• 한국정보통신학회논문지
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• 제6권5호
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• pp.689-695
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• 2002

막질의 조성은 공정 개발과 고품질 생산 적용을 위한 반도체 소자의 제조에 있어서 풍요한 요소의 하나 이다. 막의 표면과 계면의 조성은 기본적으로 AES측 통하여 알 수 있다. 본 연구에서는 온도, DCS post flow, shower head life time 등과 같은 공정조건으로 LPCVD법을 이용한 tungsten suicide 박막을 증착하고 이들의 구조적, 전기적 특성과 조성비를 측정하며 WSix박막을 해석하였고 이로부터 Si/W의 조성비를 비교하였다. Si와 W의 조성비는 DCS post flow에 의하여 WSix박막의 표면에서 증가하였으며, 폴리실리콘과 tungsten silicide 계면에서는 온도의 증가에 따라 조성비가 증가함을 알 수 있었다. 이 결과는 메모리 소자 제조의 WSix 박막 증착의 공정조건 최적화에 적용될 수 있다.

• 한국표면공학회지
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• 제27권5호
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• pp.261-272
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• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• 한국재료학회지
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• 제31권2호
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.32-35
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• 2000

Oxide-nitride-oxide(ONO) structures were formed by sequential radio frequency reactive magnetron sputtering method. The chemical composition and structure of these films were studied by using of secondary ion mass spectroscopy(SIMS) and Auger electron spectroscopy(AES) SIMS and AES experiments show the existence of nitridation at the SiO$_2$/Si substrate. The electrical characteristics of ONO films were evaluated by I-V and high frequency C-V measurements When the ONO films were annealed at 90$0^{\circ}C$ for 30 sec in $N_2$ ambient, the breakdown voltage increased and flat-band voltage decreased under high electric field.

• 한국진공학회지
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• 제6권S1호
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• pp.96-109
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• 1997

In order to simulate the corrosion behavior of Zr-4 alloy in pressurized water reactors it was implanted (or bombarded) with 190ke V $Zr^+\; and \;Ar^+$ ions at liquid nitrogen temperature and room temperature respectively up to a dose of $5times10^{15} \sim 8\times10^{16} \textrm{ions/cm}^2$ The oxidation behavior and electrochemical vehavior were studied on implanted and unimplanted samples. The oxidation kinetics of the experimental samples were measured in pure oxygen at 923K and 133.3Pa. The corrosion parameters were measured by anodic polarization methods using a princeton Applied Research Model 350 corrosion measurement system. Auger Electron Spectroscopy (AES) and X-ray Photoelectric Spectroscopy (XPS) were employed to investigate the distribution and the ion valence of oxygen and zirconium ions inside the oxide films before and after implantation. it was found tat: 1) the $Zr^+$ ion implantation (or bombardment) enhanced the oxidation of Zircaloy-4 and resulted in that the oxidation weight gain of the samples at a dose of $8times10^{16}\textrm{ions/cm}^2$ was 4 times greater than that of the unimplantation ones;2) the valence of zirconium ion in the oxide films was classified as $Zr^0,Zr^+,Zr^{2+},Zr^{3+}\; and \;Zr^{4+}$ and the higher vlence of zirconium ion increased after the bombardment ; 3) the anodic passivation current density is about 2 ~ 3 times that of the unimplanted samples; 4) the implantation damage function of the effect of ion implantation on corrosion resistance of Zr-4 alloy was established.

• Nuclear Engineering and Technology
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• 제35권6호
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• pp.507-514
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• 2003

