• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.12
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• pp.1730-1736
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• 2015

This paper presents a 16-channel transimpedance amplifier (TIA) array implemented in a standard $0.18-{\mu}m$ CMOS technology for the applications of panoramic scan LADAR (PSL) systems. Since this array is the front-end circuits of the PSL systems to recover three dimensional image for unmanned vehicles, low-noise and high-gain characteristics are necessary. Thus, we propose a voltage-mode inverter TIA (I-TIA) array in this paper, of which measured results demonstrate that each channel of the array achieves $82-dB{\Omega}$ transimpedance gain, 565-MHz bandwidth for 0.5-pF photodiode capacitance, 6.7-pA/sqrt(Hz) noise current spectral density, and 33.8-mW power dissipation from a single 1.8-V supply. The measured eye-diagrams of the array confirm wide and clear eye-openings up to 1.3-Gb/s operations. Also, the optical pulse measurements estimate that the proposed 16-channel TIA array chip can detect signals within 20 meters away from the laser source. The whole chip occupies the area of $5.0{\times}1.1mm^2$ including I/O pads. For comparison, a current-mode 16-channel TIA array is also realized in the same $0.18-{\mu}m$ CMOS technology, which exploits regulated-cascode (RGC) input configuration. Measurements reveal that the I-TIA array achieves superior performance in optical pulse measurements.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.970-973
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• 2003

Abstract An idea to redce the direct-path short circuit current of the CMOS digital integrated circuit is present. The sample circuit model of the CMOS digital circuit is the CMOS current-control digital output driver circuit, which are also suitable for the low voltage supply integrated circuits as the simple digital inverter, are present in this title. The circuit consists of active MOS load as the current control source, which construct from the saturated n-channel and p-channel MOSFET and the general CMOS inverter circuits. The saturated MOSFET bias can control the output current and the frequency response of the circuit. The experimental results show that lower short circuit current control can make the lower frequency response of the circuit.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.3
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• pp.422-426
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• 2012

Transient radiation is emitted during a nuclear explosion. Transient radiation causes a fatal error in the CMOS circuit as a Upset and Latch-up. In this paper, transient radiation NMOS, PMOS, INVERTER SPICE model was proposed on the basisi of transient radiation effects analysis using TCAD(Technology Computer Aided Design). Photocurrent generated from the MOSFET internal PN junction was expressed to the current source and Latch-up phenomenon in the INVERTER was expressed to parasitic thyristor for the transient radiation SPICE model. For example, the proposed transient radiation SPICE model was applied to CMOS NAND circuit. SPICE simulated characteristics were similar to the TCAD simulation results. Simulation time was reduced to 120 times compared to TCAD simulation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.64 no.12
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• pp.1737-1741
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• 2015

A multi-channel CMOS transimpedance amplifier(TIA) array is realized in a $0.18-{\mu}m$ CMOS technology for the applications of panoramic scan LADAR systems. Each channel consists of a PIN photodiode and a feed-forward TIA that exploits an inverter input stage followed by a feed-forward common-source amplifier so as to achieve lower noise and higher gain than a conventional voltage-mode inverter TIA. Measured results demonstrate that each channel achieves $76-dB{\Omega}$ transimpedance gain, 720-MHz bandwidth, and -20.5-dBm sensitivity for $10^{-9}$ BER. Also, a single channel dissipates the power dissipation of 30 mW from a single 1.8-V supply, and shows less than -33-dB crosstalk between adjacent channels.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.64-70
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• 1994

In this paper, we inverstigated how a parricular internal inverter circuit, which is located far from the input protection in CMOS DRAM, can be easily damaged by external ESD stress, while the protection circuit remains intact. It is shown in a mega bit DRAM that the internal circuit can be safe from ESD by simply improving the input protection circuit. An inverter, which consists of a relatively small NMOSFET and a very large PMOSFET, is used to speed up DRAMs, and the small NMOSFET is vulnerable to ESD in case that the discharge current beyond the protection flows through the inverter to Vss or Vcc power lines on chip. This internal circuit damage can not be detected by only measuring input leakage currents, but by comparing the standby and on operating current before and after ESD stressing. It was esperimentally proven that the placement of parasitic bipolar transistor between input pad and power supply is very effective for ESD immunity.

