• Journal of Electrical Engineering and information Science
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• v.2 no.5
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• pp.17-26
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• 1997

Interconnect characterization on a wafer level was performed. Test patterns for single, two-coupled, and triple-coupled lines ere designed by using 0.5$\mu\textrm{m}$ CMOS process. Then interconnect capacitances and resistances were experimentally extracted by using tow port network measurements, Particularly to eliminate parasitic effects, the Y-parameter de-embedding was performed with specially designed de-embedding patterns. Also, for the purpose of comparisons, capacitance matrices were calculated by using the existing CAD model and field-solver-based commercial simulator, METAL and MEDICI. This work experimentally verifies that existing CAD models or parameter extraction may have large deviation from real values. The signal transient simulation with the experimental data and other methodologies such as field-solver-based simulation and existing model was performed. as expected, the significantly affect on the signal delay and crosstalk. The signal delay due to interconnects dominates the sub-micron-based a gate delay (e.g., inverter). Particularly, coupling capacitance deviation is so large (about more than 45% in the worst case) that signal integrity cannot e guaranteed with the existing methodologies. The characterization methodologies of this paper can be very usefully employed for the signal integrity verification or he electrical design rule establishments of IC interconnects in the industry.

• Journal of Electrical Engineering and information Science
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• v.2 no.5
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• pp.9-16
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• 1997

This paper describes the design of a multistandard video encoder. The proposed encoder accepts conventional NTSC/PAL video signals, It also processes he PAL-plus video signal which is now popular in Europe. The encoder consists of five major building functions which are letter-box converter, color space converter, digital filters, color modulator and timing generator. In order to support multistandard video signals, a programmable systolic architecture is adopted in designing various digital filters. Interpolation digital filters are also used to enhance signal-to-noise ratio of encoded video signals. The input to the encoder can be either YCbCr signal or RGB signal. The outputs re luminance(Y), chrominance(C), and composite video baseband(Y+C) signals. The architecture of the encoder is defined by using Matlab program and is modelled by using Veriflog-HDL language. The overall operation is verified by using various video signals, such as color bar patterns, ramp signals, and so on. The encoder contains 42K gates and is implemented by using 0.6um CMOS process.

• The Transactions of the Korea Information Processing Society
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• v.7 no.2
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• pp.470-476
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• 2000

This paper describes an IP design of a low-power microcontroller using an architecture level design methodology instead of a transistor level. To reduce switching capacitance, the register-toregister data transfer is adopted to frequently used register transfer micro-operations. Also, distributed buffers are proposed to reduce a input data rising edge time. To reduce power consumption without any loss of performance, pipeline processing should be used. In this paper, a 4-stage pipelined datapath being able to process CISC instructions is designed. Designed microcontroller lessens power consumption by 20%. To measure a power consumption, the SYNOPSYS EPIC powermill is used.

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.353-357
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• 2015

A new SPICE-compatible model for a gate/body-tied PMOSFET photodetector (GBT PD) with an overlapping control gate is presented. The proposed SPICE-compatible model of a GBT PD with an overlapping control gate makes it possible to control the photocurrent. Research into GBT PD modeling was proposed previously. However, the analysis and simulation of GBT PDs is not lacking. This SPICE model concurs with the measurement results, and it is simpler than previous models. The general GBT PD model is a hybrid device composed of a MOSFET, a lateral bipolar junction transistor (BJT), and a vertical BJT. Conventional SPICE models are based on complete depletion approximation, which is more applicable to reverse-biased p-n junctions; therefore, they are not appropriate for simulating circuits that are implemented with a GBT PD with an overlapping control gate. The GBT PD with an overlapping control gate can control the sensitivity of the photodetector. The proposed sensor is fabricated using a $0.35{\mu}m$ two-poly, four-metal standard complementary MOS (CMOS) process, and its characteristics are evaluated.

• Journal of Power Electronics
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• v.15 no.4
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• pp.1131-1138
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• 2015

This study presents an input-powered high-efficiency interface circuit for energy harvesting systems, and introduces a zero standby power design to reduce power consumption significantly while removing the external power supply. This interface circuit is composed of two stages. The first stage voltage doubler uses a positive feedback control loop to improve considerably the conversion speed and efficiency, and boost the output voltage. The second stage active diode adopts a common-grid operational amplifier (op-amp) to remove the influence of offset voltage in the traditional comparator, which eliminates leakage current and broadens bandwidth with low power consumption. The system supplies itself with the harvested energy, which enables it to enter the zero standby mode near the zero crossing points of the input current. Thereafter, high system efficiency and stability are achieved, which saves power consumption. The validity and feasibility of this design is verified by the simulation results based on the 65 nm CMOS process. The minimum input voltage is down to 0.3 V, the maximum voltage efficiency is 99.6% with a DC output current of 75.6 μA, the maximum power efficiency is 98.2% with a DC output current of 40.4 μA, and the maximum output power is 60.48 μW. The power loss of the entire interface circuit is only 18.65 μW, among which, the op-amp consumes only 2.65 μW.