Recently dry decontamination/surface-cleaning technology using plasma etching has been focused in the nuclear industry. In this study, the applicability of this new dry processing technique are experimentally investigated by examining the etching reaction of $UO_2$, Co, and Mo in r.f. plasma with the etchant gas of $CF_4/O_2$ mixture. $UO_2$ is chosen as a representing material for uranium and TRU (TRans-Uranic) compounds while metallic Co and Mo are selected because they are the principal contaminants in the used metallic nuclear components such as valves and pipes made of stainless steel or inconel. Results show that in all cases maximum etching rate is achieved when the mole fraction of $UO_2\;in\;CF_4/O_2$ mixture gas is $20\%$, regardless of temperature and r.f. power. In case of $UO_2$, the highest etching reaction rate is greater than 1000 monolayers/min. at $370^{\circ}C$ under 150 W r.f. power which is equivalent to $0.4{\mu}m/min$. As for Co, etching reaction begins to take place significantly when the temperature exceeds $350^{\circ}C$. Maximum etching rate achieved at $380^{\circ}C\;is\;0.06{\mu}m/min$. Mo etching reaction takes place vigorously even at relatively low temperature and the reaction rate increases drastically with increasing temperature. Highest etching rate at $380^{\circ}C\;is\;1.9{\mu}m/min$. According to OES (Optical Emission Spectroscopy) and AES (Auger Electron Spectroscopy) analysis, primary reaction seems to be a fluorination reaction, but carbonyl compound formation reaction may assist the dominant reaction, especially in case of Co and Mo. Through this basic study, the feasibility and the applicability of plasma decontamination technique are demonstrated.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.48-48
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• 1999

티타늄 알루미나이드 합금은 이들의 강도나 고온 특성 때문에 초음속 비행기의 구조물질이나 수소를 연료로 사용하는 비행기의 엔진물질로 각광받고 있다. 그러나 티타늄 알루미나이드 합금들은 이들이 갖는 규칙적인 미세구조로 인하여 실온에서 낮은 연성을 나타내는 단점이 있다. 실온에서 낮은 연성을 갖는 티타늄 알루미나이드 합금의 단점은 텅스텐, 물리브덴, 니오비움, 탄타륨, 바나디움 등의 베타 안정화 물질들을 첨가함으로서 어느정도 극복되고 있다. 따라서 티타늄 알루미나이드 합금이 초음속 비행기의 구조 물질이나 수소를 사용하는 엔진 물질로 사용되기 위해서는 이 물질들의 산화연구가 필수적이다. 지금까지 티타늄의 산화연구에서 알루미늄이나 니오비움의 역할에 대해서는 여러 연구자들이 연구를 한 바 있다. Chaze와 Coddet는 알루미늄이 티타늄에서 산소의 용해도를 감소시키고, Chen과 Rosa는 니오비움이 티타늄에서 산화물 형성율을 낮춘다는 것을 각각 알아냈다. 그러나 지금까지 티타늄 알루미나이드의 산화연구는 충분하지 못했다. 지금까지 티타늄 알루미나이드의 산화연구에서 밝혀진 산화운동학의 내용은 가열온도와 가열시간에 따라 크게 다른 두 개 혹은 그 이상의 산화물을 갖는다는 것이다. 본 연구의 목적은 여러 가지 티타늄 알루미나이드 합금의 산화특성을 밝히는 것이다. 이를 위하여 첫 번째 실험은 실온 공기 중에서 자연적으로 산화된 여러 가지 티타늄 알루미나이드 합금들($\alpha$2,$\beta$,${\gamma}$)을 초고진공($\leq$10-11Torr)속에 넣고, 시료의 온도를 실온에서 100$0^{\circ}C$까지 변화시키면서 AES(Auger Electron Spectroscopy)와 ISS(Ion Scattering Spectroscopy)를 사용하여 각각의 온도에서 여러 가지 시료들의 표면조성을 조사했다. 두 번째 실험은 티타늄 알루미나이드 시료를 고순도 공기(hydrocarbon$\leq$0.1^g , pp m) 중에서 각각 $600^{\circ}C$에서 100$0^{\circ}C$까지 가열하여 산화시켰다. 이 시료의 산화도는 각각의 가열온도에서 가열시간을 변하시키면서 TGA(Thermogravimetric Apparatus)로 측정했다. 실온 공기중에서 자연적으로 산화된 여러 가지 티타늄 알루미나이드 합금들을 초고진공속에 넣어 100$0^{\circ}C$까지 가열한 실험에서는 이들 시료에 포함된 알루미늄의 양에 따라서 표면 조성이 크게 다른 것을 알 수 있었다. 그리고 고순도 공기 중에서 100$0^{\circ}C$까지 가열하여 산화시킨 티타늄 알루미나이드 산화물의 산화기구는 명백한 3단계 포물선 산화의 특성을 나타냈다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.20-20
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• 1998

