• 마이크로전자및패키징학회지
• /
• 제14권1호
• /
• pp.19-26
• /
• 2007

본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다.

• 전자공학회논문지 IE
• /
• 제48권3호
• /
• pp.1-9
• /
• 2011

본 연구는 submicrometer CMOS 인버터의 신호 전달 지연에 대한 모사로서 출력 전류 파형을 삼각형 모양으로 근사하고 두 개의 실험적 변수를 사용하여 구현 하였다. 본 모사의 결과는 HSPICE 결과와 매우 부합된 결과를 보인다. 모델의 시뮬레이션 결과 인버터 지연 값과 jitter의 최대 오류치는 각각 0.6%와 2.8% 이하의 결과를 보인다. 앞선 연구자들의 결과와 비교해 볼 때 본 연구의 모사는 작은 동작 전압에서 더 나은 결과를 보이는 특성을 가지고 있다. 이러한 모사의 결과를 실험적으로 증명하기 위해 인버터 체인을 제작 하였고 인버터 지연과 jitter 특성을 평가하였다. 제작된 시료의 결과는 새로운 모델과 매우 근사한 값을 보인다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제14권5호
• /
• pp.503-507
• /
• 2014

The on-state resistance ($R_{ON}$) instability of standard complementary metal-oxide-semiconductor (CMOS) antifuse cells has been observed for the first time by using acceleration factors: stress current and ambient temperature. If the program current is limited, the $R_{ON}$ increases as time passes during read operation.

• Transactions on Electrical and Electronic Materials
• /
• 제7권4호
• /
• pp.173-179
• /
• 2006

Due to the limitations of the channel length, the lateral spread for two-dimensional impurity distributions is critical for the analysis of devices including the integrated complementary metal oxide semiconductor (CMOS) circuits and high frequency semiconductor devices. The developed codes were then compared with the two-dimensional implanted profiles measured by transmission electron microscope (TEM) as well as simulated by a commercial TSUPREM4 for verification purposes. The measured two-dimensional TEM data obtained by chemical etching-method was consistent with the results of the developed analytical model, and it seemed to be more accurate than the results attained by a commercial TSUPREM4. The developed codes can be applied on a wider energy range $(1KeV{\sim}30MeV)$ than a commercial TSUPREM4 of which the maximum energy range cannot exceed 1MeV for the limited doping elements. Moreover, it is not only limited to diffusion process but also can be applied to implantation due to the sloped and nano scale structure of the mask.

• Transactions on Electrical and Electronic Materials
• /
• 제14권2호
• /
• pp.94-100
• /
• 2013

The elements B, P and As can each be implanted in silicon; for the fabrication of integrated semiconductor devices and the wells in CMOS (complementary metal oxide semiconductor). The implanted range due to different implanted species calculated using TRIM (Transport of Ions in Matter) simulation results was considered. The profiles of implanted samples could be measured using SIMS (secondary ion mass spectrometry). In the comparison between the measured and simulated data, some deviations were shown in the profiles of MeV implanted silicon. The Moliere, C-Kr, and ZBL potentials were used for the range calculations, and the results showed almost no change in the MeV energy region. However, the calculations showed remarkably improved results through the modification of the electronic stopping power. The results also matched very well with SIMS data. The calculated tolerances of $R_p$ and ${\Delta}R_p$ between the modified $S_e$ of TRIM and SIMS data were remarkably better than the tolerances between the TRIM and SIMS data.

• 한국정보통신학회논문지
• /
• 제7권2호
• /
• pp.269-275
• /
• 2003

저전압 프로그래밍이 가능한 플래시메모리를 실현하기 위하여 0.35$\mu\textrm{m}$ CMOS 공정 기술을 이용하여 터널링산화막, 질화막 그리고 블로킹산화막의 두께가 각각 2.4nm, 4.0nm, 2.5nm인 SONOS 트랜지스터를 제작하였으며, SONOS 메모리 셀의 면적은 1.32$\mu$$m^2$이었다. 질화막의 두께를 스케일링한 결과, 10V의 동작 전압에서 소거상태로부터 프로그램상태로, 반대로 프로그램상태에서 소거상태로 스위칭 하는데 50ms의 시간이 필요하였으며, 최대 메모리윈도우는 1.76V이었다. 그리고 질화막의 두께를 스케일링함에도 불구하고 10년 후에도 0.5V의 메모리 윈도우를 유지하였으며, 105회 이상의 프로그램/소거 반복동작이 가능함을 확인하였다. 마지막으로 부유게이트 소자에서 심각하게 발생하고있는 과도소거현상이 SONOS 소자에서는 나타나지 않았다.

