• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.2187-2193
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• 2002

We present a novel method for 3D microfabrication with LIGA process that utilizes a deep X-ray mask in which a micro-actuator is integrated. The integrated micro-actuator oscillates the X-ray absorber, which is formed on the shuttle mass of the micro-actuator, during X-ray exposures to modify the absorbed dose profile in X-ray resist, typically PMMA. 3D PMMA microstructures according to the modulated dose contour are revealed after GG development. An X-ray mask with integrated comb drive actuator is fabricated using deep reactive ion etching, absorber electroplating, and bulk micromachining with silicon-on-insulator (SOI) wafer. 1mm $\times$ 1 mm, 20 $\mu$m thick silicon shuttle mass as a mask blank is supported by four 1 mm long suspension beams and is driven by the comb electrodes. A 10 $\mu$m thick, 50 $\mu$m line and spaced gold absorber pattern is electroplated on the shuttle mass before the release step. The fundamental frequency and amplitude are around 3.6 kHz and 20 $\mu$m, respectively, for a do bias of 100 V and an ac bias of 20 $V_{p-p}$ (peak-peak). Fabricated PMMA microstructure shows 15.4 $\mu$m deep, S-shaped cross section in the case of 1.6 kJ $cm^{-3}$ surface dose and GG development at 35$^{\circ}C$ for 40 minutes.

• ETRI Journal
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• v.30 no.4
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• pp.615-617
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• 2008

A novel and compact elliptic-function bandpass filter is proposed in this letter. The techniques of slot etching and the addition of open stubs are applied to enhance the self-inductance and self-capacitance of hexagonal open-loop resonators. Thus, size reduction and improved transmission performance are obtained. Compared to the performance of the conventional design, the central frequency and insertion loss are reduced by 28% and 3.1 dB, respectively. Measurements show that the proposed filter has a fraction bandwidth of 23% at the central frequency of 1.84 GHz, and its insertion loss in the passband is less than -1.5 dB. The bandpass filter occupies only 12 mm${\times}$21.2 mm (approximately $0.24{\lambda}_g{\times}0.14{\lambda}_g$).

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.174-179
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• 2006

The curing characteristics of a photocurable resin are critical factors that often decide the ultimate resolution and structural sharpness of a final product fabricated by microstereolithography$(\mu-STL)$. In this study, we investigated the curing characteristics of the FA1260T photopolymer under a visible laser light of 42nm wavelength. Modification of the curing property of the FA1260T is attempted to reduce the cure depth $(D_c)$ by adding a radical quencher to the resin. Also, an organic solvent was used to reduce the resin viscosity for an improvement of the flatness of the liquid surface during layer-by-layer curing. As a result, the minimum $D_c$ has been reduced over a factor of 3 with no abrupt increase. Samples of three dimensional microstructures fabricated using the modified FA1260T are presented.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.186-194
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• 2004

In this research, microfabrication technique using localized electrochemical deposition (LECD) with ultra short pulses is presented. Electric field is localized near the tool tip end region by applying a few hundreds of nano second pulses. Pt-Ir tip is used as a counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The effectiveness of this technique is verified by comparison with LECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration are investigated. The proper condition is selected from the results of the experiments. Micro columns less than 10 $\mu$m in diameter are fabricated using this technique. The real 3D micro structures such as micro pattern and micro spring can be fabricated by this method. It is suggested that presented method can be used as an easy and inexpensive method for fabrication of microstructure with complex shape.

• Proceedings of the Optical Society of Korea Conference
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• 2006.02a
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• pp.329-330
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• 2006

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.268-272
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• 2002

This paper presents a novel microfabrication technology of 3D microstructures with inclined/rotated UV lithography using negative photoresist, SU-8. In some cases, reflected UV as well as incident UV is used to form microstructures. Various 3D microstructures are simply fabricated such as embedded channels, bridges, V-grooves, truncated cones, and so on.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.8
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• pp.119-125
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• 2009

Fabrication of a three-dimensional (3D) metallic mold for multi-production of a microstructure was studied to settle the problem of long processing time in 3D microfabrication. To date, complicated 3D microstructures including 3D photonic crystals, 3D microlens array, 3D filter for microfludics, and something else were created successfully using the two-photon polymerization (TPP) which was considered as paving the way to fabricate a real 3D shape in nano/microscale. However, for those fabrications, much processing time and efforts were inevitably required. To solve this issue, a simple and effective way was proposed in this paper; 3D master patterns were prepared using TPP, and then counter-shaped Ni molds were fabricated by electroforming process. By using these molds, 3D microstructures can be reproduced with short-processing time and low-effort comparing to the conventional approach, TPP We report some parameters to fabricate a metallic mold precisely.

• Proceedings of the Optical Society of Korea Conference
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• 2003.07a
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• pp.64-65
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• 2003

Stereo-lithography using the two photon absorption(TPA) makes micro structures with great resolution. The technique is applied to correcting photomask, 3-D photonic crystal, 3-D optical storage, 3-D lithography and so on. In contrast to a conventional stereo-lithography with single-photon absorption which has a size problem caused by the geometrical diffraction limit, the stereo-lithography with TPA has no size limit. (omitted)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.173-174
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• 2006

Understanding chondrocyte behavior inside complex, three-dimensional environments with controlled patterning of geometrical factors would provide significant insights into the basic biology of tissue regenerations. One of the fundamental limitations in studying such behavior has been the inability to fabricate controlled 3D structures. To overcome this problem, we have developed a three-dimensional microfabrication system. This system allows fabrication of predesigned internal architectures and pore size by stacking up the photopolymerized materials. Photopolymer SL5180 was used as the material for 3D scaffolds. The results demonstrate that controllable and reproducible inner-architecture can be fabricated. Chondrocytes harvested from human nasal septum were cultured in two kinds of 3D scaffolds to observe cell adhesion behavior. Such 3D scaffolds might provide effective key factors to study cell behavior in complex environments and could eventually lead to optimum design of scaffolds in various tissue regenerations such as cartilage, bone, etc. in a near future.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.