• 한국전기전자재료학회논문지
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• 제25권1호
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• pp.6-14
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• 2012

For integrated complementary metal oxide semiconductor (CMOS) circuits, the lateral spread for two-dimensional (2-D) impurity distributions are very important for the analyzing the devices. The measured two-dimensional SEM data obtained using the chemical etching-method matched very well with the results of the Gauss model for boron implanted samples. But the profiles in boron implanted silicon were deviated from the Gauss model. The profiles in boron implanted silicon were shown a little bit steep profile in the deep region due to backscattering effect on the near surface from the bombardments of light boron ions. From the simulated 3-D data obtained using an analytical model, the 1-D and 2-D data were compared with the experimental data and could be verified the justification from the experimental data. The data of 3-D model were also shown good agreements with the experimental and the simulated data. It can be used in the 3-D chip design and the analysis of microelectro-mecanical system (MEMS) and special devices.

• Transactions on Electrical and Electronic Materials
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• 제17권2호
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• pp.118-120
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• 2016

A coplanar waveguide employing periodic 3D coupling structures (CWP3DCS) was developed for application in miniaturized on-chip passive components on silicon radio frequency integrated circuits (RFIC). The CWP3DCS showed the shortest wavelength of all silicon-based transmission line structures that have been reported to date. Using CWP3DCS, a highly miniaturized impedance transformer was fabricated on silicon substrate, and the resulting device showed good RF performance in a broad band from 4.6 GHz to 28.6 GHz. The device as was 0.04 mm² in size, which is only 0.74% of the size of the conventional transformer on silicon substrate.

• 한국전자파학회논문지
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• 제12권1호
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• pp.71-76
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• 2001

Ka 대역 위성통신 및 BWLL 시스템용 3단 저잡음 증폭기가 MMIC 기술로 설계 및 제작되었다. MMIC 저잡음 증폭기는 잡음지수와 높은 이득 그리고 진폭 선형성을 만족하기 위하여 2단의 single-ended 형태의 증폭단과 1단의 balanced 형태의 증폭단으로 구성되었다. 낮은 잡음지수와 높은 이득을 얻기 위하여 0.15$\mu\textrm{m}$ pHEMT 소자가 사용되었다. CD에서 80 GHz 대역까지의 안정도 확보를 위하여 직렬 및 병렬 궤환 회로와 λ/4 short 라인이 삽입되었다. 설계된 MMIC 저잡음 증폭기의 크기는 3.1mm $\times$2.4mm(7.44mm$^2$)이다. 제작된 MMIC 저잡음 증폭기의 wafer 상에서의 측정 결과, 22~ 30 GHz 주파수 대역에서 잡음지수는 2.0 dB이하이고 이득은 26dB이상으로 설계 결과와 일치하였다.

• 한국전자파학회논문지
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• 제16권2호
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• pp.167-173
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• 2005

직렬 PIN 다이오드 스위치의 격리도는 PIN 다이오드의 병렬 커패시턴스에 의해 제한을 받으며, 스위치 구동회로는 PIN 다이오드 스위치의 스위칭 속도를 제한한다. 이런 문제를 극복하기 위해, 병렬 공진 인턱턴스와 TTL 호환의 스위치 구동회로가 적용된 높은 격리도와 고속 스위칭의 PIN 다이오드 스위치를 제안하였다. 3 GHz PIN 다이오드 스위치의 측정 결과, 1 GHz의 주파수 대역폭, 1.5 dB 이내의 삽입 손실, 65 dB의 격리도, 15 dB 이상의 반사 손실 그리고 30 ns 이내의 스위칭 속도를 나타내었다. 특히, 병렬 공진 인덕턴스를 사용한 3 GHz스위치는 15 dB의 격리도 향상을 나타내었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.256-261
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• 2011

We demonstrate 3-Gb/s wireless link using a 60-GHz receiver front-end fabricated in $0.25-{\mu}m$ SiGe:C bipolar complementary metal oxide semiconductor (BiCMOS) and a mixed-mode quadrature phase-shift keying (QPSK) demodulator fabricated in 60-nm CMOS. The 60-GHz receiver consists of a low-noise amplifier and a down-conversion mixer. It has the peak conversion gain of 16 dB at 62 GHz and the 3-dB intermediate-frequency bandwidth of 6 GHz. The demodulator using 1-bit sampling scheme can demodulate up to 4.8-Gb/s QPSK signals. We achieve successful transmission of 3-Gb/s data in 60 GHz through 2-m wireless link.