• Transactions on Electrical and Electronic Materials
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• v.11 no.1
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• pp.20-23
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• 2010

The analog front end (AFE) of a radio frequency identification transponder using the ISO 14443 type A standard with a 100% amplitude shift keying (ASK) modulation is proposed in this paper and verified by circuit simulations and measurements. This AFE circuit, using a 13.56 MHz carrier frequency, consists of a rectifier, a modulator, a demodulator, a regulator, a power on reset, and a dynamically enabled digital phase locked loop (DPLL). The DPLL, with a charge pump enable circuit, was used to recover the clock of a 100% modulated ASK signal during the pause period. A high voltage lateral double diffused metal-oxide semiconductor transistor was used to protect the rectifier and the clock recovery circuit from high voltages. The proposed AFE was fabricated using the $0.18\;{\mu}m$ standard CMOS process, with an AFE core size of $350\;{\mu}m\;{\times}\;230\;{\mu}m$. The measurement results show that the DPLL, using a demodulator output signal, generates a constant 1.695 MHz clock during the pause period of the 100% ASK signal.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.233-233
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• 2010

Magnetic random access memory (MRAM), based on magnetic tunnel junction (MTJ) and CMOS, is a prominent candidate among prospective semiconductor memories because it can provide nonvolatility, fast access time, unlimited read/write endurance, low operating voltage and high storage density. The etching of MTJ stack with good properties is one of a key process for the realization of high density MRAM. In order to achieve high quality MTJ stack, the use of CoFeB and IrMn magnetic films as free layers was proposed. In this study, inductively coupled plasma reactive ion etching of CoFeB and IrMn thin films masked with Ti hard mask was investigated in a $Cl_2$/Ar gas mix. The etch rate of CoFeB and IrMn films were examined on varying $Cl_2$ gas concentration. As the $Cl_2$ gas increased, the etch rate monotonously decreased. The effective of etch parameters including coil rf power, dc-bais voltage, and gas pressure on the etch profile of CoFeB and IrMn thin film was explored, At high coil rf power, high dc-bais voltage, low gas pressure, the etching of CoFeB and IrMn displayed better etch profiles. Finally, the clean and vertical etch sidewall of CoFeB and IrMn free layers can be achieved by means of thin Ti hard mask in a $Cl_2$/Ar plasma at the optimized condition.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.213-213
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• 2010

Magnetic random access memory (MRAM), based on magnetic tunnel junction (MTJ) and CMOS, is one of the best semiconductor memories because it can provide nonvolatility, fast access time, unlimited read/write endurance, low operating voltage and high storage density. For the realization of high density MRAM, the etching of MTJ stack with good properties is one of a key process. Recently, there has been great interest in the MTJ stack using MgO as barrier layer for its huge room temperature MR ratio. The use of MgO barrier layer will undoubtedly accelerate the development of MTJ stack for MRAM. In this study, high-density plasma reactive ion etching of MgO films was investigated in an inductively coupled plasma of $Cl_2$/Ar gas mixes. The etch rate, etch selectivity and etch profile of this magnetic film were examined on vary gas concentration. As the $Cl_2$ gas concentration increased, the etch rate of MgO monotonously decreased and etch slop was slanted. The effective of etch parameters including coil rf power, dc-bais voltage, and gas pressure on the etch profile of MgO thin film was explored, At high coil rf power, high dc-bais voltage, low gas pressure, the etching of MgO displayed better etch profiles. Finally, the clean and vertical etch sidewall of MgO films was achieved using $Cl_2$/Ar plasma at the optimized etch conditions.

• Journal of Semiconductor Engineering
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• v.2 no.3
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• pp.136-141
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• 2021

This paper analyzes the tree expansion for multiple-input multiple-output (MIMO) detection in the viewpoint of hardware implementation. The tree expansion is to calculate path metrics of child nodes performed in every visit to a node while traversing the detection tree. Accordingly, the tree-expansion unit (TEU), which is responsible for such a task, has been an essential component in a MIMO detector. Despite the paramount importance, the analyses on the TEUs in the literature are not thorough enough. Accordingly, we further investigate the hardware complexity of the TEUs to suggest a guideline for selection. In this paper, we focus on a pair of major ways to implement the TEU: 1) a full parallel realization; 2) a transformation of the formulae followed by common subexpression elimination (CSE). For a logical comparison, the numbers of multipliers and adders are first enumerated. To evaluate them in a more practical manner, the TEUs are implemented in a 65-nm CMOS process, and their propagation delays, gate counts, and power consumptions were measured explicitly. Considering the target specification of a MIMO system and the implementation results comprehensively, one can choose which architecture to adopt in realizing a detector.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.68 no.1
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• pp.90-97
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• 2019

The charge redistribution digital-to-analog converter(CR-DAC) is often used for successive approximation register analog-to-digital converter(SAR ADC) that requiring low power consumption and small circuit area. However, CR-DAC is required 2 to the power of N unit capacitors to generate reference voltage for successive approximation of the N-bit SAR ADC, and many unit capacitors occupy large circuit area and consume more power. In order to improve this problem, this paper proposes SAR ADC using series capacitor DAC. The series capacitor DAC is required 2(1+N) unit capacitors to generate reference voltage for successive approximation and charges only two capacitors of the reference generation block. Because of these structural characteristics, the SAR ADC using series capacitor DAC can reduce the power consumption and circuit area. Proposed SAR ADC was designed in CMOS 180nm process, and at 1.8V supply voltage and 500kS/s sampling rate, proposed 6-bit SAR ADC have signal-to-noise and distortion ratio(SNDR) of 36.49dB, effective number of bits(ENOB) of 5.77-bit, power consumption of 294uW.