• 제어로봇시스템학회:학술대회논문집
• /
• 2004.08a
• /
• pp.1561-1564
• /
• 2004

A CMOS-based Electronically Tunable Capacitance Multipliers, which can be magnified the value of a grounded unit capacitance, is presented in this article. The multiplication factor is varied by the ratio of the bias currents. The proposed circuit is simple, small in size and suitable for implementing in standard CMOS process. PSPICE simulation results demonstrating the characteristics of the proposed circuit are included.

• Proceedings of the IEEK Conference
• /
• 1998.06a
• /
• pp.514-517
• /
• 1998

This paper proposed a symmetric feedback current enhancement circuit with 1.5V power supply to design a 3$^{rd}$ order butterworth low pass filter. The proposed filter designed on 0.8.mu.m CMOS n-well double poly/double metal process simulated in HSPICE composed of the 3dB frequency enhancement circuit and the unity-gain frequency enhancement circuit. The simulation result on the design filter shows the badnwith of 25MHz, phase of 92.6 .deg. and power consumption of 0.3mW..

• Proceedings of the IEEK Conference
• /
• 2001.06b
• /
• pp.45-48
• /
• 2001

An programmable current-mode folding and interpolation analog to digital converter (ADC) with programmable interpolator is proposed in this paper. A programmable interpolator is employed not only to vary the resolution of data converter, but also to decrease a power dissipation within the ADC. Because of varying the number of interpolation circuits, resolution is vary from 6 to 10bit. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The experimental result shows the power dissipation from 26 to 87mW with a power supply of 3.3V.

• Proceedings of the IEEK Conference
• /
• 1999.06a
• /
• pp.986-989
• /
• 1999

An 12bit current-mode folding and interpolation analog to digital converter (ADC) with multiplied folding amplifiers is proposed in this paper. A current - mode multiplied folding amplifier is employed not only to reduced the number of reference current source, but also to decrease a power dissipation within the ADC. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The simulation result shows the power dissipation of 280㎽ with a power supply of 5V.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1086-1087
• /
• 2009

A small temperature sensor is designed in a 0.35um CMOS process. Transistors operating in the intermediate inversion region are employed in the core of the sensor. This temperature sensor operates in $-50^{\circ}C{\sim}120^{\circ}C$ with ${\pm}2^{\circ}C$ of accuracy after two-point calibration. This temperature sensor can be placed in the active pixel area of a display panel to measure the temperature of the display panel for temperature compensation.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.23 no.6
• /
• pp.988-994
• /
• 1986

We present an automated CMOS standard cell design mehtodology which generates a mask description in the CIF (Caltech Intermediate Form)from a user-given logic description and design rule. The resultant layout reflects the user's choice among N-well, P-well and twin-well process and user's decision whether the guard band is to be included or not. Noise margin of each cell was improved by carefully adjusting the channel width of P-FET.

• The Transactions of the Korean Institute of Electrical Engineers A
• /
• v.48 no.10
• /
• pp.1317-1326
• /
• 1999

As the integration ratio and operation speed increase, it has become an important problem to estimate the dissipated power during the design procedure as a method to reduce the TTM(time to market). This paper proposed a prediction model to estimate the maximum dissipated power of a CMOS logic gate. This model uses a calculational method. It was formed by including the characteristics of MOSFETs of which a CMOS gate consists, the operational characteristics of the gate, and the characteristics of the input signals. As the modeling process, a maximum power estimation model for CMOS inverter was formed first, and then a conversion model to convert a multiple input CMOS gate into a corresponding CMOS inverter was proposed. Finally, the power model for inverter was applied to the converted result so that the model could be applied to a general CMOS gate. For experiment, several CMOS gates were designed in layout level by $0.6{\mu}m$ layout design rule. The result by comparing the calculated results with those from HSPICE simulations for the gates showed that the gate conversion model has within 5% of the relative error rate to the SPICE and the maximum power estimation model has within 10% of the relative error rate. Thus, the proposed models have sufficient accuracies. Also in calculation time, the proposed models was more than 30 times faster than SPICE simulation. Consequently, it can be said that the proposed model could be used efficiently to estimate the maximum dissipated power of a CMOS logic gate during the design procedure.

• Journal of Sensor Science and Technology
• /
• v.28 no.2
• /
• pp.71-75
• /
• 2019

This paper proposes the extension of the dynamic range in complementary metal oxide semiconductor (CMOS) image sensors (CIS) using switching operation of in-pixel inverter. A CMOS inverter is integrated in each unit pixel of the proposed CIS for switching operations. The n+/p-substrate photodiode junction capacitances are added to each unit pixel. When the output voltage of the photodiode is less than half of the power supply voltage of the CMOS inverter, the output voltage of the CMOS inverter changes from 0 V to the power supply voltage. Hence, the output voltage of the CMOS inverter is adjusted by changing the supply voltage of the CMOS inverter. Thus, the switching point is adjusted according to light intensity when the supply voltage of the CMOS inverter changes. Switching operations are then performed because the CMOS inverter is integrated with in each unit pixel. The proposed CIS is composed of a pixel array, multiplexers, shift registers, and biasing circuits. The size of the proposed pixel is $10{\mu}m{\times}10{\mu}m$. The number of pixels is $150(H){\times}220(V)$. The proposed CIS was fabricated using a $0.18{\mu}m$ 1-poly 6-metal CMOS standard process and its characteristics were experimentally analyzed.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2012.05a
• /
• pp.880-883
• /
• 2012

In this paper, CMOS logic device, the INVERTER, NAND, NOR were designed and fabricated using 0.18um CMOS process for analyzing the effect of transient radiation damage. Fabricated logic devices were measured by applying a 1kHz input at 1.8V supply. As a result, the current consumption of less than 70uA and Rising time, Falling time was within a 4us. Experimental results transmission delays occurred when using a 50M cable for pulse radiation experiments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.4
• /
• pp.267-272
• /
• 2010

In this paper, a Gm-C LPF utilizing common-mode feedforward (CMFF) CMOS inverter type operational transconductance amplifier (OTA) has been designed and verified by circuit simulations. The CMFF CMOS inverter OTA was optimized for wide input linearity and low current consumption using a standard 0.18 ${\mu}m$ CMOS process; gm of 100 ${\mu}S$ and current of 100 ${\mu}A$ at supplied voltage of 1.3 V. Using this optimized CMFF CMOS inverter type OTA, an elliptic 5th order Gm-C LPF for GPS specifications was designed. Gain and frequency tuning of the LPF was done by changing the internal supply voltages. The designed Gm-C LPF gave pass-band ripple of 1.6 dB, stop-band attenuation of 60.8 dB, current consumption of 0.60 mA at supply voltage of 1.2 V. The gain and frequency characteristics of designed Gm-C LPF was unchanged even though the input common-mode voltage is varied.