• 한국진공학회지
• /
• 제16권5호
• /
• pp.383-387
• /
• 2007

본 논문에서는 KSTAR 토카막 진공용기의 세정을 위한 방전세정 시스템의 설계에 대해 기술하였다. 먼저 방전세정효율에 영향을 주는 매개변수들에 대해 논의하였으며. 실제 설계에서 직류방전 보다 낮은 압력에서 방전이 시작되고 유지되며 따라서 세정효율이 높은 RG 방전(RF-assisted DC glow discharge) 방법을 채택하였다. 그리고 방전세정의 균일성을 위해 두 개의 방전 전극을 진공용기의 진단포트(A,I-port)에 설치하였다. 설계된 방전세정 시스템은 KSTAR 진공용기 내벽 세정뿐만 아니라 제1벽의 연료재순환(fuel recycling)이나 보론화 처리(boronization)등의 연구에도 응용될 수 있다.

• 동력기계공학회지
• /
• 제21권3호
• /
• pp.74-84
• /
• 2017

This paper presents the development of the underwater cleaning robot platform for a higher efficiency in manufacturing industry. Human operators directly go into the cistern and clean sludge after drainage of the water so far. It is sometimes dangerous because of the harmful chemical materials from the product making process. In addition, it takes long time for water drainage and supplying it back. However, the robot cleaning operation does not need to drain water so that it could be applied to the sludge cleaning work at any time without the plant pause. Moreover, it can prevent the safety accidents because human operators are not necessary to enter directly the sludge cisterns. This paper shows the performance of cleaning work that can be applied in the industrial field through the design and development of underwater cleaning robot platform. And these results demonstrate that the developed underwater cleaning robot has great possibilities to clean other industrial water cisterns.

• 로봇학회논문지
• /
• 제7권4호
• /
• pp.243-251
• /
• 2012

In this paper, developing of a pool cleaning robot is addressed. First, we analyze commercial pool cleaning robot mechanisms, and the merits and demerits of wireless version of a pool cleaning robot is introduced. And then the water-jet moving mechanism for a pool cleaning robot is proposed to improve energy efficiency and mechanical design advantage, which is one of the strong candidates for wireless pool cleaning robots. Next, the method of cleaning performance evaluation of pool cleaning robots is firstly defined with five key factors, and it was verified by experimental results. If the cleaning performance can be quantitatively defined, we can design optimally a pool cleaning robot, which results in the cost down.

• 멤브레인
• /
• 제29권6호
• /
• pp.339-347
• /
• 2019

정삼투 공정(forward osmosis, FO)은 역삼투 공정(reverse osmosis, RO)에 비해 저압으로 운영되므로 오염 제어, 유지 보수, 막 세정 및 잠재적 에너지 저감 측면에서 큰 이점이 있어 다양한 분야에 적용할 수 있는 기술이다. 특히, 정삼투 공정의 막오염층이 비교적 느슨하고 분산된 특성을 가지므로 역삼투 공정과 달리 물리세정만으로도 충분한 막오염 제어가 가능하다. 하지만 기존 연구들의 경우 정삼투 물리세정에 적합한 세정 유속을 적용하지 않아 최적화 운전을 하지 못했다는 한계가 있다. 따라서 이 연구는 경제적인 에너지량으로 높은 효율의 세정을 보일 수 있는 적절한 유속의 정당성 평가를 목적으로 한다. 정삼투 공정 막오염 실험을 8.54 cm/s 순환 유속으로 유지하고 세 가지 세정유속으로 회복률과 SEC (specific energy consumption) 비교 평가하였다. 이 실험의 결과로 2배속 세정이 3배속 세정의 수투과도 회복률 만큼의 높은 효율을 보이는 동시에, 2배속 세정이 높은 세정효율 및 경제적인 SEC를 보이는 적절한 유속이라는 것을 확인하였다.

• 대한기계학회논문집A
• /
• 제33권10호
• /
• pp.1023-1028
• /
• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2000년도 춘계학술대회 논문집
• /
• pp.743-746
• /
• 2000

The removal of contaminants of silicon wafers has been investigated by various methods. Laser cleaning is the new dry cleaning technique to replace wafer wet cleaning in the near future. A dry laser cleaning uses inert gas jet to remove contaminant particles lifted off by the action of a KrF excimer laser. A laser cleaning model is developed to simulate the cleaning process and analyze the influence of contaminant particles and experimental parameters on laser cleaning efficiency. The model demonstrates that various types of submicrometer-sized particles from the front sides of silicon wafer can be efficiently removed by laser cleaning. The laser cleaning is explained by a particle adhesion model. including van der Waals forces and hydrogen bonding, and a particle removal model involving rapid thermal expansion of the substrate due to the thermoelastic effect. In addition, the experiment of wafer laser cleaning using KrF excimer laser was conducted to remove various contaminant particles.

• 전기학회논문지
• /
• 제61권1호
• /
• pp.94-98
• /
• 2012

The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.

• 한국응용과학기술학회지
• /
• 제13권3호
• /
• pp.111-117
• /
• 1996

Many alternatives to Trichlorothane & Trichlorotrifluoroethane mainly used as cleaning solvent for industrial parts are developed and commercialized because the solvent is scheduled to phaseout after 1996. Considering there are many kinds of parts and contaminants in all parts cleaning, It is essential to investigating the characteristics and performance of the alternatives prior to use. For the contaminant of a standard oil, waters, hydrocarbon and halogen parts which are the comercially available and promising alternatives were experimented at the same condition of Trichlorothane & Trichlorotrifluoroethane to check the cleaning performance. Overally, the removal efficiency of halogen solvent parts was better than that of hydrocarbon or waters parts for removing the standard oil used in this experiment.

• 한국안전학회지
• /
• 제14권4호
• /
• pp.114-119
• /
• 1999

When NaOCl was generated and put into sea-water cooling machine in order to overcome the biological hindrances against sea-water cooling machine, it was converted into metallic ion, particularly Ca and Mg, as a hydrate in sea-water and is to stick to electrolyte as a side reaction. This phenomena make the distance between the electrolytes narrow to decrease the flow rate, which induces the local vortex flow which erodes the pole plate. Moreover, this increases the resistance of the electrolyte as well as voltage to decrease the electrolytic efficiency, which has curtailed a chlorine yield and caused a pole plate cut. We are able to overcome these problems by chemical cleaning and intend to extend the life-time of electrolyte and to increase output of the sea-water electrolysis facilities by studying optimal policy regarding chemical cleaning of electrolytic cell. Cleaning time of electrolytic facilities is determined when both increase in electrolytic efficiency and decrease in pole-plate voltage are 10%. At this time as operating current of electrolytic facilities is high, operating time is diminished. Whereas, parameter of end point determination according to cleaning is Mg ionic concentration in solution. When we use Cleaner as a 7wt% HCl, cleaning time is about 80min proper. We are able to maintain pole plate performance by protecting against pole plate cut by means of electrolytic by-product, improve operating rate of facilities, and cut down on maintenance expenditure after acidic cleaning.

• 한국레이저가공학회지
• /
• 제6권3호
• /
• pp.29-35
• /
• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.