I Ion beam technology has recently attracted much interest because it has exciting t technological p아:ential for surface analysis, ion beam mixing, surface cleaning and etching i in thin film growth and semiconductor fabrication processes, etc. Es야~cially, ion beam s sputtering has been widely used for sputter depth profiling with x-photoelectron S spectroscopy (XPS) , Auger electron s$\pi$~troscopy(AES), and secondary-ion mass S야i따oscopy(SIMS). However, The problem of surface compositional ch없1ge due to ion b bombardment remains to be understo여 없ld solved. So far sputtering processes have been s studied by s따face an외ysis tools such as XPS, AES, and SIMS which use the sputtering p process again. It would be improbable to measure the modified surface composition profiles a accurately due to ion beam bombardment with surface analysis techniques based on sputter d depth profiling. However, recently Medium energy ion scattering spectroscopy(MEIS) has b been applied to study the sputtering of solid surface at ion bombardment and has been p proved that it has been extremely valuable in probing the surface composition 뻐d s structure nondestructively and quantita디vely with less than 1.0 nm depth resolution. To u understand the sputtering processes of solid surface at ion bombardment, The Molecular D Dynamics(MD) and Monte Carlo(MC) simulation has been used and give an intimate i insight into the sputtering processes of solid surfaces. In this presentation, the sputtering processes of alloys and compound samples at ion b bombardment will be reviewed and the MEIS results for the Ar+ sputter induced altered l layer of the TazOs thin film 뻐dd없nage profiling of Ar+ ion sputt얹"ed Si(100) surface will b be discussed with the results of MD and MC simulation.tion.

• 한국재료학회지
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• 제9권9호
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• pp.878-882
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• 1999

분자선증착법으로 (0001) 사파이어 기판 위에 $Al_xGa_1-_xN$ 에피층을 AlN 몰비를 변화시키면서 성장시켰다. AlN 몰비는 0.16에서 0.76까지 변화시켰으며 X선의 회절 실험과 Rutherford backscattering spectroscopy 방법을 이용하여 AlN 몰비를 결정하였다. $Al_xGa_1-_xN$ 에피층의 깊이 방향의 조성 변화를 관찰하였으며 스퍼터 시간에 대해 각 원소가 일정한 원자 농도를 가짐을 알 수 있었다. AlN 몰비의 증가에 따른 표면 특성의 변화를 관찰하기 위하여 atomic force microscopy 측정을 수행하였다. 표면에서의 입자 모양이 AlN 몰비가 변화함에 따라 원형에서 침상형태로 변화함을 알 수 있었다. 표면 입자에 대한 root mean square 값과 average roughness 값을 구하였으며 AlN 몰비를 바꿈에 따라 나타나는 변화를 관찰하였다.

• 한국재료학회지
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• 제13권9호
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• pp.567-571
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• 2003

We investigate vanadium (V)-based Ohmic contacts on n-GaN ($N_{d}$=$2.0${\times}$10^{18}$ $cm^{-3}$ ) as a function of annealing temperature. It is shown that the V (60 nm) contacts become Ohmic with specific contact resistances of $10^{-3}$ $- 10^{-4}$ Ω$\textrm{cm}^2$ upon annealing at 650 and $850^{\circ}C$. The V(20 nm)/Ti(60 nm)/Au(20 nm)contacts produce very low specific contact resistances of $2.2 ${\times}$ 10^{-5}$ and$ 4.0${\times}$10^{-6}$ Ω$\textrm{cm}^2$ when annealed at 650 and $850{\circ}C$, respectively. A comparison shows that the use of the overlayers (Ti/Au) is very effective in improving Ohmic property. Based on the current-voltage measurement, Auger electron spectroscopy, glancing angle X-ray diffraction, and X-ray photoemission spectroscopy results, the possible mechanisms for the annealing temperature dependence of the Ohmic behavior of the V-based contacts are described and discussed.d.