• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.451-454
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• 2015

This paper introduces 3 type of OTAs with $0.35-{\mu}m$ standard CMOS technology for Low-Power, Low-Voltage. The first type is a two-stage OTA designed to operate with a 1-V VDD and it has $1.774{\mu}W$ low power consumption. All transistors are operating in strong inversion. It takes Gm-Enhancement techniques to compensate gm, which is lowered by Bulk-Driven technique and has an Wide swing current mirror for low voltage operation and a Class-A output. The second type is a Two-stage OTA designed to operate with a 0.8-V VDD and It has 52nW low power consumption and 112dB high gain. The current mirror uses Composite Transistor binding Gates of two MOSFET to raise Rout which is similar with cascode structure. The third type is a Two-stage OTA designed to operate with a 0.6-V VDD and It has 160nW low power consumption and 72dB high gain. It takes Level Shift technique by Common Gate structure to amplify signals without additional bias voltage at second stage.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.3
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• pp.399-405
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• 2011

In this paper, we present the design of Q-band LC VCO and injection locking buffer for 77 GHz automotive radar sensor using 130 nm RF CMOS process. To improve the phase noise characteristic of LC tank, the transmission line is used. The negative resistance by the active device cross-coupled pair of buffer is used for high output power, with or without oscillation of buffer. The measured phase noise is -102 dBc/Hz at 1 MHz offset frequency and tuning range is 34.53~35.07 GHz. The output power is higher than 4.1 dBm over entire tuning range. The fabricated chip size is $510{\times}130\;um^2$. The power consumption of LC VCO is 10.8 mW and injection locking buffer is 50.4 mW from 1.2 V supply.

• Journal of IKEEE
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• v.22 no.4
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• pp.1006-1011
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• 2018

This paper proposes a three level buck converter utilizing multi-bit flying capacitor voltage control. The conventional three-level buck converter can not control the flying capacitor voltage, so that the operation is unstable or the circuit for controlling the flying capacitor voltage can not be applied to the PWM mode. Also when the load current is increased, an error occurs in the inductor voltage. The proposed structure can control the flying capacitor voltage in PWM mode by using differential difference amplifier and common mode feedback circuit. In addition, this paper proposes a 3bit flying capacitor voltage control circuit to optimize the operation of the three level buck converter depending on the load current, and a triangular wave generation circuit using the schmitt trigger circuit. The proposed 3-level buck converter is designed in $0.18{\mu}m$ CMOS process and has an input voltage range of 2.7V~3.6V and an output voltage range of 0.7V~2.4V. The operating frequency is 2MHz, the load current range is 30mA to 500mA, and the output voltage ripple is measured up to 32.5mV. The measurement results show a maximum power conversion efficiency of 85% at a load current of 130 mA.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.4
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• pp.299-312
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• 2006

This paper presents the results of a novel test structure for process control monitor for uncooled IR detector technology of microbolometer arrays. The proposed test structure is based on resistive network configuration. The theoretical model for resistance of this network has been developed using 'Compensation' and 'Superposition' network theorems. The theoretical results of proposed resistive network have been verified by wired hardware testing as well as using an actual 16x16 networked bolometer array. The proposed structure uses simple two-level metal process and is easy to integrate with standard CMOS process line. The proposed structure can imitate the performance of actual fabricated version of area array closely and it uses only 32 pins instead of 512 using conventional method for a $16{\times}16$ array. Further, it has been demonstrated that the defective or faulty elements can be identified vividly using extraction matrix, whose values are quite similar(within the error of 0.1%), which verifies the algorithm in small variation case(${\sim}1%$ variation). For example, an element, intentionally damaged electrically, has been shown to have the difference magnitude much higher than rest of the elements(1.45 a.u. as compared to ${\sim}$ 0.25 a.u. of others), confirming that it is defective. Further, for the devices having non-uniformity ${\leq}$ 10%, both the actual non-uniformity and faults are predicted well. Finally, using our analysis, we have been able to grade(pass or fail) 60 actual devices based on quantitative estimation of non-uniformity ranging from ＜ 5% to ＞ 20%. Additionally, we have been able to identify the number of bad elements ranging from 0 to ＞ 15 in above devices.

• Transactions on Electrical and Electronic Materials
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• v.10 no.2
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• pp.35-39
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• 2009

A novel Helmholtz coil inductively coupled plasma(H-ICP) etcher is proposed and characterized for deep nano-scale CMOS technology. Various hardware tests are performed while varying key parameters such as distance between the top and bottom coils, the distance between the chamber ceiling and the wafer, and the chamber height in order to determine the optimal design of the chamber and optimal process conditions. The uniformity was significantly improved by applying the optimum conditions. The plasma density obtained with the H-ICP source was about $5{\times}10^{11}/cm^3$, and the electron temperature was about 2-3 eV. The etching selectivity for the poly-silicon gate versus the ultra-thin gate oxide was 482:1 at 10 sccm of $HeO_2$. The proposed H-ICP was successfully applied to form multiple 60-nm poly-silicon gate layers.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.94-97
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• 2002

