• Title/Summary/Keyword: 3D profile measurement

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Development of the Railway Abrasion Measurement System using Camera Model and Perspective Transformation (카메라 모델과 투시 변환에 의한 레일 마모도 측정 시스템 개발)

  • Ahn, Sung-Hyuk;Kang, Dong-Eun;Moon, Hyoung-Deuk;Park, So-Yeon;Kim, Man-Cheol
    • Proceedings of the KSR Conference
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    • 2008.11b
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    • pp.1069-1077
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    • 2008
  • The railway abrasion measurement system have to satisfy two conditions to increase the measurement accuracy as follows. The laser region which is projected on the rail have to be extracted without the geometrical distortion. The mapping of the acquired laser region data on the rail profile have to be processed exactly. But, the conventional railway abrasion measurement system is deeply effected by the foreign substance( dust, rainwater, and so on ) on the railway or the sensitive response characteristic of the laser to the external measurement circumstance, and then the measurement errors arise from above factors. When the laser region is projected on the rail extracts from the acquired image, the interference of the light with the same frequency as the laser system occurs the serious problems. In the process of the mapping between the railway profile and the extracted laser region, the measurement accuracy is very highly effected by the geometrical distortion and the abnormal variation. In this Paper, we propose the novel method to increase the accuracy of the railway abrasion measurement dramatically. we designed and manufactured the high precision and fast image processing board with DSP Core and FPGA to measure the railway abrasion. The image processing board has the capability that the image of 1024X1280 from camera can be processed with the speed of 480 frame/sec. And, we apply the image processing algorithm base on the wavelet to extract the laser region is projected on the rail exactly. Finally, we developed high precision railway abrasion measurement system with the error range less than +/-0.5mm by which 2D image data is covered 3D data and mapped on the rail profile using the camera model and the perspective transform.

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2D/3D Visual Optical Inspection System for Quad Chip (Quad Chip 외관 불량 검사를 위한 2D/3D 광학 시스템)

  • Han, Chang Ho;Lee, Sangjoon;Park, Chul-Geon;Lee, Ji Yeon;Ryu, Young-Kee;Ko, Kuk Won
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.1
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    • pp.684-692
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    • 2016
  • In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.

A study on the grid fringe generator for measurement of 3-D object (영사식 3차원 형상 측정을 위한 격자무늬 생성장치에 관한 연구)

  • 박윤창
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.170-175
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    • 1999
  • Noncontact measuring methodology of 3-dimensional profile using CCD camera are very attractive because of it's high measuring speed and its's high sensitivity. Especially, when projecting a grid pattern over the object the captured image have 3 dimensional information of the object. Projection moire extract 3-D information with another grid pattern in front of CCD camera. However phase measuring profilometry(PMP) obtain similar results without additional grid pattern. In this paper, new method for grid pattern generation system by polygonal mirror and Laser Diode. This system is applied the projection moire and the PMP.

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Point-diffraction interferometer for 3-D profile measurement of light scattering rough surfaces (광산란 거친표면의 고정밀 삼차원 형상 측정을 위한 점회절 간섭계)

  • 김병창;이호재;김승우
    • Korean Journal of Optics and Photonics
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    • v.14 no.5
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    • pp.504-508
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    • 2003
  • We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2${\times}$l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 ${\mu}{\textrm}{m}$ with a standard deviation of 1.5 ${\mu}{\textrm}{m}$.

A THREE-DINENSIONAL MEASURING TECHNIQUE APPLIED TO FORGING PRESS MACHINE

  • Xiao, Sun;Shimomoto, Yoichi;Ishimatsu, Takakazu
    • 제어로봇시스템학회:학술대회논문집
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    • 1995.10a
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    • pp.138-141
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    • 1995
  • This paper describes a 3-dimensional measuring method for cylindrical huge ingot pressed with forging machine. Target ingot we consider here is rotated around a fixed axis during measurement. Using an image processing technique every profile of cross-section is obtained, and 3D image is reconstructed. One method to calibrate the system setting is also presented. Experimental results reveal that the method are applicable and the algorithm is feasible.

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Finite Element Simulation and Experimental Study on the Electrochemical Etching Process for Fabrication of Micro Metal Mold (미세금형 가공을 위한 전기화학식각 공정의 유한요소 해석 및 실험결과 비교)

  • Ryu, Heon-Yul;Im, Hyeon-Seung;Cho, Si-Hyeong;Hwang, Byeong-Jun;Lee, Sung-Ho;Park, Jin-Goo
    • Korean Journal of Materials Research
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    • v.22 no.9
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    • pp.482-488
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    • 2012
  • To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

Moving Temperature Profile Method for Efficient Three-Dimensional Finite Element Welding Residual Stress Analysis for Large Structures (대형구조물의 효율적 3차원 용접잔류응력해석을 위한 새로운 이동 온도 프로파일 방법)

  • Cheol Ho Kim;Jae Min Gim;Yun Jae Kim
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.19 no.2
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    • pp.75-83
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    • 2023
  • For three-dimensional finite element welding residual stress simulation, several methods are available. Two widely used methods are the moving heat source model using heat flux and the temperature boundary condition model using the temperature profile of the welded beads. However, each model has pros and cons in terms of calculation times and difficulties in determining welding parameters. In this paper, a new method using the moving temperature profile model is proposed to perform efficiently 3-D FE welding residual stress analysis for large structures. Comparison with existing experimental residual stress measurement data of two-pass welding pipe and SNL(Sandia National Laboratories) mock-up canister shows the accuracy and efficiency of the proposed method.

