• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.239-242
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• 1999

In this paper, we report the process/device design of high-speed, high-voltage SOI smart power IC for mobile communication system, high-speed HDD system and the electronic control system of automobiles. The high voltage LDMOS with 70V breakdown voltage under 0.8${\mu}{\textrm}{m}$ design rule, the high voltage bipolar with 40V breakdown voltage for analog signal processing, the high speed bipolar with cut-off frequency over 20㎓ and LDD NMOS for high density were proposed and simulated on a single chip by the simulator DIOS and DESSIS. And we extracted the process/device parameters of the simulated devices.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.621-622
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• 2006

This paper presents the design of LVDS(Low-Voltage-Differential-Signaling) driver circuit for Gb/s-per-pin operation using BiCMOS process technology. To reduce chip area, LVDS driver's switching devices were replaced with lateral bipolar devices. The designed lateral bipolar transister's common emitter current gain($\beta$) is 20 and device's emitter size is 2*10um. Also the proposed LVDS driver is operated at 2.5V and the maximum data rate is 2.8Gb/s approximately.

• Journal of Power Electronics
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• v.15 no.3
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• pp.610-620
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• 2015

An inherent zero-voltage and zero-current-switching phase-shifted full-bridge converter with reverse-blocking insulated-gate bipolar transistor (IGBT) or non-punch-through IGBT is proposed in this paper. This converter not only ensures that the switches in the lagging leg works at zero-current switching, but also minimizes circulating conduction loss without any additional auxiliary circuits. A 1.2 kW hardware prototype is designed, fabricated, and tested to verify the proposed topology. The control loop design procedures with small-signal models are also presented. A simple, low-cost, and robust democratic current-sharing circuit is also introduced and verified in this study. The proposed converter is a suitable alternative for compact, cost-effective applications with high-voltage input.

• Journal of Power Electronics
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• v.15 no.3
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• pp.685-694
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• 2015

The power loss of the controllable switches in modular multilevel converter (MMC) HVDC transmission systems is an important factor, which can determine the design of the operating junction temperatures. Due to the dc current component, the approximate calculation tool provided by the manufacturer of the switches cannot be used for the losses of the switches in the MMC. Based on the enabled probabilities of each SM in an arm, the current analytical models of the switches can be determined. The average and RMS currents can be obtained from the corresponding current analytical model. Then, the conduction losses can be calculated, and the switching losses of the switches can be estimated according to the upper limit of the switching frequency. Finally, the thermal resistance model of the switches can be utilized, and the junction temperatures can be estimated. A comparison between the calculation and PSCAD simulation results shows that the proposed method is effective for estimating the junction temperatures of the switches in the MMC.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.907-911
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• 2006

In this paper, we propose a new structure that improves the on-state voltage drop and switching speed in Insulated Gate Bipolar Transistors(IGBTs), which can be widely used in high voltage semiconductors. The proposed structure is unique in that the collector area is divided by $SiO_2$, whereas the conventional IGBT has a planar P+ collector structure. The process and device simulation results show remarkably improved on-state and switching characteristics. Also, the current and electric field distribution indicate that the segmented collector structure has increased electric field near the $SiO_2$ corner, which leads to an increase of electron current. This results in a decrease of on-state resistance and voltage drop to $30%{\sim}40%$. Also, since the area of the P+ region is decreased compared to existing structures, the hole injection decreases and leads to an increase of switching speed to 30 %. In spite of some complexity in process procedures, this structure can be manufactured with remarkably improved characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.491-496
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• 2014

The resistive switching characteristics of resistive random access memory (ReRAM) based on amorphous $Ge_{0.5}Se_{0.5}$ thin films have been demonstrated by using Ti/Ag nanocrystals/$Ge_{0.5}Se_{0.5}$/Pt structure. Ag nanocrystals (Ag NCs) were spread on the amorphous $Ge_{0.5}Se_{0.5}$ thin film and they played the role of metal ions source. As a result, comparing the conventional Ag/$Ge_{0.5}Se_{0.5}$/Pt structure, this Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt ReRAM device exhibits the highly uniform bipolar resistive switching (BRS) characteristics, such as the operating voltages, and the resistance values. At the same time, a stable DC endurance(> 100 cycles), and the excellent data retention (> $10^4$ sec) properties were found from the Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt structured ReRAM device.

