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http://dx.doi.org/10.5762/KAIS.2016.17.1.684

2D/3D Visual Optical Inspection System for Quad Chip  

Han, Chang Ho (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Lee, Sangjoon (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Park, Chul-Geon (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Lee, Ji Yeon (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Ryu, Young-Kee (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Ko, Kuk Won (School of Mechanical and ICT Convergence Engineering, Sunmoom University)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.17, no.1, 2016 , pp. 684-692 More about this Journal
Abstract
In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.
Keywords
LQFP/TQFP(Low-profile Quad Flat Package/Thin Quad Flat Package); Automatic Optical Inspection; Moire; 3D Inspection; Machine Vision;
Citations & Related Records
Times Cited By KSCI : 8  (Citation Analysis)
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