• Journal of the Korean Society of Industry Convergence
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• v.25 no.6_3
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• pp.1239-1246
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• 2022

This paper introduces the effect of grease on the degradation characteristics of bearings used as key components of packaging equipment and automation systems. Bearings parts are installed to fix and support the rotating body of the system, and performance degradation of the bearings has a great effect on the life of the system too. When bearings are used in various devices and systems, the grease is applied to reduce friction and improve fatigue life. Determining the type of lubricant (grease) is important because it has a great influence on the operating environment and lifespan and ensures long lifespan of systems and facilities. However, studies that simultaneously compared and analyzed the change in mechanical degradation characteristics and the comparison of chemical degradation characteristics according to grease types under actual operating conditions are insufficient. In this paper, three types of small harmonic drive, high-load reducer, and low-load reducer grease used in power transmission joint modules are experimentally selected and finally injected into ball bearings with a load (19,500N) to improve bearing durability. Degradation characteristics were tested by attaching to test equipment. At this time, after the durability test under the same load conditions, the mechanical degradation characteristics, that is temperature, vibration according to the three greases types. In addition, the chemical degradation characteristics of the corresponding grease was compared to present the results of mutual correlation analysis.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.6
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• pp.183-194
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• 2013

Liquid urea based SCR has been used in the market to reduce NOx in the exhaust emission of the diesel engine vehicle. This system has several problems at low temperature, which are freezing below $-12^{\circ}C$, solid deposit formation in the exhaust, and difficulties in dosing system at exhaust temperature below $200^{\circ}C$. Also, it is required complicated exhaust packaging equipment and mixer due to supply uniform ammonia concentration. In order to solve these issues, solid urea, ammonium carbonate, and ammonium carbamate are selected as ammonia sources for the application of solid SCR. In this paper, basic research on reaction rate of three ammonia-transporting materials was performed. TGA (Thermogravimetric Analysis) and DTA (Differential Thermal Analysis) tests for these materials are carried out for various heating conditions. From the results, chemical kinetic parameters such as activation energy and frequency factor are obtained from the Arrhenius plot. Additionally, from test results of DSC (Differential Scanning Calorimeter) for these materials, chemical kinetic parameters using the Kissinger method are calculated. Activation energies of solid SCR from this experiment are compared with proper data of literature study, then obtained data of this experiment are used for the design of reactor and dosing system for candidate vehicle.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.37-41
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• 2012

The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

• Korean Chemical Engineering Research
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• v.54 no.6
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• pp.723-733
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• 2016

Intensive researches have been focused on the 3-dimensional packaging technology using through silicon via (TSV) to overcome the limitation in Cu interconnection scaling. Void-free filling of TSV by the Cu electrodeposition is required for the fabrication of reliable electronic devices. It is generally known that sufficient inhibition on the top and the sidewall of TSV, accompanying the selective Cu deposition on the bottom, enables the void-free bottom-up filling. Organic additives contained in the electrolyte locally determine the deposition rate of Cu inside the TSV. Investigation on the additive chemistry is essential for understanding the filling mechanisms of TSV based on the effects of additives in the Cu electrodeposition process. In this review, we introduce various filling mechanisms suggested by analyzing the additives effect, research on the three-additive system containing new levelers synthesized to increase efficiency of the filling process, and methods to improve the filling performance by modifying the functional groups of the additives or deposition mode.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.24 no.4
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• pp.425-435
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• 2014

Objectives: This study was performed in order to establish reliable and relative selection criteria for hazardous substances requiring management(HSRM) in the Occupational Safety and Health Act in Korea. Methods: To determine the relative criteria and weight of evidence for HSRM, we analyzed the difference between the selection method of priority substances in studies by KOSHA(Korea Occupational Safety and Health Agency) and the European Union Risk Ranking Method(EURAM). In addition, 597 hazardous substances with exposure limit valueswereanalyzed and the posted health hazards classification by MOEL(Ministry of Employee and Labor), MOE(Ministry of Environment), and EU CLP(Classification, Labelling and Packaging regulation) were compared based on GHS(Globally Harmonized System of classification and labelling of chemicals) criteria. The existing HSRM(167 substances) were evaluated for suitability by the proposed criteria in this study. Results: As a result of this study, the criteria and procedures for selecting HSRM in the Occupational Safety and Health Act were arranged utilizing GHS health hazard classification results, occupational disease cases and domestic use situations. Conclusions: The applicability of the proposed criteria was proved via the evaluation of existing HSRM(167 substances). Most HSRM (161 substances) were found to correspond to a significant health effect or substantial health effect. The question of whether to include the six substances that have been found to have general health effects as HSRM would be require further research.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.47-51
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• 2013

