• Title/Summary/Keyword: Communication Chip

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A Product of Power Chip Inductor for Slim Mobile Communication Set (휴대용 이동 통신기기의 슬림화를 위한 파워 칩 인덕터의 제품화)

  • Uhm, Jae-Hyun;Cho, Il-Jae;Seo, Jong-Go;Kim, Sung-Il;Kim, Du-Il;Park, Jun-Hyung
    • Proceedings of the KIEE Conference
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    • 2006.07b
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    • pp.891-892
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    • 2006
  • An obstacle is an element for power to small and slim the existing portable communication set. Developed Inductor for Chip-type electric power in needs to solve this. Stack applied Process, and used gap of a magnetic path, and made a height of an element to 1.0T or below, and this development commodity did product for saturation prevention to materials of silver. Saturation current characteristic of Chip-type inductor was low compare with winding-type inductors, but bulk against performance were had superior excellence. Chip-type inductor can raise performance per unit volume compared with the existing inductors at these papers. Therefore, acceleration can get growth of small and slim of a mobile product done, and expect.

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Novel Extraction Method for Unknown Chip PDN Using De-Embedding Technique (De-Embedding 기술을 이용한 IC 내부의 전원분배망 추출에 관한 연구)

  • Kim, Jongmin;Lee, In-Woo;Kim, Sungjun;Kim, So-Young;Nah, Wansoo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.6
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    • pp.633-643
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    • 2013
  • GDS format files, as well as layout of the chip are noticeably needed so as to analyze the PDN (Power Delivery Network) inside of IC; however, commercial IC in the market has not supported design information which is layout of IC. Within this, in terms of IC having on-chip PDN, characteristic of inside PDN of the chip is a core parameter to predict generated noise from power/ground planes. Consequently, there is a need to scrutinize extraction method for unknown PDN of the chip in this paper. To extract PDN of the chip without IC circuit information, the de-embedding test vehicle is fabricated based on IEC62014-3. Further more, the extracted inside PDN of chip from de-embedding technique adopts the Co-simulation model which composes PCB, QFN (Quad-FlatNo-leads) Package, and Chip for the PDN, applied Co-simulation model well corresponds with impedance from measured S-parameters up to 4 GHz at common measured and simulated points.

The Advanced SNR Performance analysis for DS-CDMA Communication System (DS-CDMA 통신시스템 기반에서의 새로운 SNR 성능평가)

  • Jeong, Ke-Hon;Kim, Sung-Soo
    • Proceedings of the KIEE Conference
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    • 2004.07d
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    • pp.2559-2561
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    • 2004
  • This paper proposes the new signal-to-noise ratio(SNR) that is different from the conventional signal-to-noise ratio (SNR) in direct-sequence code-division multiple-access communication system employing offset quadrature phase-shift keying(OQPSK) and using a chip waveform. The conventional SNR value is so different from a real SNR value. Therefore, we propose a new SNR equation approximated to real SNR. The multiple-access interference(MAI) in DS-CDMA communication system has an effect on SNR performance and MAI is concerned with the correlation functions of the chip waveform. For this reason, we considered all possible correlations of chip waveforms. In conclusion, the SNR value of proposed method is enclosed to the real SNR value.

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Multiple Network-on-Chip Model for High Performance Neural Network

  • Dong, Yiping;Li, Ce;Lin, Zhen;Watanabe, Takahiro
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.1
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    • pp.28-36
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    • 2010
  • Hardware implementation methods for Artificial Neural Network (ANN) have been researched for a long time to achieve high performance. We have proposed a Network on Chip (NoC) for ANN, and this architecture can reduce communication load and increase performance when an implemented ANN is small. In this paper, a multiple NoC models are proposed for ANN, which can implement both a small size ANN and a large size one. The simulation result shows that the proposed multiple NoC models can reduce communication load, increase system performance of connection-per-second (CPS), and reduce system running time compared with the existing hardware ANN. Furthermore, this architecture is reconfigurable and reparable. It can be used to implement different applications of ANN.

A Study On Design of ZigBee Chip Communication Module for Remote Radiation Measurement (원격 방사선 측정을 위한 ZigBee 원칩형 통신 모듈 설계에 대한 연구)

  • Lee, Joo-Hyun;Lee, Seung-Ho
    • Journal of IKEEE
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    • v.18 no.4
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    • pp.552-558
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    • 2014
  • This paper suggests how to design a ZigBee-chip-based communication module to remotely measure radiation level. The suggested communication module consists of two control processors for the chip as generally required to configure a ZigBee system, and one chip module to configure a ZigBee RF device. The ZigBee-chip-based communication module for remote radiation measurement consists of a wireless communication controller; sensor and high-voltage generator; charger and power supply circuit; wired communication part; and RF circuit and antenna. The wireless communication controller is to control wireless communication for ZigBee and to measure radiation level remotely. The sensor and high-voltage generator generates 500 V in two consecutive series to amplify and filter pulses of radiation detected by G-M Tube. The charger and power supply circuit part is to charge lithium-ion battery and supply power to one-chip processors. The wired communication part serves as a RS-485/422 interface to enable USB interface and wired remote communication for interfacing with PC and debugging. RF circuit and antenna applies an RLC passive component for chip antenna to configure BALUN and antenna impedance matching circuit, allowing wireless communication. After configuring the ZigBee-chip-based communication module, tests were conducted to measure radiation level remotely: data were successfully transmitted in 10-meter and 100-meter distances, measuring radiation level in a remote condition. The communication module allows an environment where radiation level can be remotely measured in an economically beneficial way as it not only consumes less electricity but also costs less. By securing linearity of a radiation measuring device and by minimizing the device itself, it is possible to set up an environment where radiation can be measured in a reliable manner, and radiation level is monitored real-time.

