• Journal of Sensor Science and Technology
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• v.23 no.2
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• pp.73-81
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• 2014

Silicon PIN diode radiation sensors and CMOS readout circuits were designed and fabricated in this study. The PIN diodes were fabricated using a 380-${\mu}m$-thick 4-inch n+ Si (111) wafer containing a $2-k{\Omega}{\cdot}cm$ n- thin epitaxial layer. CMOS readout circuits employed the driving and signal processes in a radiation sensor were mixed with digital logic and analog input circuits. The primary functions of readout circuits are amplification of sensor signals and the generation of the alarm signals when radiation events occur. The radiation sensors and CMOS readout circuits were fabricated in the Institute of Semiconductor Fusion Technology (ISFT) semiconductor fabrication facilities located in Kyungpook National University. The performance of the readout circuit combined with the Si PIN diode sensor was demonstrated.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.3
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• pp.380-386
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• 2016

This paper presents a compact and low-power on-chip touch sensor and readout circuit using shunt proximity touch sensor and its design scheme. In the proposed touch sensor readout circuit, the touch panel condition depending on the proximity of the finger is directly converted into the corresponding voltage level without additional signal conditioning procedures. Furthermore, the additional circuitry including the comparator and the flip-flop does not consume any static current, which leads to a low-power design scheme. A new prototype touch sensor readout integrated circuit was fabricated using complementally metal oxide silicon (CMOS) $0.18{\mu}m$ technology with core area of $0.032mm^2$ and total current of $125{\mu}A$. Our measurement result shows that an actual 10.4 inches capacitive type touch screen panel (TSP) can detect the finger size from 0 to 1.52 mm, sharply.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.2
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• pp.330-336
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• 2007

A single pixel photon counting type image sensor which is applicable for medical diagnosis with digitally obtained image and industrial purpose has tern designed with $0.18{\mu}m$ triple-well CMOS process. The designed single pixel for readout chip is able to be operated by single supply voltage to simplify digital X-ray image sensor module and a preamplifier which is consist of folded cascode CMOS operational amplifier has been designed to enlarge signal voltage(${\Delta}Vs$), the output voltage of preamplifier. And an externally tunable threshold voltage generator circuit which generates threshold voltage in the readout chip has been newly proposed against the conventional external threshold voltage supply. In addition, A dark current compensation circuit for reducing dark current noise from photo diode is proposed and 15bit LFSR(Linear Feedback Shift Resister) Counter which is able to have high counting frequency and small layout area is designed.

• Journal of IKEEE
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• v.18 no.1
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• pp.119-127
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• 2014

This paper presents a CMOS readout circuit for MEMS(Micro Electro Mechanical System) acceleration sensors. It consists of a MEMS accelerometer, a capacitance to voltage converter(CVC) and a second-order switched-capacitor ${\Sigma}{\Delta}$ modulator. Correlated-double-sampling(CDS) and chopper-stabilization(CHS) techniques are used in the CVC and ${\Sigma}{\Delta}$ modulator to reduce the low-frequency noise and DC offset. The sensitivity of the designed CVC is 150mV/g and its non-linearity is 0.15%. The duty cycle of the designed ${\Sigma}{\Delta}$ modulator output increases about 10% when the input voltage amplitude increases by 100mV, and the modulator's non-linearity is 0.45%. The total sensitivity is 150mV/g and the power consumption is 5.6mW. The proposed circuit is designed in a 0.35um CMOS process with a supply voltage of 3.3V and a operating frequency of 2MHz. The size of the designed chip including PADs is $0.96mm{\times}0.85mm$.

• ETRI Journal
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• v.31 no.2
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• pp.243-245
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• 2009

A novel ultra-low-power readout circuit for a pH-sensitive ion-sensitive field-effect transistor (ISFET) is proposed. It uses an ISFET/reference FET (REFET) differential pair operating in weak-inversion and a simple current-mode metal-oxide semiconductor FET (MOSFET) translinear circuit. Simulation results verify that the circuit operates with excellent common-mode rejection ability and good linearity for a single pH range from 4 to 10, while only 4 nA is drawn from a single 1 V supply voltage.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.2
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• pp.322-329
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• 2007

A single pixel photon counting type image sensor which is applicable for medical diagnosis with digitally obtained image and industrial purpose has been designed with $0.18{\mu}m$ triple-well CMOS process. The designed single pixel for readout chip is able to be operated by single supply voltage to simplify digital X-ray image sensor module and a preamplifier which is consist of folded cascode CMOS operational amplifier has been designed to enlarge signal voltage(${\Delta}Vs$), the output voltage of preamplifier. And an externally tunable threshold voltage generator circuit which generates threshold voltage in the readout chip has been newly proposed against the conventional external threshold voltage supply. In addition, A dark current compensation circuit for reducing dark current noise from photo diode is proposed and 15bit LFSR(Linear Feedback Shift Resister) Counter which is able to have high counting frequency and small layout area is designed.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.38-45
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• 2010

A new readout circuit involving a pixel-level reset control was studied for 2-D long wavelength infrared focal plane arrays. The integration time of each pixel can be optimized individually and automatically. Hence, the readout circuit has a wide dynamic range and good signal-to-noise ratio characteristics. The readout circuit was fabricated with a $0.35{\mu}m$ 2-poly 4-metal CMOS process for a $128{\times}128$ long wavelength infrared HgCdTe array with a pixel size of $50{\mu}m{\times}50{\mu}m$. The smart reset control with two-step background suppression improves the signal-to-noise ratio to 87dB and the dynamic range to 95.8dB.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.41-52
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• 2008

In this paper, a circuit analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure is consist of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Photo diode is modelled with Medici device program. HSPICE was used to analyze the variation of the signal feature depending on light intensity using $0.5{\mu}M$ standard CMOS process. Simulation results show that the output signal range is from 0.8 V to 4.5 V. This signal range increased 135 % output dynamic range compared to conventional 3TR pixel in the condition of 5 V power supply.

• Journal of IKEEE
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• v.24 no.4
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• pp.942-949
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• 2020

In this paper, we propose an improved algorithmic ADC for CMOS Image Sensor that is suitable for a column-parallel readout circuit. The algorithm of the conventional algorithmic ADC is modified so that it can operate as a single amplifier while being independent of the capacitor ratio and insensitive to the gain of the op-amp, and it has a high conversion efficiency by using an adaptive biasing amplifier. The proposed ADC is designed with 0.18-um Magnachip CMOS process, Spectre simulation shows that the power consumption per conversion speed is reduced by 37% compared with the conventional algorithmic ADC.

• Journal of Sensor Science and Technology
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• v.14 no.3
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• pp.191-197
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• 2005

When fabricating a vision chip, we should consider the noise problem, such as the fixed pattern noise(FPN) due to the process variation. In this paper, we propose an edge-detection circuit based on biological retina using the offset-free column readout circuit to reduce the FPN occurring in the photo-detector. The offset-free column readout circuit consists of one source follower, one capacitor and five transmission gates. As a result, it is simpler and smaller than a general correlated double sampling(CDS) circuit. A vision chip for edge detection has been designed and fabricated using $0.35\;{\mu}m$ 2-poly 4-metal CMOS technology, and its output characteristics have been investigated.