 ${\mu}A/mM{\cdot}cm^2$와 1.55 ${\mu}A/mM{\cdot}cm^2$의 감도를 보였다.

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디지털 프린팅을 위한 전도성 배선에 관한 연구 (Investigation of Conductive Pattern Line for Direct Digital Printing)

  • 김용식;서상훈;이로운;김태훈;박재찬;김태구;정경진;윤관수;박성준;정재우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.502-502
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    • 2007
  • Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

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전기활성 고분자 전극용 탄소입자 강화고무의 전기적 및 기계적 특성 (Electrical and Mechanical Properties of Carbon Particle Reinforced Rubber for Electro-Active Polymer Electrode)

  • 이준만;류상렬;이동주
    • 대한기계학회논문집A
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    • 제37권12호
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    • pp.1465-1471
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    • 2013
  • 다중벽 탄소나노튜브 (CNT), 카본블랙 (CB) 그리고 희석제의 함유량에 따른 상온경화형 실리콘 고무복합재료의 전기적 및 기계적 특성에 대해 연구하였다. 기지 내에 CNT 및 CB의 분산을 향상시키기 위해서 희석제를 사용하였다. CNT 강화 복합재료의 전기적 및 기계적 특성은 같은 함유량의 CB이 강화된 복합재료에 비해 향상되었다. 희석제의 함유량이 80phr일 때, 복합재료의 전기저항은 CNT 함유량 증가에 따라 크게 감소하였고, CNT 2.5phr에서 접촉점 포화현상을 보였다. 희석제 함유량 증가에 따라 전도성 입자들의 분산은 향상되었지만, CB의 무게비 감소로 임계 CB 함유량은 증가하였다. 희석제의 함유량 증가로 많은 CNT와 CB의 혼합이 가능하므로 유연하면서 전기적 특성이 우수한 전극의 제작이 가능하다고 판단된다.

에폭시 아크릴레이트를 이용한 감광성 폴리머 저항 페이스트 조성 (Compositions for Photosensitive Polymer Resistor Paste Using Epoxy Acrylates)

  • 김동국;박성대;이규복;경진범
    • 공업화학
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    • 제23권2호
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    • pp.157-163
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    • 2012
  • 6종의 에폭시 아크릴레이트와 전도성 카본블랙을 이용하여 감광성 저항 페이스트를 제작하고, 그들의 알칼리 수용액에 대한 현상성과 열경화 후 저항값을 평가하였다. 자외선에 의한 광경화성 및 알칼리 용액에 대한 현상성을 부여하기 위해서 카르복시기를 가진 에폭시 아크릴레이트 올리고머, 아크릴레이트 모노머, 광개시제 등이 사용되었다. 또한 열경화성 조성물을 얻기 위하여 유기 과산화물을 페이스트에 첨가하였다. 실험 결과, 올리고머의 종류에 따라서 일부 페이스트들은 현상이 되지 않았으며, 현상된 페이스트 중, 측정된 저항값은 동일한 카본블랙 함량에서도 페이스트 조성에 따라 다른 값들을 나타내었다. 최종적으로 최적의 올리고머를 선정하고, 카본블랙의 함량과 모노머의 종류, 경화 온도를 조절함으로써 약 0.5 $k{\Omega}/sq.$의 면저항을 나타내는 감광성 저항 페이스트 조성물을 얻을 수 있었다.

상압소결 질화알루미늄의 소결 첨가제 변화에 따른 열적 및 기계적 특성 (Effects of Sintering Additives on the Thermal and Mechanical Properties of AlN by Pressureless Sintering)

  • 황진욱;문소윤;남상용;도환수
    • 한국분말재료학회지
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    • 제26권5호
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    • pp.395-404
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    • 2019
  • Aluminum nitride (AlN) has excellent electrical insulation property, high thermal conductivity, and a low thermal expansion coefficient; therefore, it is widely used as a heat sink, heat-conductive filler, and heat dissipation substrate. However, it is well known that the AlN-based materials have disadvantages such as low sinterability and poor mechanical properties. In this study, the effects of addition of various amounts (1-6 wt.%) of sintering additives $Y_2O_3$ and $Sm_2O_3$ on the thermal and mechanical properties of AlN samples pressureless sintered at $1850^{\circ}C$ in an $N_2$ atmosphere for a holding time of 2 h are examined. All AlN samples exhibit relative densities of more than 97%. It showed that the higher thermal conductivity as the $Y_2O_3$ content increased than the $Sm_2O_3$ additive, whereas all AlN samples exhibited higher mechanical properties as $Sm_2O_3$ content increased. The formation of secondary phases by reaction of $Y_2O_3$, $Sm_2O_3$ with oxygen from AlN lattice influenced the thermal and mechanical properties of AlN samples due to the reaction of the oxygen contents in AlN lattice.

Numerical and experimental investigation for monitoring and prediction of performance in the soft actuator

  • Azizkhani, Mohammadbagher;sangsefidi, Alireza;Kadkhodapour, Javad;Anaraki, Ali Pourkamali
    • Structural Engineering and Mechanics
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    • 제77권2호
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    • pp.167-177
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    • 2021
  • Due to various benefits such as unlimited degrees of freedom, environment adaptability, and safety for humans, engineers have used soft materials with hyperelastic behavior in various industrial, medical, rescue, and other sectors. One of the applications of these materials in the fabrication of bending soft actuators (SA) is that they have eliminated many problems in the actuators such as production cost, mechanical complexity, and design algorithm. However, SA has complexities, such as predicting and monitoring behavior despite the many benefits. The first part of this paper deals with the prediction of SA behavior through mathematical models such as Ogden and Darijani, and its comparison with the results of experiments. At first, by examining different geometric models, the cubic structure was selected as the optimal structure in the investigated models. This geometrical structure at the same pressure showed the most significant bending in the simulation. The simulation results were then compared with experimental, and the final gripper model was designed and manufactured using a 3D printer with silicone rubber as for the polymer part. This geometrical structure is capable of bending up to a 90-degree angle at 70 kPa in less than 2 seconds. The second section is dedicated to monitoring the bending behavior created by the strain sensors with different sensitivity and stretchability. In the fabrication of the sensors, silicon is used as a soft material with hyperelastic behavior and carbon fiber as a conductive material in the soft material substrate. The SA designed in this paper is capable of deforming up to 1000 cycles without changing its characteristics and capable of moving objects weigh up to 1200 g. This SA has the capability of being used in soft robots and artificial hand making for high-speed objects harvesting.