A VLSI architecture of an Ogg Vorbis decoder is proposed : which is dedicated to portable audio appliances. Referring to the computational cost analysis of the decoding processes, the LSP (Line Spectrum Pair) process, which takes more than 50% of the total processing time, can be regarded as a bottleneck to achieve realtime processing by embedded Processors. Thus in our decoder a specific hardware architecture is devised for the LSP process so as to be integrated into a single chip together with an ARM7TDMI processor. In addition, in order to reduce the total hardware cost, instead of the floating point arithmetic, the fixed point arithmetic is adopted. The LSP module has been implemented with 9,740 gates by using a Virtual Silicon 0.l5$\mu\textrm{m}$ CMOS technology, which operates at 58.8MHz with the total CPU load reduced by 57%. It is also verified that the use of the fixed point arithmetic does not incur any significant sound distortion.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.797-800
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• 2005

In this paper, the designed 10-bit current steering data driving circuit consists of bias circuits, shift registers, data and line latches, level shifters, and 10-bit D/A converters. This data driving circuit can improve image quality, driving speed, and can reduce process error, DNL error, and glitch noise. To reduce current cells, the 10-bit D/A converter was designed 3+3+4 hybrid type. As a result 49 current cells are decreased. The transient analysis shows that currents flows a few of mA in data line and the currents have 1024 gray levels of current values. Total circuits are designed for 10 ${\mu}s$ speed. Thus the designed 10-bit current steering data driving circuit can be usable in HDTV/XGA AMOLED displays. These data driving circuits are designed for 0.35 ${\mu}m$ CMOS process at 3.3 V and 18 V supply voltage and simulated with HSPICE..

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.4
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• pp.538-542
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• 2018

In order to generate a clock source with low cost and high performance in system on chip(SoC), a relaxation oscillator with stable output characteristics according to PVT(process, voltage and temperature) fluctuation require a low area and a low power. In this paper, we propose a solution to reduce the current loss caused by parasitic components in the conventional relaxation oscillator. Since the slew rate of the bias current and the capacitor are adjusted to be the same through the proposed solution, a relaxation oscillator with low area characteristics is designed for the same clock source frequency implementation. The proposed circuit is designed using the TSMC CMOS 0.18um process. The Simulation results show that the relaxation oscillator using the proposed solution can prevent the current loss of about $279{\mu}A$ and reduce the total chip area by 20.8% compared with the conventional oscillator in the clock source frequency of 96 MHz.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.9-9
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• 2011

The transfer of nano-science accomplishments into technology is severely hindered by a lack of understanding of barriers to nanoscale manufacturing. The NSF Center for High-rate Nanomanufacturing (CHN) is developing tools and processes to conduct fast massive directed assembly of nanoscale elements by controlling the forces required to assemble, detach, and transfer nanoelements at high rates and over large areas. The center has developed templates with nanofeatures to direct the assembly of carbon nanotubes and nanoparticles (down to 10 nm) into nanoscale trenches in a short time (in seconds) and over a large area (measured in inches). The center has demonstrated that nanotemplates can be used to pattern conducting polymers and that the patterned polymer can be transferred onto a second polymer substrate. Recently, a fast and highly scalable process for fabricating interconnects from CMOS and other types of interconnects has been developed using metallic nanoparticles. The particles are precisely assembled into the vias from the suspension and then fused in a room temperature process creating nanoscale interconnect. The center has many applications where the technology has been demonstrated. For example, the nonvolatile memory switches using (SWNTs) or molecules assembled on a wafer level. A new biosensor chip (0.02 $mm^2$) capable of detecting multiple biomarkers simultaneously and can be in vitro and in vivo with a detection limit that's 200 times lower than current technology. The center has developed the fundamental science and engineering platform necessary to manufacture a wide array of applications ranging from electronics, energy, and materials to biotechnology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.440-443
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• 2010

We report a top-down approach based on atomic force microscopy (AFM) local anodic oxidation for the fabrication of the nano-pattern field effect transistors (FETs). AFM anodic oxidation is relatively a simple process in atmosphere at room temperature but it still can result in patterns with a high spatial resolution, and compatibility with conventional silicon CMOS process. In this work, we study nano-pattern FETs for various cross-bar distance value D, from ${\sim}0.5\;{\mu}m$ to $1\;{\mu}m$. We compare the optical characteristics of the patterned FETs and of the reference FETs based on both 2-dimensional simulation and experimental results for the wavelength from 100 nm to 900 nm. The simulated the drain current of the nano-patterned FETs shows significantly higher value incident the reference FETs from ${\sim}1.7\;{\times}\;10^{-6}A$ to ${\sim}2.3\;{\times}\;10^{-6}A$ in the infrared range. The fabricated surface texturing of photo-transistors may be applied for high-efficiency photovoltaic devices.