Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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SPICE Modeling for Thermoelectric Modules

열전 모듈의 SPICE 모델링

  • Park, Soon-Seo (Department of Electrical Engineering, Chungbuk National University) ;
  • Cho, Sung-Kyu (Department of Electrical Engineering, Chungbuk National University) ;
  • Baatar, Nyambayar (Department of Electrical Engineering, Chungbuk National University) ;
  • Kim, Shi-Ho (Department of Electrical Engineering, Chungbuk National University)
  • 박순서 (충북대학교 전기공학과) ;
  • 조성규 (충북대학교 전기공학과) ;
  • ;
  • 김시호 (충북대학교 전기전자공학부)
  • Received : 2009.12.03
  • Accepted : 2010.03.09
  • Published : 2010.04.25
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Abstract

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.

열전소자의 SPICE 모델을 유도하였고, Harman method를 이용하여 전기적인 측정과 열전 소자 양단면의 온도 측정값 만으로 모델 파라미터를 추출하기 위한 방법을 제시하였다. 본 논문에서 제시된 SPICE 모델 파라미터 추출방식은 열전도 측정 데이터를 사용하지 않고, 모델 파라미터를 추출할 수 있으며, 기존의 열전도 측정에 의한 값과 비교하였을 때 오차가 크지 않아서 실제로 열전 모듈을 제작하였을 때 유용하게 사용할 수 있는 방법이 될 수 있음을 보였다. 제시된 SPICE 모델은 열전모듈을 이용한 냉각 장치와 열전 발전 장치의 열적 시뮬레이션과 전기적인 시뮬레이션에 모두 적용이 가능하다.

Keywords

References

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