• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.380-385
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• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• Journal of Urban Science
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• v.6 no.2
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• pp.17-27
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• 2017

Recently, civil complaints have increased due to water pollution and bad smell in rivers. Therefore, attention is focused on improving the river environment. The purpose of this study is to acquire RGB and thermal infrared images using UAV for sewage outlet and to monitor the status of stream pollution and the applicability UAV based images for river embankment maintenance plan was examined. The accuracy of the 3D model was examination by SfM(Structure from Motion) based images analysis on river embankment maintenance area. Especially, The wastewater discharged from the factory near the river was detected as an thermal infrared images and the flow of wastewater was monitored. As a result of the study, we could monitor the cause and flows of wastewater pollution by detecting temperature change caused by wastewater inflow using UAV images. In addition, UAV based a high precision 3D model (DTM, Digital Topographic Map, Orthophoto Mosaic) was produced to obtain precise DSM(Digital Surface Model) and vegetation cover information for river embankment maintenance.

• Proceedings of the Korea Information Processing Society Conference
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• 2006.05a
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• pp.1311-1314
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• 2006

원자력 시설 및 연구용 원자로 해체 시 해체 공정의 효율성을 증진시키기 위해 컴퓨터 그래픽스를 이용한 해체 공정의 최적화 연구가 수행되었다. 애니메이션 설계를 위해 해체 시설 및 구조물과 해체 장비의 모델링이 완료되었으며, 방사능에 오염된 대상물의 방사능 분포도를 위치별, 준위별로 확인할 수 있도록 3 차원으로 나타내었다. 해체 일정과 해체 폐기물량 그리고 해체 비용을 모사하기 위해 각 정보들에 대한 평가식과 가중치 값을 도출하였다. 연구로 1 호기 Thermal column 을 대상으로 애니메이션을 통한 해체 공정절차 시각화와 단위 해체 공정 시나리오를 수행한 결과 애니메이션의 경우 해체 현장과 동일하게 모델링 되어 현장 작업자들이 해체 공정 절차를 쉽게 이해할 수 있다는 것을 확인하였으며, 시나리오 별 해체 소요시간과 폐기물량 그리고 해체 비용의 경우 정상적으로 모사가 수행됨으로써 단위 해체 공정에 대한 최적의 시나리오를 평가 할 수 있는 기초 연구의 틀을 마련하였다. 본 시스템은 해체 관리자, 해체 시스템 분석가, 해체 현장 감독과 해체 작업자들의 중요한 협업도구로 활용될 것으로 사료된다.

• Transactions of the Society of Information Storage Systems
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• v.3 no.3
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• pp.113-117
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• 2007

재생층이 상변화물질로 이루어진 초해상 광디스크에 있어서, 기록 전과 후에 thermal curing 을 실시하여 신호품질과 재생안정성이 크게 향상되었다. Pre-curing으로 수천 회 이하에서 나타나는 short-term stability가 향상되었고, post-curing 한 후 mid-term stability 가 향상되었다. 그리고, pre- and post-curing 후 noise level 은 전반적으로 $1{\sim}2dB$가 낮아졌고, CNR은 $2{\sim}3dB$, jitter 는 $2{\sim}3%$ 가 향상되었다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.18-24
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• 2012

This paper reports the test results of a 50MHz/s 10 bits DAC developed with $0.18{\mu}m$ CMOS process for the wireless sensor network application. The 10bits DAC, not likely a typical segmented type, has been designed as a current driving type with double step thermometer decoding architecture in which 10bits are divided into 6bits of MSB and 4bits of LSB. MSB 6bits are converted into 3 bits row thermal codes and 3 bits column thermal codes to control high current cells, and LSB 4 bits are also converted into thermal codes to control the lower current cells. The high and the lower current cells use the same cell size while a bias circuit has been designed to make the amount of lower unit current become 1/16 of high unit current. All thermal codes are synchronized with output latches to prevent glitches on the output signals. The test results show that the DAC consumes 4.3mA DC current with 3.3V DC supply for 2.2Vpp output at 50MHz clock. The linearity characteristics of DAC are the maximum SFDR of 62.02dB, maximum DNL of 0.37 LSB, and maximum INL of 0.67 LSB.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.3
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• pp.46-55
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• 1998

This stud demonstrates the profiles of heavy ions (As, Sb) in silicon by high energy (1~10 MeV) implantation. Implanted profiles were measured by SIMS (Cameca 4f) and compared with simulation results (TRIM) program and analytical description method using Pearson function). The experimental results have a little bit deviation with simulation data in the case of As high energy implatation. But in the case of Sb, the experimental results are in good agreement with TRIM data. SIMS profiles are perfectly fitted with a analytical description method only using one pearson function in Sb implantation. but in the case of As, fitted profilesshow with a little bit deviations by channeling effects of SIMS profiles. Thermal annealing for electrical activation of implanted ions was carried out by furnace annealing and RTA(Rapid Thermal Annealing). Concentration-depth profile after heat treatement were measured by SR(Spreading Resistance) method.

• 전자공학회논문지 IE
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• v.48 no.2
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• pp.12-18
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• 2011

In this paper, did numerical simulation to confirm LED module for lighting and protection against heat special quality of heat sink device. Analysis was gone dividing on case that emitting light side turns normalcy department considering that eat of device according to usage and case that turn down looking being street lamp of 200 W or security appointment lighting device analysis case, and also, volume of thermal element divides on big case and small case and analyzed. Confirmed that can do so that may discharge LED's thermal value to outside enough in analysis wave and current heat sink shape, and investigated that difference of protection against heat performance according to position of device and size of thermal element appears.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.595-600
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• 2005

A micro flow sensor on silicon substrate allows the fabrication of small components where many different functions can be integrated so that the functionality of the sensors can be increased. Further more, the small size of the elements these sensors can be quite fast. A thermal mass flow sensor measures the asymmetry of temperature profile around the heater which is modulated by the fluid flow. In normal, a mass flow sensor is composed of a central heater and a pair of temperature sensing elements around the heater A new 2-D wide range micro flow sensor structure with three pairs of temperature sensors and a central heater was proposed and numerically simulated by Finite Difference formulation to confirm the feasibility of the flow sensor structure in time domain.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.112-117
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• 2008

Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

• Journal of Construction Engineering and Project Management
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• v.5 no.4
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• pp.16-22
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• 2015

This paper presents an automated computer vision-based system to update BIM data by leveraging multi-modal visual data collected from existing buildings under inspection. Currently, visual inspections are conducted for building envelopes or mechanical systems, and auditors analyze energy-related contextual information to examine if their performance is maintained as expected by the design. By translating 3D surface thermal profiles into energy performance metrics such as actual R-values at point-level and by mapping such properties to the associated BIM elements using XML Document Object Model (DOM), the proposed method shortens the energy performance modeling gap between the architectural information in the as-designed BIM and the as-is building condition, which improve the reliability of building energy analysis. Several case studies were conducted to experimentally evaluate their impact on BIM-based energy analysis to calculate energy load. The experimental results on existing buildings show that (1) the point-level thermography-based thermal resistance measurement can be automatically matched with the associated BIM elements; and (2) their corresponding thermal properties are automatically updated in gbXML schema. This paper provides practitioners with insight to uncover the fundamentals of how multi-modal visual data can be used to improve the accuracy of building energy modeling for retrofit analysis. Open research challenges and lessons learned from real-world case studies are discussed in detail.