A Fundamental Study on Vibration Characteristics of Container Car for Sensitive Cargo Transportation according to ASTM D-4169 (ASTM 규격에 따른 민감화물 수송용 컨테이너 화차의 진동 특성에 관한 기초 연구)

  • Ki, Ho-Cheol;Lee, Seung-Yil;Kim, Chul-Su
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.12
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    • pp.53-59
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    • 2019
  • To reduce the vibrations and shocks during the cargo transportation of high value-added goods, the vibration history was measured on the truck transportation section (Asan-Uiwang) and the freight train transportation section (Uiwang-Pusan). The internal vibrations of the container were obtained by attaching acceleration sensors in three axis directions (longitudinal, lateral. and vertical directions) on the front and rear bogies. The rail vibration profile (0.29Grms) proposed in ASTM D-4169 was approximately 50% higher than the truck vibration profile (0.54Grms). The overall vibration was 16% and 33 % lower in the longitudinal and transverse directions, respectively, compared to the ASTM truck transport vibration profile. On the other hand, the vertical vibration measurement history partially exceeded the ASTM truck transport vibration profile over the range, 4 - 15Hz, and over 60Hz. The vibration measurement history of the cargo train was similar to that of the road. The longitudinal and lateral vibration history was lower than the ASTM D-4169 rail vibration profile, while the vertical history was over 30Hz.

The necessary number of profile lines for the analysis of concrete fracture surfaces

  • Konkol, Janusz;Prokopski, Grzegorz
    • Structural Engineering and Mechanics
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    • v.25 no.5
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    • pp.565-576
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    • 2007
  • The article describes a technique for the measurement of the level of complexity of fracture surfaces by the method of vertical sections, and a performed statistical analysis of the effect of profile lines on the fractographic and fractal parameters of fractures, i.e. the profile line development factor, $R_L$, and the fracture surface development factor, $R_S$, (as defined by the cycloid method), as well as the fractal dimension, $D_C$, (as determined by the chord method), and the fractal dimension, $D_{BC}$, (as determined by the box method). The above-mentioned parameters were determined for fracture surfaces of basalt and gravel concretes, respectively, which had previously been subjected to fracture toughness tests. The concretes were made from mixtures of a water/cement ratio ranging from 0.41 to 0.61 and with a variable fraction of coarse aggregate to fine aggregate, $C_{agg.}/F_{agg.}$, in the range from 1.5 to 3.5. Basalt and gravel aggregate of a fraction to maximum 16 mm were used to the tests. Based on the performed analysis it has been established that the necessary number of concrete fracture profile lines, which assures the reliability of obtained testing results, should amount to 12.

Performance Evaluation of Stealth Chamber as a Novel Reference Chamber for Measuring Percentage Depth Dose and Profile of VitalBeam Linear Accelerator (VitalBeam 선형가속기의 심부선량백분율과 측방선량분포 측정을 위한 새로운 기준 전리함으로서 스텔스 전리함의 성능 평가)

  • Kim, Yon-Lae;Chung, Jin-Beom;Kang, Seong-Hee;Kang, Sang-Won;Kim, Kyeong-Hyeon;Jung, Jae-Yong;Shin, Young-Joo;Suh, Tae-Suk;Lee, Jeong-Woo
    • Journal of radiological science and technology
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    • v.41 no.3
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    • pp.201-207
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    • 2018
  • The purpose of this study is to evaluate the performance of a "stealth chamber" as a novel reference chamber for measuring percentage depth dose (PDD) and profile of 6, 8 and 10 MV photon energies. The PDD curves and dose profiles with fields ranging from $3{\times}3$ to $25{\times}25cm^2$ were acquired from measurements by using the stealth chamber and CC 13 chamber as reference chamber. All measurements were performed with Varian VitalBeam linear accelerator. In order to assess the performance of stealth chamber, PDD curves and profiles measured with stealth chamber were compared with measurement data using CC13 chamber. For PPDs measured with both chambers, the dosimetric parameters such as $d_{max}$ (depth of maximum dose), $D_{50}$ (PDD at 50 mm depth), and $D_{100}$ (PDD at 100 mm depth) were analyzed. Moreover, root mean square error (RMSE) values for profiles at $d_{max}$ and 100 mm depth were evaluated. The measured PDDs and profiles between the stealth chamber and CC13 chamber as reference detector had almost comparable. For PDDs, the evaluated dosimetric parameters were observed small difference (<1%) for all energies and field sizes, except for $d_{max}$ less than 2 mm. In addition, the difference of RMSEs for profiles at $d_{max}$ and 100 mm depth was similar for both chambers. This study confirmed that the use of stealth chamber for measuring commission beam data is a feasible as reference chamber for fields ranging from $3{\times}3$ to $20{\times}20cm^2$. Furthermore, it has an advantage with respect to measurement of the small fields (less than $3{\times}3cm^2$ field) although not performed in this study.