• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.91-99
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• 1998

A 5Gbps LiNbO$_3$ optical phase modulator was designed, packaged and it's properties were characterized for optical communications. The APE(annealed proton exchange) method was employed for the optical waveguide and the electrode of ACPS (asymmetric coplanar strip) type was formed by electro-plating on LiNbO$_3$ for applying microwave signal with a dimension of width 18${\mu}{\textrm}{m}$, gap 9${\mu}{\textrm}{m}$ and length 50mm. The fabricated single-moded modulator operated at a 1550nm wavelength exhibits its modulation bandwidth, insertion loss and driving voltage of 7㎓, 3.0dB and 6V, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.61-68
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• 2007

Interfacial fracture energy(${\Gamma}$) between $Al_2O_3$ thin film deposited by Atomic Layer Deposition(ALD) and sputter deposited Cu electrode for embedded PCB applications is measured from a $90^{\circ}$ peel test. While the interfacial fracture energy of $Cu/Al_2O_3$ is very poor, Cr adhesion layer increases the interfacial fracture energy to $39.8{\pm}3.2g/mm\;for\;Ar^+$ RF plasma power density of $0.123W/cm^2$, which seems to come from the enhancement of the mechanical interlocking and Cr-O chemical bonding effects.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.31-36
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• 2004

We charaterized electromagnetic shielding properties of a soft magnetic film using by a ASTM method and 2-port flanged coaxial line method in a RF range and quantitatively analyzed factors for the shielding effectiveness of the soft magnetic film in far field. The shielding effectiveness of the soft magnetic film was dominantly affected by absorption loss not reflection loss in high frequency range of 4-13.5 GHz.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1925-1926
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• 2008

본 논문에서는 UHF TV방송 전 대역 Ch.14(473MHz)$\sim$Ch.69(803MHz)까지의 모든 채널에서 동작하는 유도결합구조의 RF동조회로를 설계하였다. 기존 자기결합구조의 RF동조회로는 PCB 양면을 사용하여야 하고 수작업으로 Air Coil 간격을 조절해야만 한다. 부품의 집적화와 양산 효율성 측면에서 자기결합구조의 단점을 해결할 수 있도록 하기 위해 본 논문에서 제안한 유도결합구조는 수동부품인 칩인덕터와 칩커패시터 및 가변용량 다이오드만을 사용하여 RF동조회로를 설계하였다. 칩인덕터는 Air Coil에 비해 낮은 소자 Q값을 가진다. 상대적으로 낮은 Q값을 갖는 칩인덕터를 사용하기 때문에 이를 보완하기 위해 Peaking용 칩인덕터를 설계 디자인에 적용하였다. 가변형 대역통과필터로 동작하기 위해 자기결합구조와 동일하게 가변용량 다이오드를 이용하였다. UHF TV방송 전 대역(470$\sim$806MHz)에서 -2.88 $\sim$ -3.97dB의 삽입손실 특성 및 -8dB 이상의 반사손실 특성과 330MHz의 중심주파수 변화 범위를 갖는다. 현재 상용중인 지상파 튜너에 적용되고 있는 자기결합구조의 RF동조회로를 대치하여 적용될 수 있을 것이다.

• Journal of the Korean Society of Food Science and Nutrition
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• v.12 no.2
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• pp.93-98
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• 1983

Apple sugaring and apple nectar gel were treated with coating agent, and then the rate of weight loss, browning reaction and fungi growth on the storage conditions of those were investigated. The results obtained were summarized as follows; The composition of sucrose, D-sorbitol, corn syrup, gelatin, arabia gum, citric acid, sodium citrate and sodium ascorbate as a nontoxic coating agent was desirable to repress weight loss browning reaction and fungi growth of apple sugaring and apple nectar gel. It was the most effective method that apple sugaring was treated with the coating agent and refrigerated with double packaging. The contraction by weight loss, browning reaction and fungi growth of apple nectar gel treated with the coating agent and freezed with double packaging were repressed.

• Food Science and Preservation
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• v.23 no.3
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• pp.422-431
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• 2016

To investigate the causes of the thermal deformations of packaging materials when microwave-heating ready-to-eat sauce products packaged in stand-up pouches, patterns of temperature changes were determined using an infra-red thermal imaging camera, a thermo-sensitive tape, and a fiver-optic thermometer. The temperature distributions of spicy chicken sauce and Indian curry samples in a stand-up pouch were found to be uneven during micrewave heating. A sharp increase in the temperature was detected, especially above the filling layers and in the corners of sealing layers of the package. The temperature measurements using an infra-red thermal imaging camera are restricted to the surface, and therefore might underestimate the actual temperature. Using a thermo-sensitive tape, temperature up to $200^{\circ}C$ were measured in the spicy chicken sauce sample showing package deformation. When the temperature is measured using a fiber-optic thermometer, it is crucial to have precise sensor performance to accurately measure the temperature in a narrow hot-spot area of the package. In this experiment, the fiber-optic thermometer was attached to a GaAs crystal sensor, which obtained more sensitive and accurate temperature measurements than those by a convectional sensor.

• Proceedings of the CALSEC Conference
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• 2001.08a
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• pp.597-614
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• 2001

Level 0: The Marekting Buzzword : □Confusion between DMU and Visualization □Having a Mobile Data Viewer/Analyser is Anyway a Prerequisite Level 1: Digital Pre-Assembly (DPA): □Building Digital Prototype before Physical Build □Usually a job for Packaging or Prototype Teams □Usually no time Left to take Feed-back into account before Actual Build Level 2: Design in Context: □All Designers within Car Maker do Local DMU before DPA Level 3: Design in Extended Context □Design in Context Expanded to Suppliers(omitted)

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.78-82
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• 2023

A fabrication of smart windows with controllable visible light transmittance in three steps by using λ/2 retardation films based on a reactive mesogen (RM) material and polarizing films is demonstrated. The phase retardation films with a Δn·d value of λ/2 (λ: wavelength) convert the direction of a traveling light to the optical axis of the film symmetrically. In this work, the retardation characteristics according to the RM thickness were evaluated and henceλ/2 phase retardation film can be fabricated. The phase retardation film with Δn·d of 276.1 nm, which is close to λ/2 (=275 nm @550 nm), was fabricated. The light transmittance of a smart window with the structure of (polarizing film)/(glass)/(alignment layer)/(λ/2 retardation film) was measured in the transmission mode, half mode and blocking mode. The evaluation results show that the transmittance of the smart window can be controlled in three steps with 35.8%, 27.8%, and 18.2% at each mode, respectively. In addition, by fabricating a smart window with a size of 15×200 mm², the feasibility of use in various fields such as buildings and automobiles was verified.