• Journal of IKEEE
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• v.25 no.4
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• pp.778-781
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• 2021

In this paper, we propose the 16-layer 3D NAND Flash memory compact modeling using SPICE. In the same structure and simulation conditions, the channel potential about Down Coupling Phenomenon(DCP) and Natural Local Self Boosting (NLSB) were simulated and analyzed with Technology Computer Aided Design(TCAD) tool Atlas(Silvaco^TM) and SPICE, respectively. As a result, it was confirmed that the channel potential of TCAD and SPICE for the two phenomena were almost same. The SPICE can be checked the device structure intuitively by using netlist. Also, its simulation time is shorter than TCAD. Therefore, using SPICE can be expected to efficient research on 3D NAND Flash memory.

• 전자공학회논문지 IE
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• v.46 no.4
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• pp.8-15
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• 2009

In this paper, we are indicated CMOS Image sensor circuit SPICE analysis for the Photo Diode and pixel Modeling. We get a characteristic of the photoelectric current using a device simulator Medici and develop the Photodiode model for applying a SPICE simulation. For verifying the result, We compared the result of SPICE simulation with the result of mixed mode simulation about the testing circuit structure consisted photodiode and NMOS.

• Journal of Power Electronics
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• v.19 no.6
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• pp.1591-1600
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• 2019

In this paper, a practical SPICE model for an IGBT and a PiN diode is proposed based on the Finite Differential Method (FDM). Other than the conventional Fourier model and the Hefner model, the excess carrier distribution can be accurately solved by a fast FDM in the SPICE simulation tool. In order to improve the accuracy of the SPICE model, the Taguchi method is adopted to calibrate the extracted parameters. This paper presents a numerical modelling approach of an IGBT and a PIN diode, which are also verified by SPICE simulations and experiments.

• Journal of information and communication convergence engineering
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• v.14 no.2
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• pp.115-121
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• 2016

Currently there is a lack of literature on SPICE-level models of double-gate (DG) tunnel field-effect transistors (TFETs). A DG TFET compact model is presented in this work that is used to develop a SPICE model for DG TFETs implemented with Verilog-A language. The compact modeling approach presented in this work integrates several issues in previously published compact models including ambiguity about the use of tunneling parameters A_k and B_k, and the use of a universal equation for calculating the surface potential of DG TFETs in all regimes of operation to deliver a general SPICE modeling procedure for DG TFETs. The SPICE model of DG TFET captures the drain current-gate voltage (I_ds-V_gs) characteristics of DG TFET reasonably well and offers a definite computational advantage over TCAD. The general SPICE modeling procedure presented here could be used to develop SPICE models for any combination of structural parameters of DG TFETs.

• Journal of the Korea Safety Management & Science
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• v.7 no.4
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• pp.141-163
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• 2005

The international SPICE (Software Process Improvement and Capability determination) Project ISO/IEC 15504(SPICE : Software Process Improvement and Capability determination) is an emerging International Standard on SPA(Software Process Assessment). A prime motivation for developing this standard has been the perceived need for an internationally recognized software process assessment framework that pulls together the existing public and proprietary models and methods. A SPICE assessment can be considered as one of representative SPA model since assessors assign ratings to indicators and metrics to measure the capability of software process. But this models doesn't provide a systematic measurement procedures and dynamic method for SPI(Software Process Improvement). Through the evaluation of SPICE is capable of providing a substantiated basis for using the notion of capability, as well as providing information for nacessary improvements to the standard using 6sigma process. As a result, this paper propose a measurement procedure and guidelines for application of 6sigma process to guarantee the reliability in SPI and suggest the structure to support SPI on overall organization.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.43 no.2
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• pp.206-215
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• 1994

A method for simulating general characteristics and temperature characteristics of discharging SCR of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristic of magnetizing circuit can be obtained, the efficient design of the magntizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, computation of the temperature rise of discharging SCR is very important since it gives some indication of thermal characteristic of discharging circuit. It is implemented on a 486 personal computer, and the modeling results are checked against experimental measures. The experimental results have been achived using 305[V] and 607[V] charging voltage, low-energy capacitor discharge impulse magnetizer-magnetizing fixture of air cleaner DC motor.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1203-1204
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• 2007

In the methods for securing software quality and safety, two approaches - product centered approach and process centered approach - can be suggested. SPICE is a standard for the process improvement and the capability determination, which is planned for securing software quality and safety by the process centered approach. In this paper, general SPICE model, which is presented in ISO/IEC 15504 and Automotive SPICE model for automobile industry are analyzed. For securing railway software quality and safety, appropriate scheme to apply Automotive SPICE to railway software is proposed.

• Proceedings of the Korea Information Processing Society Conference
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• 2012.11a
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• pp.227-229
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• 2012

모바일 클라우드 서비스에 대한 요구에 따라 다양한 관련 기술들이 소개되고 있다. 이 중에서 모바일 원격접속 프로토콜은 RFB와 RDP, 두 개의 표준 프로토콜로 나뉜다. RFB 프로토콜은 구조의 단순함이, RDP 프로토콜은 빠른 응답속도가 상대적인 장점이다. 이 중, RDP 프로토콜은 윈도우즈 환경에 종속적인 제약이 있는데, SPICE 프로토콜은 이러한 RDP 프로토콜과는 달리 가상화 환경에 최적화된 오픈소스 프로토콜이다. 이러한 SPICE 프로토콜의 특징은 모바일 클라우드 환경에 상당한 이점을 가질 수 있다. 본 논문은 PC환경에서 RFB와 RDP, SPICE 프로토콜을 비교해 보고 모바일 환경에서의 활용성을 가늠해 본다. 그리고 모바일 환경에 가장 적합한 SPICE 프로토콜이 안드로이드에서 동작가능한지를 살펴보고 발생 가능한 문제점과 해결방안을 살펴보고자 한다.

• Proceedings of the Korea Information Processing Society Conference
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• 2012.11a
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• pp.223-226
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• 2012

스마트폰과 같은 모바일 단말은 모바일 클라우드의 서비스를 받기 위해 모바일 가상머신에 원격접속 할 수 있는 기술이 필요하다. 원격접속 표준 프로토콜은 프레임 버퍼 방식의 Remote Frame Buffer(RFB) 프로토콜과 메시지 전송방식의 Remote Desktop Protocol(RDP)로 나뉜다. SPICE 프로토콜은 RDP 프로토콜 기반의 오픈소스 원격접속 프로토콜이다. SPICE 프로토콜은 가상머신에 원격접속 할 수 있지만 모바일 환경을 지원하지 않는다. 따라서 SPICE 프로토콜을 모바일 환경에서 사용하려면 포팅 작업이 필요하다. 본 논문은 리눅스용 SPICE 클라이언트 모듈을 안드로이드 환경에 맞도록 포팅하는 방법을 소개하고자 한다. 또한 포팅시 발생하는 문제점과 이를 해결하는 방법 몇 가지를 함께 소개한다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.7-12
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• 2010

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.