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http://dx.doi.org/10.6113/JPE.2015.15.3.685

Power Loss and Junction Temperature Analysis in the Modular Multilevel Converters for HVDC Transmission Systems  

Wang, Haitian (Department of DC Power Transmission Technology, State Grid Smart Grid Research Institute)
Tang, Guangfu (Department of DC Power Transmission Technology, State Grid Smart Grid Research Institute)
He, Zhiyuan (Department of DC Power Transmission Technology, State Grid Smart Grid Research Institute)
Cao, Junzheng (Department of DC Power Transmission Technology, State Grid Smart Grid Research Institute)
Publication Information
Journal of Power Electronics / v.15, no.3, 2015 , pp. 685-694 More about this Journal
Abstract
The power loss of the controllable switches in modular multilevel converter (MMC) HVDC transmission systems is an important factor, which can determine the design of the operating junction temperatures. Due to the dc current component, the approximate calculation tool provided by the manufacturer of the switches cannot be used for the losses of the switches in the MMC. Based on the enabled probabilities of each SM in an arm, the current analytical models of the switches can be determined. The average and RMS currents can be obtained from the corresponding current analytical model. Then, the conduction losses can be calculated, and the switching losses of the switches can be estimated according to the upper limit of the switching frequency. Finally, the thermal resistance model of the switches can be utilized, and the junction temperatures can be estimated. A comparison between the calculation and PSCAD simulation results shows that the proposed method is effective for estimating the junction temperatures of the switches in the MMC.
Keywords
Analytical model; Conduction losses; Insulated gate bipolar transistors (IGBT); Junction temperature; Modular multilevel converters (MMC); Switching frequency; Switching losses;
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