• Title/Summary/Keyword: Channel length

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Impact of Segregation Layer on Scalability and Analog/RF Performance of Nanoscale Schottky Barrier SOI MOSFET

  • Patil, Ganesh C.;Qureshi, S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.1
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    • pp.66-74
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    • 2012
  • In this paper, the impact of segregation layer density ($N_{DSL}$) and length ($L_{DSL}$) on scalability and analog/RF performance of dopant-segregated Schottky barrier (DSSB) SOI MOSFET has been investigated in sub-30 nm regime. It has been found that, although by increasing the $N_{DSL}$ the increased off-state leakage, short-channel effects and the parasitic capacitances limits the scalability, the reduced Schottky barrier width at source-to-channel interface improves the analog/RF figures of merit of this device. Moreover, although by reducing the $L_{DSL}$ the increased voltage drop across the underlap length reduces the drive current, the increased effective channel length improves the scalability of this device. Further, the gain-bandwidth product in a common-source amplifier based on optimized DSSB SOI MOSFET has improved by ~40% over an amplifier based on raised source/drain ultrathin-body SOI MOSFET. Thus, optimizing $N_{DSL}$ and $L_{DSL}$ of DSSB SOI MOSFET makes it a suitable candidate for future nanoscale analog/RF circuits.

Analysis of Transport Characteristics for Double Gate MOSFET using Analytical Current-Voltage Model (해석학적 전류-전압모델을 이용한 이중게이트 MOSFET의 전송특성분석)

  • Jung Hak-Kee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.9
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    • pp.1648-1653
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    • 2006
  • In this paper, transport characteristics have been investigated using analytical current-voltage model for double gate MOSFET(DGMOSFET). Scaling down to 100nm of gate length for MOSFET can bring about various problems such as a threshold voltage roll-off and increasing off current by tunneling since thickness of oxide is down by 1.fnm and doping concentration is increased. A current-voltage characteristics have been calculated according to changing of channel length,using analytical current-voltage relation. The analytical model has been verified by calculating I-V relation according to changing of oxide thickness and channel thickness as well as channel length. A current-voltage characteristics also have been compared and analyzed for operating temperature. When gate voltage is 2V, it is shown that a current-voltage characteristic in 77K is superior to in room temperature.

Study on the Characteristics of Bubble and Liquid Slugs for Gas-Liquid Taylor Flow in a Rectangular Micro-channel (사각 마이크로 채널 내 Taylor Flow의 기포 및 액체 슬러그 유동 특성에 대한 연구)

  • Lee, Jun Kyoung;Lee, Kwan Geun
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.10
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    • pp.520-526
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    • 2015
  • The characteristics of gas-liquid Taylor (Slug) flow in a square micro-channel of $600{\sim}600{{\mu}m}$ were investigated experimentally in this paper. The test fluids were nitrogen and water. The liquid and gas superficial velocities were 0.01~3 m/s and 0.1~3 m/s, respectively. Bubble and liquid slug length, bubble velocity, and frequency were measured by analyzing optical images using a high speed camera. Bubble length decreased with higher liquid flow rate, which increased dramatically with higher gas flow rate. However, slug length did not vary with changes in inlet liquid conditions. Additionally, bubble velocities and frequencies increased with higher liquid and gas flow rates. It was found that measured bubble lengths were in good agreement with the empirical models in the existing literature, but slug lengths were not.

Analytical Model of Threshold Voltage for Negative Capacitance Junctionless Double Gate MOSFET Using Ferroelectric (강유전체를 이용한 음의 정전용량 무접합 이중 게이트 MOSFET의 문턱전압 모델)

  • Hakkee Jung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.2
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    • pp.129-135
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    • 2023
  • An analytical threshold voltage model is presented to observe the change in threshold voltage shift ΔVth of a junctionless double gate MOSFET using ferroelectric-metal-SiO2 as a gate oxide film. The negative capacitance transistors using ferroelectric have the characteristics of increasing on-current and lowering off-current. The change in the threshold voltage of the transistor affects the power dissipation. Therefore, the change in the threshold voltage as a function of theferroelectric thickness is analyzed. The presented threshold voltage model is in a good agreement with the results of TCAD. As a results of our analysis using this analytical threshold voltage model, the change in the threshold voltage with respect to the change in the ferroelectric thickness showed that the threshold voltage increased with the increase of the absolute value of charges in the employed ferroelectric. This suggests that it is possible to obtain an optimum ferroelectric thickness at which the threshold voltage shift becomes 0 V by the voltage across the ferroelectric even when the channel length is reduced. It was also found that the ferroelectric thickness increased as the silicon thickness increased when the channel length was less than 30 nm, but the ferroelectric thickness decreased as the silicon thickness increased when the channel length was 30 nm or more in order to satisfy ΔVth=0.

Characterization of channel length and width of p channel poly-Si thin film transistors (P channel poly-Si TFT의 길이와 두께에 관한 특성)

  • Lee, Jeoung-In;Hwang, Sung-Hyun;Jung, Sung-Wook;Jang, Kyung-Soo;Lee, Kwang-Soo;Chung, Ho-Kyoon;Choi, Byoung-Deog;Lee, Ki-Yong;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.87-88
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    • 2006
  • Recently, poly-Si TFT-LCD starts to be mass produced using excimer laser annealing (ELA) poly-Si. The main reason for this is the good quality poly-Si and large area uniformity. We report the influence of channel length and width on poly-Si TFTs performance. Transfer characteristics of p-channel poly-Si thin film transistors fabricated on polycrystalline silicon (poly-Si) thin film transistors (TFTs) with various channel lengths and widths of 2-30 ${\mu}m$ has been investigated. In this paper, we analyzed the data of p-type TFTs. We studied threshold voltage ($V_{TH}$), on/off current ratio ($I_{ON}/I_{OFF}$), saturation current ($I_{DSAT}$), and transconductance ($g_m$) of p-channel poly-Si thin film transistors with various channel lengths and widths.