• Journal of Power Electronics
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• v.15 no.2
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• pp.299-308
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• 2015

This study proposes four novel pulse width modulation (PWM) shoot-through control methods for impedance source (IS) galvanically isolated DC-DC converters. These methods are derived from a PWM control method with shifted shoot-through introduced by the authors in 2012. In contrast to the baseline solution, where the shoot-through states are generated by the simultaneous conduction of all transistors in the inverter bridge, our new approach is based on the shoot-through generation by one inverter leg. The idea is to increase the number of soft-switched transients and, therefore, decrease the dynamic losses of the front-end inverter. All the proposed approaches are experimentally verified through an insulated-gate bipolar transistor-based IS DC-DC converter. Conclusions are drawn in accordance with the results of the switching loss analysis.

• Journal of the Korean Physical Society
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• v.73 no.9
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• pp.1356-1361
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• 2018

Replacing conventional Si diodes with SiC diodes in Si insulated gate bipolar transistor (IGBT) modules is advantageous as it can reduce power losses significantly. Also, the fast switching nature of the SiC diode will allow Si IGBTs to operate at their full high-switching-speed potential, which at present conventional Si diodes cannot do. In this work, the electrical test results for Si-IGBT/4HSiC-Schottky hybrid substrates (hybrid SiC substrates) are presented. These substrates are built for two voltage ratings, 1.7 kV and 3.3 kV. Comparisons of the 1.7 kV and the 3.3 kV Si-IGBT/Si-diode substrates (Si substrates) at room temperature ($20^{\circ}C$, RT) and high temperature ($H125^{\circ}C$, HT) have shown that the switching losses in hybrid SiC substrates are miniscule as compared to those in Si substrates but necessary steps are required to mitigate the ringing observed in the current waveforms. Also, the effect of design variations on the electrical performance of 1.7 kV, 50 A diodes is reported here. These variations are made in the active and termination regions of the device.

• Journal of Power Electronics
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• v.15 no.6
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• pp.1609-1618
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• 2015

DC microgrids are considered as prospective systems because of their easy connection of distributed energy resources (DERs) and electric vehicles (EVs), reduction of conversion loss between dc output sources and loads, lack of reactive power issues, etc. These features make them very suitable for future industrial and commercial buildings' power systems. In addition, the bipolar-type dc system structure is more popular, because it provides two voltage levels for different power converters and loads. To keep voltage balanced in such a dc system, a bidirectional dual buck-boost voltage balancer with direct coupling is introduced based on P-cell and N-cell concepts. This results in greatly enhanced system reliability thanks to no shoot-through problems and lower switching losses with the help of power MOSFETs. In order to increase system efficiency and reliability, a novel burst-mode control strategy is proposed for the dual buck-boost voltage balancer. The basic operating principle, the current relations, and a small-signal model of the voltage balancer are analyzed under the burst-mode control scheme in detail. Finally, simulation experiments are performed and a laboratory unit with a 5kW unbalanced ability is constructed to verify the viability of the bidirectional dual buck-boost voltage balancer under the proposed burst-mode control scheme in low-voltage bipolar-type dc microgrids.

• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1471-1481
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• 2014

This paper presents the new power dissipation model of individual switching device in a high-level modular multilevel converter (MMC), which can be mostly used in voltage sourced converter (VSC) based high-voltage direct current (HVDC) system and flexible AC transmission system (FACTS). Also, the voltage balancing method based on sorting algorithm is newly proposed to advance the MMC functionalities by effectively adjusting switching variations of the sub-module (SM). The proposed power dissipation model does not fully calculate the average power dissipation for numerous switching devices in an arm module. Instead, it estimates the power dissipation of every switching element based on the inherent operational principle of SM in MMC. In other words, the power dissipation is computed in every single switching event by using the polynomial curve fitting model with minimum computational efforts and high accuracy, which are required to manage the large number of SMs. After estimating the value of power dissipation, the thermal condition of every switching element is considered in the case of external disturbance. Then, the arm modeling for high-level MMC and its control scheme is implemented with the electromagnetic transient simulation program. Finally, the case study for applying to the MMC based HVDC system is carried out to select the appropriate insulated-gate bipolar transistor (IGBT) module in a steady-state, as well as to estimate the proper thermal condition of every switching element in a transient state.