• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.5
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• pp.219-225
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• 2014

This paper describes an IC for Power Factor Correction. It can use electrical appliances which convert power from AC to DC. The power factor can be influenced not only phase difference of voltage and current but also sudden change of current waveform. This circuit enables current wave supplied to load by close to sinusoidal and minimum phase difference of voltage and current waveform. A self oscillated 10[kHz]~100[kHz] pulse signal converted to PWM waveform and it chops rectified full wave AC power which flows to load device. The multiplier and zero current detector circuit, UVLO, OVP, BGR circuits were designed. This IC has been designed and whole chip simulation use 0.5[um] double poly, double metal 20[V] CMOS process.

• Journal of IKEEE
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• v.18 no.2
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• pp.263-271
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• 2014

This paper presents design of the second-order sigma-delta modulator for converting voltage and temperature signals to digital ones in Battery Management IC (BMIC) for mobile applications. The second-order single-loop switched-capacitor sigma-delta modulator with 1-bit quantization in 0.13-um CMOS technology is proposed. The proposed modulator is designed using switched-opamp technique for saving power consumption. With an oversampling ratio of 256 and clock frequency of 256kHz, the modulator achieves a measured 83-dB dynamic range and a peak signal-to-(noise+distortion) ratio (SNDR) of 81.7dB. Power dissipation is about 0.66 mW at 3.3 V power supply and the occupied core area is $0.425mm^2$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.221-228
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• 2011

This paper describes 250-Mb/s fiber optic transmitter and receiver ICs for plastic optical fiber applications using a$ 0.18-{\mu}m$ CMOS technology. Simple signal and light detection schemes are introduced for power reduction in sleep mode. The transmitter converts non-return-to-zero digital data into 650-nm visible-red light signal and the receiver recovers the digital data from the incident light signal through up to 50-m plastic optical fiber. The transmitter and receiver ICs occupy only 0.62 $mm^2$ of area including electrostatic discharge protection diodes and bonding pads. The transmitter IC consumes 23 mA with 20 mA of LED driving currents, and the receiver IC consumes 16 mA with 4 mA of output driving currents at 250 Mb/s of data rate from a 3.3-V supply in active mode. In sleep mode, the transmitter and receiver ICs consume only 25 ${\mu}A$ and 40 ${\mu}A$, respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.88-93
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• 2004

We, for the first time, present novel test patterns and conclusive on-chip data indicating that the variation of coupling capacitance, ${\Delta}C_C$ by crosstalk can be larger than static coupling capacitance, $C_C$. The test chip is fabricated using a generic 150 nm CMOS technology with 7 level metallization. It is also shown that ${\Delta}C_C$ is strongly dependent on the phase of aggressive lines. For antiphase crosstalk ${\Delta}C_C$ is always larger than $C_C$ while for in-phase crosstalk $D_{\Delta}C_C$is smaller than $C_C$.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.3124-3126
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• 2000

The application of IR(Infrared) communication is very wide and IR receiver has become a standard of home entertainment. A preamplifier with single 5V supply was designed for IR receiver IC. To operate at long distance, receiver IC should have high gain and low noise characteristic. To provide constant output signal magnitude, independent of transciever distance, gain limiting stage is needed. And to cut-off DC noise component effectively, large resistance and capacitance are required. Transimpedance type preamplifier, and diode limiting amplifier, and current limiting amplifier were designed. It is another function of current limiting amplifier that transforms single input signal to differential output signal. Using AMS BiCMOS model, both BJT version and MOS version was designed. Total power consumption is O.lmW, and IC size is $0.3mm^2$

• Journal of IKEEE
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• v.13 no.2
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• pp.208-215
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• 2009

The high efficiency power management IC(PMIC) with DT-CMOS(Dynamic Threshold voltage MOSFET) switching device for portable application is proposed in this paper. Because portable applications need high output voltages and low output voltage, Boost converter and Buck converter are embedded in One-chip. PMIC is controlled with PWM control method in order to have high power efficiency at high current level. DTMOS with low on-resistance is designed to decrease conduction loss. Boost converter and Buck converter, are based on Voltage-mode PWM control circuits and low on-resistance switching device, achieved the high efficiency near 92.1% and 95%, respectively, at 100mA output current. And Step-down DC-DC converter in stand-by mode below 1mA is designed with LDO in order to achive high efficiency.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.18 no.3
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• pp.397-409
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• 1993