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Relation of Conduction Path and Subthreshold Swing for Doping Profile of Asymmetric Double Gate MOSFET (비대칭 DGMOSFET의 도핑분포함수에 따른 전도중심과 문턱전압이하 스윙의 관계)

  • Jung, Hakkee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.8
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    • pp.1925-1930
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    • 2014
  • This paper has analyzed the relation of conduction path and subthreshold swing for doping profile in channel of asymmetric double gate(DG) MOSFET. Since the channel size of asymmetric DGMOSFET is greatly small and number of impurity is few, the high doping channel is analyzed. The analytical potential distribution is derived from Possion's equation, and Gaussian distribution function is used as doping profile. The conduction path and subthreshold swing are derived from this analytical potential distribution, and those are investigated for variables of doping profile, projected range and standard projected deviation, according to the change of channel length and thickness. As a result, subthreshold swing is reduced when conduction path is approaching to top gate, and that is increased with a decrease of channel length and a increase of channel thickness due to short channel effects.

Improvement of Current Path by Using Ferroelectric Material in 3D NAND Flash Memory (3D NAND Flash Memory에 Ferroelectric Material을 사용한 Current Path 개선)

  • Jihwan Lee;Jaewoo Lee;Myounggon Kang
    • Journal of IKEEE
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    • v.27 no.4
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    • pp.399-404
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    • 2023
  • In this paper, we analyzed the current path in the O/N/O (Oxide/Nitride/Oxide) structure of 3D NAND Flash memory and in the O/N/F (Oxide/Nitride/Ferroelectric) structure where the blocking oxide is replaced by a ferroelectric. In the O/N/O structure, when Vread is applied, a current path is formed on the backside of the channel due to the E-fields of neighboring cells. In contrast, the O/N/F structure exhibits a current path formed on the front side due to the polarization of the ferroelectric material, causing electrons to move toward the channel front. Additionally, we performed an examination of device characteristics considering channel thickness and channel length. The analysis results showed that the front electron current density in the O/N/F structure increased by 2.8 times compared to the O/N/O structure, and the front electron current density ratio of the O/N/F structure was 17.7% higher. Therefore, the front current path is formed more effectively in the O/N/F structure than in the O/N/O structure.

The Characterizing Analysis of a Buried-Channel MOSFET based on the 3-D Numerical Simulation

  • Kim, Man-Ho;Kim, Jong-Soo
    • Journal of Electrical Engineering and Technology
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    • v.2 no.2
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    • pp.267-273
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    • 2007
  • A depletion-mode MOSFET has been analyzed to evaluate its electrical behavior using a novel 3-D numerical simulation package. The characterizing analysis of the BC MOSFET was performed through short-channel narrow-channel and small-geometry effects that are investigated, in detail, in terms of the threshold voltage. The DIBL effect becomes significant for a short-channel device with a channel length of $<\;3({\mu}m)$. For narrow-channel devices the variation of the threshold voltage was sharp for $<4({\mu}m)$ due to the strong narrow-channel effect. In the case of small-geometry devices, the shift of the threshold voltage was less sensitive due to the combination of the DIBL and substrate bias effects, as compared with that observed from the short-channel and narrow-channel devices. The characterizing analysis of the narrow-channel and small-geometry devices, especially with channel width of $<\;4({\mu}m)$ and channel area of $<\;4{\times}4({\mu}m^2)$ respectively, can be accurately performed only from a 3-D numerical simulation due to their sharp variations in threshold voltages.

Joint Adaptive Combining and Variable Tap-Length Multiuser Detector for Underwater Acoustic Cooperative Communication

  • Liu, Zhiyong;Wang, Yinghua;Song, Lizhong;Wang, Yinyin;Dai, Fusheng
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.12 no.1
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    • pp.325-339
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    • 2018
  • In this paper, we propose a joint adaptive combining and variable tap-length multiuser detector (MUD) for amplify-and-forward (AF) underwater acoustic cooperative interleave-division multiple access (IDMA) communication system. The proposed MUD jointly realizes tap-length adjustment, adaptive combining, and multiuser detection. In contrast to the existing methods, the proposed detector can adaptively combine the received signals from different nodes at destination, and does not need the assumption that full and perfect channel state information (CSI) of all the links at the receiver is known. Moreover, the proposed detector can adaptively adjust the tap coefficient vector and tap-length of each branch according to the specific channel profile of each branch. Simulation results validate the feasibility and show the advantages of the proposed detector against existing counterparts.

Fluorine Effects on NMOS Characteristics and DRAM Refresh

  • Choi, Deuk-Sung
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.1
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    • pp.41-45
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    • 2012
  • We observed that in chemical vapor deposition (CVD) tungsten silicide (WSix) poly gate scheme, the gate oxide thickness decreases as gate length is reduced, and it intensifies the roll-off properties of transistor. This is because the fluorine diffuses laterally from WSix to the gate sidewall oxide in addition to its vertical diffusion to the gate oxide during gate re-oxidation process. When the channel length is very small, the gate oxide thickness is further reduced due to a relative increase of the lateral diffusion than the vertical diffusion. In DRAM cells where the channel length is extremely small, we found the thinned gate oxide is a main cause of poor retention time.