• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.363-363
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• 2010

After oxide wet etch with BOE(Buffered Oxide Etchant), triangle type defect maps were inspected and SEM image showed them unetch of oxide layer. As decreasing design rule, oxide unetch has become a crucial issue and has affected the yield and quality.

• Progress in Medical Physics
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• v.25 no.2
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• pp.116-121
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• 2014

Next future, The bio technology will be a rapidly developing. This paper is the scattering beam measurement of the red blood cell (RBC) and the fabrication of the micro cell biochip using the bio micro electro mechanical system (Bio-MEMS) process technology. The Major process method of Bio-MEMS technology was used the buffered oxide etchant (BOE), electro chemical discharge (ECD) and ultraviolet sensitive adhesives (UVSA). All experiments were the 10 times according to the process conditions. The experiment and research are required the ultraviolet expose, the micro fluid current, the cell control and the measurement of the output voltage Vpp (peak to peak) waveform by scattering angles. The transmitting and receiving of the laser beam was used the single mode optical fiber. The principles of the optical properties are as follows. The red blood cells were injected into the micro channel. The single mode optical fiber was inserting in the guide channel. The He-Ne laser beam was focusing in the single mode optical fiber. The transmission He-Ne laser beam is irradiating to the red blood cells. The manufactured guide channel consists of the four inputs and the four outputs. The red blood cell was allowed with the cylinder pump. The output voltage Vpp waveform of the scattering beam was measured with a photo detector. The receiving angle of the output optical fiber is $0^{\circ}$, $5^{\circ}$, $10^{\circ}$, $15^{\circ}$. The magnitude of the output voltage Vpp waveform was measured in the decrease according to increase of the reception angles. The difference of the output voltage Vpp waveform is due differences of the light transmittance of the red blood cells.

• Korean Journal of Metals and Materials
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• v.47 no.11
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• pp.748-753
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• 2009

The surface morphology and the surface roughness of n-type SiC induced by wet-treatment using 45% KOH and buffered oxide etchant (BOE-1HF : $6H_2O$) were investigated by atomic force microscopy (AFM). While Si-face of SiC could be etched by alkali solutions such as KOH, acidic solutions such as BOE were hardly able to etch SiC. When the rough SiC samples were used, the surface roughness of etched sample was decreased after wet-treatment regardless of etchant, due to the planarization the of surface by widening of scratches formed by mechanical polishing. It was observed that the initial etching was affected by the energetically unstable sites, such as dangling bond and steps. However, when a relatively smooth sample was used, the surface roughness was rapidly increased after treatment at $180^{\circ}C$ for 1 hr and at room temperature for 4 hr by using KOH solution, resulting from the nano-sized structures such as pores and bumps. This indicates that porous SiC surface can be achieved by using purely chemical treatment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.151-154
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• 2004

화합물 반도체 단일 나노선의 에칭 효과를 보기 위하여 에칭 용액과 시간을 달리하면서 전류-전압 특성을 측정하였다. 측정을 위한 단일 나노선 소자는 Electron beam lithography를 이용하여 전극을 top contact 방식으로 만들었다. 에칭은 식각과정에서 현상된 상태의 패턴에서 수행하며 금속 전극과 나노선 접합 부분만을 에칭 하였다. 에칭용액은 Buffered Oxide Etchant(BOE)을 이용하였으며 에칭 시간은 수 십초에서 수 십분까지 다양하게 하였다. 전압-전류 특성 측정결과에서 에칭 용액과 에칭 시간에 따라 전류가 증가하는 것을 확인 할 수 있었다. 이러한 효과는 나노선 외곽에 비정질 산화층의 제거 효과로 인한 것으로 설명할 수 있다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.121-122
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• 2011

광도파로 기반 센서의 성능을 개선시키기 위해서는 코어와 클래딩 층의 굴절률 차를 크게 하여 표면감도를 향상시켜야 한다. 이를 위해 센서용 광도파로 코어 층을 위한 고굴절률 SiNx 박막을 플라즈마 화학기상증착(PECVD, plasma enhanced chemical vapor deposition)법을 이용하여 성장한 후 그 표면특성을 분석하였다. 이 때 플라즈마 화학기상증착 공정 조건 중 NH3 가스를 제외하여 Si 성분이 많은 고굴절률 SiNx 박막의 성장을 유도하고 He/SiH4 가스유량비를 0에서 100까지 변화시켜 SiNx 박막의 표면거칠기를 제어하였다. Si기판 위에 SiNx 박막을 10분 성장 후 BOE(buffered oxide etchant)로 선택식각하여 그 박막두께를 alpha step으로 측정하는 방법으로 He/SiH4 가스유량비 조건별 박막성장률을 계산하였다. 그 결과 He/SiH4 가스유량비 증가함에 따라 박막성장률이 33 nm/min에서 19 nm/min으로 선형적인 감소함을 알 수 있었다. 박막두께가 190 nm가 되도록 He/SiH4 가스유량비 조건별 SiNx 박막을 성장한 후 그 표면특성을 AFM (atomic force microscope)으로 관찰하였다. 이를 통해 He/SiH4 가스유량비가 50일 때 SiNx 박막의 표면거칠기가 최소가 됨을 알 수 있었다.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.91-94
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• 2011

This paper presents light transmission efficiency by optical adhesive thickness between MLA and aperture layer and by aperture hole size. The gap between MLA and Aperture layer is adjusted by the shim. The more optical adhesive thickness increases, the better light transmission efficiency increases up to a point. After that, the light transmission efficiency decreases because stray lights cannot transmit through the aperture layer owing to cut-off by aperture layer. And as a result of light transmission efficiency with changing aperture hole size, the light transmission efficiency is proportional to area of aperture hole. The more specified process is made, the better data and sample will be got.