This paper proposed the design methodology of the 8 bit binary parallel adder with carry book-ahead scheme via current-mode CMOS multivalued logic and simulated the proposed adder under $5{\mu}m$ standard IC process technology. The threshold conditions of $G_K$ and $P_K$ which are needed for m-valued parallel adder with CLA are evaluated and adopted for quaternary logic. The design of quaternary CMOS logic circuits, encoder, decoder, mod-4 adder, $G_K$ and $P_K$ detecting circuit and current-voltage converter is proposed and is simulated to prove the operations. These circuits are necessary for binary arithmetic using multivalued logic. By comparing with the conventional binary adder and the CCD-MVL adder, We show that the proposed adder cab be designed one look-ahead carry generator with 1-level structure under standard CMOS technology and confirm the usefulness of the proposed adder.

• Journal of IKEEE
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• v.2 no.2 s.3
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• pp.309-315
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• 1998

This paper describes an 8b 52 MHz CMOS subranging analog-to-digital converter (ADC) for Integrated Services Digital Network (ISDN) applications. The proposed ADC based on the improved time-interleaved architecture removes the holding time which is typically observed in the conventional double-channel subranging ADCs to increase throughput rate. Moreover, the ADC employs the interpolation technique in the back-end subranging ADCs far residue signal processing to minimize die area and power consumption. The fabricated and measured prototype ADC in a 0.8 um n-well double-poly double-metal CMOS process typically shows a 52 MHz sampling rate at a 5 V supply voltage with 230 mW, and a 40 MHz sampling rate at a 3 V power supply with 60 mW power consumption.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.236-244
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• 2003

In this paper, RF and IF circuits for mobile terminals which have usually been implemented using expensive BiCMOS processes are designed using CMOS circuits, and a Tx CMOS RF/IF single chip for PCS applications is designed. The designed circuit consists of an IF block including an IF PLL frequency synthesizer, an IF mixer, and a VGA and an RF block including a SSB RF mixer and a driver amplifier, and performs all transmit signal processing functions required between digital baseband and the power amplifier. The phase noise level of the designed IF PLL frequency synthesizer is -114dBc/Hz@100kHz and the lock time is less than $300{\mu}s$. It consumes 5.3mA from a 3V power supply. The conversion gain and OIP3 of the IF mixer block are 3.6dB and -11.3dBm. It consumes 5.3mA. The 3dB frequencies of the VGA are greater than 250MHz for all gain settings. The designed VGA consumes 10mA. The designed RF block exhibits a gain of 14.93dB and an OIP3 of 6.97dBm. The image and carrier suppressions are 35dBc and 31dBc, respectively. It consumes 63.4mA. The designed circuits are under fabrication using a $0.35{\mu}m$ CMOS process. The designed entire chip consumes 84mA from a 3V supply, and its area is $1.6㎜{\times}3.5㎜$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.2
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• pp.397-407
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• 2015

In this paper, we designed 1 chip IC for 3-axis gyroscope and 3-axis accelerometer used for various IoT/M2M mobile devices such as smartphone, wearable device and etc. We especially focused on analysis of gyroscope noise and proposed new architecture for removing various noise generated by gyroscope MEMS and IC. Gyroscope, accelerometer and geo-magnetic sensors are usually used to detect user motion or to estimate moving distance, direction and relative position. It is very important element to designing a low noise IC because very small amount of noise may be accumulated and affect the estimated position or direction. We made a mathematical model of a gyroscope sensor, analyzed the frequency characteristics of MEMS and circuit, designed a low noise, compact and low power 1 chip 6-axis inertial sensor IC including 3-axis gyroscope and 3-axis accelerometer. As a result, designed IC has 0.01dps/${\sqrt{Hz}}$ of gyroscope sensor noise density.