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SPICE Modeling for Thermoelectric Modules  

Park, Soon-Seo (Department of Electrical Engineering, Chungbuk National University)
Cho, Sung-Kyu (Department of Electrical Engineering, Chungbuk National University)
Baatar, Nyambayar (Department of Electrical Engineering, Chungbuk National University)
Kim, Shi-Ho (Department of Electrical Engineering, Chungbuk National University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.47, no.4, 2010 , pp. 7-12 More about this Journal
Abstract
We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.
Keywords
thermoelectric module; thermoelectric cooler; spice model;
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  • Reference
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