A Study on Development of Disaster Prevention Automation System on IT using One-chip Type PLC (원칩형 PLC를 이용한 IT 기반 방재용 자동화시스템 개발에 관한 연구)

  • Kwak, Dong-Kurl
    • The Transactions of the Korean Institute of Power Electronics
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    • v.16 no.2
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    • pp.97-104
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    • 2011
  • This paper deals with the quick and precise disaster prevention automation system (DPAS) based on information communication technology (IT) that detects fire and disasters in the building automatically and quickly and then activates the facilities to extinguish fire and disasters, monitoring such situation in a real time through wire-wireless communication network. The proposed DPAS is applied a programmable logic controller (PLC) of one-chip type which is smallsize and lightweight and also has highly sensitive-precise reliabilities. The one-chip type PLC analyzes detected signals from sensors in a case of fire and disasters, then activates fire extinguishing facilities for rapid suppression. The detected data is also transferred to a remote situation room through wire-wireless network of RS232c and bluetooth communication. The transferred data sounds an emergency alarm signal, and operates a monitoring program. The proposed DPAS based on IT will minimize the life and wealth loss from rapid measures while prevents fire and disasters.

Design and Implementation of On-Chip Network Architecture for Improving Latency Efficiency (지연시간 효율 개선을 위한 On-Chip Network 구조 설계 및 구현)

  • Jo, Seong-Min;Cho, Han-Wook;Ha, Jin-Seok;Song, Yong-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.11
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    • pp.56-65
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    • 2009
  • As increasing the number of IPs integrated in a single chip and requiring high communication bandwidth on a chip, the trend of SoC communication architecture is changed from bus- or crossbar-based architecture to packet switched network architecture, NoC. However, highly complex control logics in routers require multiple cycles to switch packet. In this paper, we design low complex router to improve the communication latency. Our NoC design is verified by simulation platform modeled by ESL tool, SoC Designer. We also evaluate our NoC design comparing to the previous NoC architecture based on VC router. Our results show that our NoC architecture has less communication latency, even small throughput degradation (about 1-2%).

A Study on Design and Operation Performance of Automatic Fire Detection Equipment (P-type One-class Receiver) by Bidirectional Communication (양방향 통신이 가능한 자동화재탐지설비(P형 1급 수신기)의 설계 및 동작특성에 관한 연구)

  • Lee, Bong-Seob;Kwak, Dong-Kurl;Jung, Do-Young;Cheon, Dong-Jin
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.2
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    • pp.347-353
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    • 2012
  • In this paper, authors will develop the quick and precise remote controller of automatic fire detection equipment (P-type one-class receiver) based on information communication technology (IT). The remote controller detects the fire and disaster in the building automatically and quickly and then activates the facilities to extinguish the fire and disaster, monitoring such situation in a real time through wire-wireless communication network. The proposed remote controller is applied a programmable logic device (PLD) micom. of one-chip type which is small size and lightweight and also has highly sensitive-precise reliabilities. The one-chip type PLD micom. analyzes digital signals from sensors, then activates fire extinguishing facilities for alarm and rapid suppression in a case of fire and disaster. The detected data is also transferred to a remote situation room through wire-wireless network of RS232c and bluetooth communication, and then the situation room sends an emergency alarm signal. The automatic fire detection equipment (AFDE) based on IT will minimize the life and wealth loss while prevents fire and disaster.

Performance Oriented Docket-NoC (Dt-NoC) Scheme for Fast Communication in NoC

  • Vijayaraj, M.;Balamurugan, K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.3
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    • pp.359-366
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    • 2016
  • Today's multi-core technology rapidly increases with more and more Intellectual Property cores on a single chip. Network-on-Chip (NoC) is an emerging communication network design for SoC. For efficient on-chip communication, routing algorithms plays an important role. This paper proposes a novel multicast routing technique entitled as Docket NoC (Dt-NoC), which eliminates the need of routing tables for faster communication. This technique reduces the latency and computing power of NoC. This work uses a CURVE restriction based algorithm to restrict few CURVES during the communication between source and destination and it prevents the network from deadlock and livelock. Performance evaluation is done by utilizing cycle accurate RTL simulator and by Cadence TSMC 18 nm technology. Experimental results show that the Dt-NoC architecture consumes power approximately 33.75% 27.65% and 24.85% less than Baseline XY, EnA, OEnA architectures respectively. Dt-NoC performs good as compared to other routing algorithms such as baseline XY, EnA, OEnA distributed architecture in terms of latency, power and throughput.

The Fabrication of Mulilayer Chip NTC Thermistor for Mobile Communication Telephone (이동통신 단말기에 이용되는 적층 칩 써미스터 제작)

  • Yoon, Jung-Rag;Lee, Heon-Yong;Kim, Jee-Gyun;Lee, Suk-Won
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1794-1796
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    • 2000
  • Oxides of the form $Mn_{3}O_4$-$Co_{3}O_4$-NiO present properties that make them useful as multilayer chip NTC thermistor for mobile communication telephone. When $Mn_{2}Ni_{x}CO_{1-x}O_4$ composition with the X = 0.12$\sim$0.24 at sintered temperature 1250$^{\circ}C$, resistivity and B-constant were 300$\sim$450[${\Omega}-cm$] and 3250$\sim$3450, respectively. Multilayer chip NTC(Negative Temperature Coefficient) resistor were fabricated with 4 layer by a conventional multilayer capacitor techniques, using 100 pd paste as internal electrode and $Mn_{2}Ni_{0.20}CO_{0.8}O_4$ composition as NTC materials. In particular, resistance change ratio (${\Delta}R$), the important factor for reliability, varied within $\pm$3%, indicating the compositions of multilayer chip NTC thermistor products could be available for mobile communication telephone.

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