• Transactions on Electrical and Electronic Materials
• /
• 제11권4호
• /
• pp.155-165
• /
• 2010

As a promising candidate to replace the conventional floating gate flash memories, polysilicon-oxide-nitride-oxidesilicon (SONOS)-type nonvolatile semiconductor memories have been investigated widely in the past several years. SONOS-type memories have some advantages over the conventional floating gate flash memories, such as lower operating voltage, excellent endurance and compatibility with standard complementary metal-oxide-semiconductor (CMOS) technology. However, their operating speed and date retention characteristics are still the bottlenecks to limit the applications of SONOS-type memories. Recently, various approaches have been used to make a trade-off between the operating speed and the date retention characteristics. Application of high-k dielectrics to SONOS-type memories is a predominant route. This article provides the state-of-the-art research progress of high-k dielectrics applicable to SONOS-type nonvolatile semiconductor memories. It begins with a short description of working mechanism of SONOS-type memories, and then deals with the materials' requirements of high-k dielectrics used for SONOS-type memories. In the following section, the microstructures of high-k dielectrics used as tunneling layers, charge trapping layers and blocking layers in SONOS-type memories, and their impacts on the memory behaviors are critically reviewed. The improvement of the memory characteristics by using multilayered structures, including multilayered tunneling layer or multilayered charge trapping layer are also discussed. Finally, this review is concluded with our perspectives towards the future researches on the high-k dielectrics applicable to SONOS-type nonvolatile semiconductor memories.

• 전기학회논문지
• /
• 제66권10호
• /
• pp.1494-1498
• /
• 2017

In this study, we investigate the influence of an overlap between the gate and source/drain regions of silicon nanowire (SiNW) CMOS (complementary metal-oxide-semiconductor) inverter on bendable plastic substrates and describe their electrical characteristics. The combination of n-channel silicon nanowire field-effect transistor (n-SiNWFET) and p-channel silicon nanowire field-effect transistor (p-SiNWFET) operates as an inverter logic gate. The gains with a drain voltage ($V_{dd}$) of 1 V are 3.07 and 1.21 for overlapped device and non-overlapped device, respectively. The superior electrical characteristics of each of the SiNW transistors including steep subthreshold slopes and the high $I_{on}/I_{off}$ ratios are major factors that enable the excellent operation of the logic gate.

• 센서학회지
• /
• 제23권2호
• /
• pp.87-93
• /
• 2014

In this paper, we propose a block-based low-power complementary metal oxide semiconductor (CMOS) image sensor (CIS) with a simple pixel structure for power efficiency. This method, which uses an additional computation circuit, makes it possible to reduce the power consumption of the pixel array. In addition, the computation circuit for a block-based CIS is very flexible for various types of pixel structures. The proposed CIS was designed and fabricated using a standard CMOS 0.18 ${\mu}m$ process, and the performance of the fabricated chip was evaluated. From a resultant image, the proposed block-based CIS can calculate a differing contrast in the block and control the operating voltage of the unit blocks. Finally, we confirmed that the power consumption in the proposed CIS with a simple pixel structure can be reduced.

• 센서학회지
• /
• 제24권2호
• /
• pp.79-82
• /
• 2015

This paper proposes a novel complementary metal oxide semiconductor (CMOS) active pixel sensor (APS) and presents its performance characteristics. The proposed APS exhibits a linear-logarithmic response, which is simulated using a standard $0.35-{\mu}m$ CMOS process. To maintain high sensitivity and improve the dynamic range (DR) of the proposed APS at low and high-intensity light, respectively, two additional nMOSFETs are integrated into the structure of the proposed APS, along with a photogate. The applied photogate voltage reduces the sensitivity of the proposed APS in the linear response regime. Thus, the conversion gain of the proposed APS changes from high to low owing to the addition of the capacitance of the photogate to that of the sensing node. Under high-intensity light, the integrated MOSFETs serve as voltage-light dependent active loads and are responsible for logarithmic compression. The DR of the proposed APS can be improved on the basis of the logarithmic response. Furthermore, the reference voltages enable the tuning of the sensitivity of the photodetector, as well as the DR of the APS.