• Journal of Electrical Engineering and Technology
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• v.8 no.5
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• pp.1182-1187
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• 2013

Transient radiation is emitted during a nuclear explosion and causes fatal errors as upset and latch-up in CMOS circuits. This paper proposes the transient radiation SPICE models of NMOS, PMOS, and INVERTER based on the transient radiation analysis using TCAD (Technology Computer Aided Design). To make the SPICE model of a CMOS circuit, the photocurrent in the PN junction of NMOS and PMOS was replaced as current source, and a latch-up phenomenon in the inverter was applied using a parasitic thyristor. As an example, the proposed transient radiation SPICE model was applied to a CMOS NAND circuit. The CMOS NAND circuit was simulated by SPICE and TCAD using the 0.18um CMOS process model parameter. The simulated results show that the SPICE results were similar to the TCAD simulation and the test results of commercial CMOS NAND IC. The simulation time was reduced by 120 times compared to the TCAD simulation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.880-883
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• 2012

In this paper, CMOS logic device, the INVERTER, NAND, NOR were designed and fabricated using 0.18um CMOS process for analyzing the effect of transient radiation damage. Fabricated logic devices were measured by applying a 1kHz input at 1.8V supply. As a result, the current consumption of less than 70uA and Rising time, Falling time was within a 4us. Experimental results transmission delays occurred when using a 50M cable for pulse radiation experiments.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.2
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• pp.56-62
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• 2002

A new high speed and low voltage swing on-chip BUS using threshold voltage swing driver and dual sense amplifier receiver is proposed. The threshold voltage swing driver reduces the rising time in the bus to 30% of the full CMOS inverter driver and the dual sense amplifier receiver increases twice the throughput. of the conventional reduced-swing buses using sense amplifier receiver. With threshold voltage swing driver and dual sense amplifier receiver combined, approximately 60% speed improvement and 75% power reduction are achieved in the proposed scheme compared to the conventional full CMOS inverter for the on-chip bus.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.14-21
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• 2009

A digital differential transmitter based on CMOS inverter worked up to 2.8 Gbps at the supply voltage of 1 V with a $0.18{\mu}m$ CMOS process. By calibrating the output impedance of the transmitter, the impedance matching between the transmitter output and the transmission line is achieved. The PVT variations of pre-driver are compensated by the calibration of the rising-edge delay and falling-edge delay of the pre-driver outputs. The chip fabricated with a $0.18{\mu}m$ CMOS process, which uses the standard supply voltage of 1.8 V, gives the highest data rate of 4Gbps at the supply voltage of 1.2 V. The proposed calibration schemes improve the eye opening with the voltage margin by 200% and the timing margin by 30%, at 2.8 Gbps and 1 V.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.9
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• pp.54-65
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• 1999

As the integration ratio and operating speed increase, it has become an important problem to estimate the dissipated power during the design procedure to reduce th TTM(time to market). This paper proposed a prediction model for the maximum dissipated power of a CMOS logic gate. This model uses a calculating method. It was constructed by including the characteristics of MOSFETs, the operational characteristics of the gate, and the characteristics of the input signals. As the construction procedure, a maximum power estimation model for CMOS inverter was formed first, And then, a conversion model to convert a multiple input CMOS gate into a corresponding CMOS inverter was proposed. Finally, the power model for inverter was applied to the converted result so that the model could be applied to a general CMOS gate. We designed several CMOS gates in layout level with $0.6{\mu}m$ design rule to apply both to HSPICE simulation and to the proposed models. The comparison between the two results showed that the gate conversion model and the power estimation model had within 5% and 10% of the relative errors, respectively. Those values show that the proposed models have sufficient accuracies. Also in calculation time, the proposed models were more than 30 times faster than HSPICE simulation. Consequently, it can be said that the proposed model could be used efficiently to estimate the maximum dissipated power of a CMOS logic gate during the design procedure.