Abstract
The behavior of ozone micro bubble cleaning system was investigated to evaluate the solution as a new method of solar cell wafer cleaning in comparison with former conventional RCA cleaning. We have developed the ozone dissolution system in the ozonated water for more efficient cleaning conditions. The optimized cleaning conditions for solar cell wafer process were 10 ppm of ozone concentration and 12 minutes in cleaning periods, respectively. We have confirmed the cleaning reliability and cell efficiencies after ozone micro bubble cleaning. Using this new cleaning technology, it was possible to obtain higher efficiency, higher productivity, and fast tact time for applying cleaning in the fields on bare ingot wafer, LED wafers as well as the solar cell wafer.