• Journal of Electrical Engineering and information Science
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• 제3권2호
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• pp.239-244
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• 1998

Piezoelectric pressure sensors and pyroelectric infrared detectors based on ZnO thin film have been integrated with GaAs metal-semiconductor field effect transistor (MESFET) amplifiers. Surface micromachining techniques have been applied in a GaAs MESFET process to form both microsensors and electronic circuits. The on-chip integration of microsensors such as pressure sensors and infrared detectors with GaAs integrated circuits is attractive because of the higher operating temperature up to 200 oC for GaAs devices compared to 125 oC for silicon devices and radiation hardness for infrared imaging applications. The microsensors incorporate a 1${\mu}$m-thick sputtered ZnO capacitor supported by a 2${\mu}$m-thick aluminum membrane formed on a semi-insulating GaAs substrate. The piezoelectric pressure sensor of an area 80${\times}$80 ${\mu}$m2 designed for use as a miniature microphone exhibits 2.99${\mu}$V/${\mu}$ bar sensitivity at 400Hz. The voltage responsivity and the detectivity of a single infrared detector of an area 80${\times}$80 $\mu\textrm{m}$2 is 700 V/W and 6${\times}$108cm$.$ Hz/W at 10Hz respectively, and the time constant of the sensor with the amplifying circuit is 53 ms. Circuits using 4${\mu}$m-gate GaAs MESFETs are fabricated in planar, direct ion-implanted process. The measured transconductance of a 4${\mu}$m-gate GaAs MESFET is 25.6 mS/mm and 12.4 mS/mm at 27 oC and 200oC, respectively. A differential amplifier whose voltage gain in 33.7 dB using 4${\mu}$m gate GaAs MESFETs is fabricated for high selectivity to the physical variable being sensed.

• ETRI Journal
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• 제30권4호
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• pp.526-534
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• 2008

This paper presents a fully integrated 0.13 ${\mu}m$ CMOS MB-OFDM UWB transmitter chain (mode 1). The proposed transmitter consists of a low-pass filter, a variable gain amplifier, a voltage-to-current converter, an I/Q up-mixer, a differential-to-single-ended converter, a driver amplifier, and a transmit/receive (T/R) switch. The proposed T/R switch shows an insertion loss of less than 1.5 dB and a Tx/Rx port isolation of more than 27 dB over a 3 GHz to 5 GHz frequency range. All RF/analog circuits have been designed to achieve high linearity and wide bandwidth. The proposed transmitter is implemented using IBM 0.13 ${\mu}m$ CMOS technology. The fabricated transmitter shows a -3 dB bandwidth of 550 MHz at each sub-band center frequency with gain flatness less than 1.5 dB. It also shows a power gain of 0.5 dB, a maximum output power level of 0 dBm, and output IP3 of +9.3 dBm. It consumes a total of 54 mA from a 1.5 V supply.

• Journal of Power Electronics
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• 제19권6호
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• pp.1449-1457
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• 2019

This paper presents two voltage domain stacking topologies for powering integrated digital loads such as multiprocessors or 3D integrated circuits. Pairs of loads and capacitors are connected in series to form a stack of voltage domains. The voltage is balanced by switching the position of the capacitors in one case and the position of the loads in the other case. This method makes the voltage regulation robust to large differential load power consumption. The first configuration can be named the load stacking topology. The second configuration can be named the capacitor stacking topology. This paper aims at proposing and comparing these two topologies. Models of both topologies and a switching scheme are presented. The behavior, control scheme, losses and overall performance are analyzed and compared theoretically in simulation and experiments. Experimental results show that the capacitor stacking topology has better performance with a 30% voltage ripple reduction.

• 대한전자공학회논문지SD
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• 제43권2호
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• pp.42-50
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• 2006

반도체 공정기술의 발달로 인해 칩의 집적도가 향상되고 높은 성능의 SoC (System On a Chip)의 구현이 가능해졌다. 하지만 이로 인한 칩의 전력 소모량 증가는 칩 설계시의 중요 제한 요소가 되고 있다 칩 설계의 하위 단계로 갈수록 설계의 수정은 시간과 금전적 비용을 기하급수적으로 증가시키기 때문에, 설계의 상위 단계에서부터 칩의 소모 전력을 미리 추정하는 기술은 필수적이다. 이에 본 연구에서는 효율적인 상위 레벨 소모 전력 추정을 위해 회로를 레벨화 하고, 일부 레벨의 스위칭을 기반으로 회로의 소모 전력을 look up 테이블을 이용하여 모델링하였다 제안한 기술을 이용하여 ISCAS'85 벤치마크 회로에 대해 평균 소모 전력을 추정한 결과, 기존에 알려진 소모 전력 추정 기술에 비해 평균 추정 오차를 $9.45\%$에서 $3.84\%$로 크게 개선한 결과를 얻을 수 있었다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2000년도 International Symposium on Magnetics The 2000 Fall Conference
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• pp.5-32
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• 2000

MRAM, High performance MRAM using MTJS demostrated, fully integrated MTJ MRAM with CMOS circuits, write time ~2.3 nsec; read time ~3 nsec, Thermally stable up to ~350 C, Switching field distibution controlled by size & shape. Magnetic Tunnel Junction Properties, Magnetoresistance: ~50% at room temperature, enhanced by thermal treatment, Negative and Positive MR by interface modification, Spin Polarization: >55% at 0.25K, Insensitive ot FM composition, Resistance $\times$ Area product, ranging from ~20 to 10$^{9}$ $\Omega$(${\mu}{\textrm}{m}$)$^{2}$, Spin valve transistor, Tunnel injected spin polarization for "hot" electrons, Decrease of MTJMR at high bias originates from anode.