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

• Journal of the Korean Society of Food Science and Nutrition
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• v.33 no.5
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• pp.917-920
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• 2004

The migration potential of volatile organic solvents widely employed in the printing process of food packaging was investigated by using a closed experimental system, which contained a food sample and a paper sheet spiked with the contaminant solvents. The studied organic compounds included toluene and p,m,o-xylene which are relatively highly volatile. Typical food samples of caramel, beef jerky and butter were selected based on their chemical composition and were assigned to the migration system at 10, 25 and 4$0^{\circ}C$. The equilibrated migration level was very high with almost complete transfer in the butter with high fat, while caramel of high carbohydrate content and beef jerky of high protein showed migration degree of 37∼56% and 37∼77%, respectively. Temperature did significantly influence the migration on beef jerky with higher level at higher temperature. There was no difference in the migration level among the solvents.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.25-31
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• 2012

In the synthesis of nanoparticles (NPs) via wet chemical reduction using tin(II) acetate precursor, the effects of green reducing agents (sugar) and a capping agent (gelatin) on the formation of NPs were analyzed as functions of synthesis conditions and time. When glucose was used as the reducing agent, it was observed that irregular chainlike shapes, aggregates of NPs, were formed during the synthesis at $70-110^{\circ}C$. The NPs were determined as $SnO_2$ from the fast Fourier transform (FFT) pattern. In the synthesis at $110^{\circ}C$ by using sucrose, fine spherical NPs of ~10 nm in diameter were formed after the synthesis time of 3 h. As the time increased to 9 h, the chainlike NP aggregates besides irregularly aggregated spherical NPs were also formed locally. However, the chainlike NP aggregates were only observed when the synthesis was conducted at $130^{\circ}C$. The spherical NPs and chainlike NP aggregates were analyzed to be pure Sn and $SnO_2$, respectively.

• KSBB Journal
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• v.20 no.2 s.91
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• pp.112-115
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• 2005

E. coli in combination with bacteriophage $\lambda$ was used to overcome the intrinsic plasmid instability that is frequently found in recombinant fermentation especially in long-term operation. In order to enhance the stability and productivity, the bacteriophage ${\lambda}NM1070$ was used in this study. It is a $\lambda$ mutant, which is deficient in the synthesis of protein related to DNA packaging and cell lysis. The ${\lambda}NM1070$ is also a temperature-sensitive mutant. To optimize the production of recombinant protein in this temperature-sensitive system, the temperature effects on growth and cloned gene expression were investigated for stable and efficient recombinant gene expression. The induction to the lytic state was not complete at $36^{\circ}C$ while the temperature above $40^{\circ}C$ induced the lytic state completely. However, the productivity was decreased at $42^{\circ}C$ by temperature inhibition. The L-free cell concentration increased with the increase of temperature until $40^{\circ}C$. In conclusion, ${\lambda}NM1070$ has the optimal temperature at $38^{\circ}C$ for stability and at $40^{\circ}C$ for expression.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.85-89
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• 2021

AlGaN-based UV-C light-emitting diodes (LEDs) were applied for p-type activation by electrochemical potentiostatic activation (EPA). The p-type activation efficiency was increased by removing hydrogen atoms through EPA treatment using a neutral Mg-H complex that causes high resistance and low conductivity. A neutral Mg-H complex is decomposed into Mg^- and H⁺ depending on the key parameters of solution, voltage, and time. The improved hole carrier concentration was confirmed by secondary ion mass spectroscopy (SIMS) analysis. This mechanism eventually improved the internal quantum efficiency (IQE), the light extraction efficiency, the leakage current value in the reverse current region, and junction temperature, resulting in better UV-C LED lifetime. For systematic analysis, SIMS, Etamax IQE system, integrating sphere, and current-voltage measurement system were used, and the results were compared with the existing N₂-annealing method.