• Journal of Sensor Science and Technology
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• v.11 no.3
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• pp.183-190
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• 2002

Photoluminescence(PL) properties of $Si^+$-implanted $SiO_2$ film, which was thermally grown on c-Si substrate, is reported. We have compared room temperature photoluminescence (PL) spectra of the samples which was made in several kinds of implantation, subsequent annealing and $SiO_2$ film thickness. XRD data was correlated with the PL spectra. Silicon nanocrystals in $SiO_2$ film is considered as the origin of the photoluminescence. PL spectra was investigated after wet etching of the $SiO_2$ film by using BOE (Buffered Oxide Etchant) at every one minute. PL peak wavelength was varied as the etching is proceeded. These results indicate that the quantity and the distribution of dominant size of Si nanocrystals in $SiO_2$ film seem to have a direct effect on PL spectrum.

• Journal of Sensor Science and Technology
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• v.22 no.4
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• pp.244-248
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• 2013

The discovery of a two-dimensional electron gas (2DEG) in $LaAlO_3$ (LAO)/$SrTiO_3$ (STO) heterostructure has stimulated intense research activity. We suggest a new structure model based on $KNbO_3$ (KNO) material. The KNO thin films were grown on $TiO_2$-terminated STO substrates as a p-type structure ($NbO_2/KO/TiO_2$) to form a two-dimensional hole gas (2DHG). The STO thin films were grown on KNO/$TiO_2$-terminated STO substrates as an n-type structure to form a 2DEG. Oxygen pressure during the deposition of the KNO and STO thin films was changed so as to determine the effect of oxygen vacancies on 2DEGs. Our results showed conducting behavior in the n-type structure and insulating properties in the p-type structure. When both the KNO and STO thin films were deposited on a $TiO_2$-terminated STO substrate at a low oxygen pressure, the conductivity was found to be higher than that at higher oxygen pressures. Furthermore, the heterostructure formed at various oxygen pressures resulted in structures with different current values. An STO/KNO heterostructure was also grown on the STO substrate, without using the buffered oxide etchant (BOE) treatment, so as to confirm the effects of the polar catastrophe mechanism. An STO/KNO heterostructure grown on an STO substrate without BOE treatment did not exhibit conductivity. Therefore, we expect that the mechanics of 2DEGs in the STO/KNO heterostructures are governed by the oxygen vacancy mechanism and the polar catastrophe mechanism.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.353-353
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• 2012

InAs nanowires (NWs)는 나노소자스케일의 전자소자나 광전자소자를 위한 기본 단위(building block)로 사용될 수 있고, 1차원적 나노구조를 가지면서 나타나는 특별한 전기적, 광학적 특성으로 인해 전계효과 트랜지스터, 레이저, 광발광 다이오드, 가스 검출 센서 등의 많은 응용소자로 활용을 위한 연구가 진행되 있으며 주로 실리콘, 갈륨비소 기판 위에 금속유기기상 증착(MOCVD) 또는 분자선 증착 (MBE)을 이용하여 선택적 수직배열 성장 조절을 위한 연구와 특성 평가 연구가 주로 이뤄지고 있다. 본 연구에서는 InAs NWs를 MBE 장치를 이용하여 Si(111) 기판 위에 Au와 같은 촉매를 사용하지 않고 Si과 InAs의 큰 격자 불일치로 인하여 성장되는 Volmer-weber 성장 모드를 이용 하였다. InAs NW 성장모드는 Si ($5.4309{\AA}$)과 InAs ($6.0584{\AA}$) 사이에 큰 격자상수 차이를 이용하게 되는데 촉매를 사용하여 성장하는 일반적인 이종 화합물 반도체 성장 모드와 달리 액상상태가 존재하지 않고 바로 In과 As이 Si 기판 위를 이동하여 수직방향으로 성장이 이루어지는 vaporsolid(VS) 모드이다. InAs NW V-S 성장 모드는 Si 기판과의 격자 상수차에 의한 스트레스를 이용해야 하므로 Si기판 위에 존재하는 native oxide는 완벽히 제거되어야 한다. InAs NW 최적 성장 조건을 찾기위해 V/III raitio, 성장 온도, 기판표면처리 등의 성장 변수를 변화 시켜가며 실험을 수행하였다. Native oxide를 제거하기 위하여 HF와 buffered oxide etchant (BOE)를 사용하였다. InAs NWs 성장조건은 Indium flux를 고정 시키고 V/III ratio는 50~400까지 변화를 주었다. V/III ratio를 200으로 고정을 시키고 성장온도를 $375{\sim}470^{\circ}C$에서 성장 하였다. 이 때 InAs NWs는 $430^{\circ}C$에서 가장 높은 밀도와 aspect ratio를 얻을 수 있었다. Arsenic flux에 대해서는 많을 수록 좋은 aspect ratio를 얻을 수 있었다. 하지만 InAs 구조의 절대 부피는 거의 같다는 것을 확인 할 수 있었고 이는 온도와 V/III ratio가 Indium adatom의 surface migration length에 대하여 중요한 요소로 작용되는 것을 알 수 있었다.